DE69019982D1 - Metallbeschichtung auf poly-(aryl-ether-keton)oberflächen. - Google Patents

Metallbeschichtung auf poly-(aryl-ether-keton)oberflächen.

Info

Publication number
DE69019982D1
DE69019982D1 DE69019982T DE69019982T DE69019982D1 DE 69019982 D1 DE69019982 D1 DE 69019982D1 DE 69019982 T DE69019982 T DE 69019982T DE 69019982 T DE69019982 T DE 69019982T DE 69019982 D1 DE69019982 D1 DE 69019982D1
Authority
DE
Germany
Prior art keywords
poly
aryl ether
ether ketone
metal
metal coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69019982T
Other languages
English (en)
Other versions
DE69019982T2 (de
Inventor
Edward Sherman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Corp
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Corp filed Critical Raychem Corp
Application granted granted Critical
Publication of DE69019982D1 publication Critical patent/DE69019982D1/de
Publication of DE69019982T2 publication Critical patent/DE69019982T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
DE69019982T 1989-11-03 1990-10-31 Metallbeschichtung auf poly-(aryl-ether-keton)oberflächen. Expired - Fee Related DE69019982T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43151589A 1989-11-03 1989-11-03
US07/452,170 US5192590A (en) 1989-11-03 1989-12-18 Coating metal on poly(aryl ether ketone) surfaces
PCT/US1990/006336 WO1991006689A1 (en) 1989-11-03 1990-10-31 Coating metal on poly(aryl ether ketone) surfaces

Publications (2)

Publication Number Publication Date
DE69019982D1 true DE69019982D1 (de) 1995-07-13
DE69019982T2 DE69019982T2 (de) 1996-04-04

Family

ID=27029075

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69019982T Expired - Fee Related DE69019982T2 (de) 1989-11-03 1990-10-31 Metallbeschichtung auf poly-(aryl-ether-keton)oberflächen.

Country Status (7)

Country Link
US (1) US5192590A (de)
EP (1) EP0500759B1 (de)
JP (1) JPH05502059A (de)
AT (1) ATE123536T1 (de)
CA (1) CA2066239A1 (de)
DE (1) DE69019982T2 (de)
WO (1) WO1991006689A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5288528A (en) * 1993-02-02 1994-02-22 E. I. Du Pont De Nemours And Company Process for producing thin polymer film by pulsed laser evaporation
EP0899821A3 (de) * 1997-08-29 2000-02-23 GRUNDIG Aktiengesellschaft Bedieneinheit
BR9915280A (pt) * 1998-11-13 2001-08-07 Enthone Omi Inc Processo para metalizar uma superfìcie plástica
US6712948B1 (en) * 1998-11-13 2004-03-30 Enthone Inc. Process for metallizing a plastic surface
US6468672B1 (en) 2000-06-29 2002-10-22 Lacks Enterprises, Inc. Decorative chrome electroplate on plastics
US6923919B2 (en) * 2000-07-18 2005-08-02 3M Innovative Properties Company Liquid crystal polymers for flexible circuits
GB0118870D0 (en) * 2001-08-02 2001-09-26 Shipley Co Llc A combined adhesion promotion and direct metallization process
DE102004026489B3 (de) * 2004-05-27 2005-09-29 Enthone Inc., West Haven Verfahren zur Metallisierung von Kunststoffoberflächen
WO2007116493A1 (ja) * 2006-03-31 2007-10-18 Ebara-Udylite Co., Ltd. プラスチック用の表面改質液およびそれを利用したプラスチック表面の金属化方法
US8974860B2 (en) * 2009-06-19 2015-03-10 Robert Hamilton Selective deposition of metal on plastic substrates
US9492584B2 (en) 2009-11-25 2016-11-15 Difusion Technologies, Inc. Post-charging of zeolite doped plastics with antimicrobial metal ions
US20110135949A1 (en) 2009-12-08 2011-06-09 E. I. Du Pont De Nemours And Company Metal-Coated Plastic Articles and Methods Therefor
CN102834122B (zh) 2009-12-11 2015-03-11 扩散技术公司 制备聚醚醚酮抗微生物植入物的方法
CA2795836C (en) 2010-05-07 2015-11-17 Difusion Technologies, Inc. Medical implant comprising a thermoplastic resin having aluminosilicate particles incorporated therein
WO2012047454A1 (en) 2010-10-06 2012-04-12 E. I. Du Pont De Nemours And Company Process for surface preparation of polyamide articles for metal-coating
GB201212407D0 (en) * 2012-07-12 2012-08-22 Intrinsiq Materials Ltd Composition for forming a seed layer
CN103898590A (zh) * 2012-12-27 2014-07-02 郑州航天电子技术有限公司 聚醚醚酮(peek)特种工程塑料表面电镀方法
WO2017188280A1 (ja) * 2016-04-28 2017-11-02 旭硝子株式会社 含フッ素共重合体組成物、その製造方法、および成形体
WO2023242157A1 (en) * 2022-06-14 2023-12-21 Atotech Deutschland GmbH & Co. KG Method for cleaning a nonconductive surface and use
CN115522185A (zh) * 2022-10-18 2022-12-27 西安亚威材料科技有限公司 一种具有表面电磁屏蔽层的聚醚醚酮制品及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1472244A (en) * 1922-05-01 1923-10-30 Gold Sealed Denture Process Co Coating
US3518067A (en) * 1965-08-20 1970-06-30 Union Carbide Corp Method of plating polyarylene polyethers,polycarbonate or polyhydroxyethers and the resulting articles
US3501332A (en) * 1967-04-28 1970-03-17 Shell Oil Co Metal plating of plastics
US3574070A (en) * 1967-05-11 1971-04-06 Shipley Co Metal plating over plastic
US3607473A (en) * 1968-03-04 1971-09-21 Macdermid Inc Compositions for and method of pretreating plastic surfaces to improve adhesion of coating materials
US3563784A (en) * 1968-09-09 1971-02-16 Macdermid Inc Pre-activation treatment in the electroless plating of synthetic resin substrates
US3518667A (en) * 1968-11-27 1970-06-30 Eaton Yale & Towne Adjustable buzzer with manual adjustment of levels of sound
US3689303A (en) * 1970-12-21 1972-09-05 Crown City Plating Co Process for electroless plating of abs resins
US4054693A (en) * 1974-11-07 1977-10-18 Kollmorgen Technologies Corporation Processes for the preparation of resinous bodies for adherent metallization comprising treatment with manganate/permanganate composition
US4709007A (en) * 1983-03-31 1987-11-24 Raychem Corporation Preparation of aromatic polymers
CA1267350A (en) * 1985-08-22 1990-04-03 Union Carbide Corporation Treatment of drilled copper clad thermoplastic laminates using concentrated sulfuric acid
JPS6263674A (ja) * 1985-09-17 1987-03-20 Toray Ind Inc 樹脂成形品の表面金属化方法

Also Published As

Publication number Publication date
US5192590A (en) 1993-03-09
DE69019982T2 (de) 1996-04-04
CA2066239A1 (en) 1991-05-04
EP0500759B1 (de) 1995-06-07
EP0500759A1 (de) 1992-09-02
JPH05502059A (ja) 1993-04-15
ATE123536T1 (de) 1995-06-15
WO1991006689A1 (en) 1991-05-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee