DE69022668D1 - Elektronische Verbindungen, Verfahren zur Bildung von Endverbindern dafür und Paste zur Ausbildung derselben. - Google Patents

Elektronische Verbindungen, Verfahren zur Bildung von Endverbindern dafür und Paste zur Ausbildung derselben.

Info

Publication number
DE69022668D1
DE69022668D1 DE69022668T DE69022668T DE69022668D1 DE 69022668 D1 DE69022668 D1 DE 69022668D1 DE 69022668 T DE69022668 T DE 69022668T DE 69022668 T DE69022668 T DE 69022668T DE 69022668 D1 DE69022668 D1 DE 69022668D1
Authority
DE
Germany
Prior art keywords
forming
paste
methods
same
end connectors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69022668T
Other languages
English (en)
Other versions
DE69022668T2 (de
Inventor
Yoichiro Yokotani
Seiichi Nakatani
Koichi Kugimiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69022668D1 publication Critical patent/DE69022668D1/de
Publication of DE69022668T2 publication Critical patent/DE69022668T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/43Electric condenser making
    • Y10T29/435Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
DE69022668T 1989-06-16 1990-06-15 Elektronische Verbindungen, Verfahren zur Bildung von Endverbindern dafür und Paste zur Ausbildung derselben. Expired - Fee Related DE69022668T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15535989 1989-06-16

Publications (2)

Publication Number Publication Date
DE69022668D1 true DE69022668D1 (de) 1995-11-02
DE69022668T2 DE69022668T2 (de) 1996-05-23

Family

ID=15604185

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69022668T Expired - Fee Related DE69022668T2 (de) 1989-06-16 1990-06-15 Elektronische Verbindungen, Verfahren zur Bildung von Endverbindern dafür und Paste zur Ausbildung derselben.

Country Status (4)

Country Link
US (1) US5128827A (de)
EP (1) EP0412259B1 (de)
KR (1) KR930002982B1 (de)
DE (1) DE69022668T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3121119B2 (ja) * 1992-06-16 2000-12-25 ローム株式会社 積層セラミックコンデンサの外部電極の形成方法
US5912796A (en) * 1996-11-15 1999-06-15 Illinois Tool Works, Inc. Metallized film capacitor and manufacturing process
JP3688429B2 (ja) 1997-04-25 2005-08-31 株式会社東芝 電子部品実装用基板および電子部品実装基板
GB2326976A (en) * 1997-06-30 1999-01-06 Harris Corp Varistor nickel barrier electrode
ES2162566B1 (es) * 1999-07-09 2003-12-16 E Instr Galvanotecnico S L Pro Procedimiento para metalizar productos ceramicos.
JP3910363B2 (ja) 2000-12-28 2007-04-25 富士通株式会社 外部接続端子
JP3864114B2 (ja) * 2001-08-02 2006-12-27 株式会社日本自動車部品総合研究所 積層型誘電体の製造方法
US7751174B2 (en) * 2002-12-09 2010-07-06 Matsushita Electric Industrial Co., Ltd. Electronic part with external electrode
EP1749616A1 (de) * 2005-08-05 2007-02-07 Grillo-Werke AG Verfahren zum Lichtbogen- oder Strahllöten/-schweissen von Werkstücken gleicher oder verschiedener Metalle oder Metalllegierungen mit Zusatzwerkstoffen aus Sn-Basis-Legierungen; Draht bestehend aus einer Zinn-Basis-Legierung
KR20090042556A (ko) * 2007-10-26 2009-04-30 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US8988855B2 (en) * 2011-10-31 2015-03-24 Murata Manufacturing Co., Ltd. Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particle
KR101452065B1 (ko) * 2012-12-13 2014-10-16 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
TWI530973B (zh) 2013-08-02 2016-04-21 Murata Manufacturing Co Laminated ceramic capacitor and laminated ceramic capacitor manufacturing method
JP6476417B2 (ja) * 2013-08-07 2019-03-06 パナソニックIpマネジメント株式会社 抵抗器の製造方法
KR102426211B1 (ko) * 2017-10-02 2022-07-28 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
JP2022156320A (ja) * 2021-03-31 2022-10-14 Tdk株式会社 積層電子部品

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3920781A (en) * 1971-04-02 1975-11-18 Sprague Electric Co Method of forming a ceramic dielectric body
US4130854A (en) * 1976-09-23 1978-12-19 Erie Technological Products, Inc. Borate treated nickel pigment for metallizing ceramics
US4353153A (en) * 1978-11-16 1982-10-12 Union Carbide Corporation Method of making capacitor with CO-fired end terminations
DE3148778A1 (de) * 1981-05-21 1982-12-09 Resista Fabrik elektrischer Widerstände GmbH, 8300 Landshut Bauelemente in chip-bauweise und verfahren zu dessen herstellung
US4517155A (en) * 1982-05-18 1985-05-14 Union Carbide Corporation Copper base metal termination for multilayer ceramic capacitors
JPS59184511A (ja) * 1983-04-04 1984-10-19 株式会社村田製作所 セラミツク積層コンデンサ
JPS60250686A (ja) * 1984-05-25 1985-12-11 日本碍子株式会社 セラミツク配線基板の製造方法
JPS6147618A (ja) * 1984-08-13 1986-03-08 株式会社村田製作所 積層セラミツクコンデンサ
US4766027A (en) * 1987-01-13 1988-08-23 E. I. Du Pont De Nemours And Company Method for making a ceramic multilayer structure having internal copper conductors
US4740863A (en) * 1987-05-15 1988-04-26 Sfe Technologies Current-limiting thin film termination for capacitors
US4881308A (en) * 1988-07-01 1989-11-21 Avx Corporation Method of terminating lead filled capacitor

Also Published As

Publication number Publication date
DE69022668T2 (de) 1996-05-23
EP0412259B1 (de) 1995-09-27
US5128827A (en) 1992-07-07
EP0412259A2 (de) 1991-02-13
KR930002982B1 (ko) 1993-04-16
KR910001808A (ko) 1991-01-31
EP0412259A3 (en) 1993-02-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee