DE69005342D1 - Zwischenstruktur zur Wärmeableitung vom elektrischen Modul. - Google Patents

Zwischenstruktur zur Wärmeableitung vom elektrischen Modul.

Info

Publication number
DE69005342D1
DE69005342D1 DE90105765T DE69005342T DE69005342D1 DE 69005342 D1 DE69005342 D1 DE 69005342D1 DE 90105765 T DE90105765 T DE 90105765T DE 69005342 T DE69005342 T DE 69005342T DE 69005342 D1 DE69005342 D1 DE 69005342D1
Authority
DE
Germany
Prior art keywords
heat dissipation
intermediate structure
electrical module
module
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE90105765T
Other languages
English (en)
Other versions
DE69005342T2 (de
Inventor
Gerhard Wenke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of DE69005342D1 publication Critical patent/DE69005342D1/de
Application granted granted Critical
Publication of DE69005342T2 publication Critical patent/DE69005342T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE90105765T 1989-03-29 1990-03-27 Zwischenstruktur zur Wärmeableitung vom elektrischen Modul. Expired - Fee Related DE69005342T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/329,996 US4958257A (en) 1989-03-29 1989-03-29 Heat conducting interface for electronic module

Publications (2)

Publication Number Publication Date
DE69005342D1 true DE69005342D1 (de) 1994-02-03
DE69005342T2 DE69005342T2 (de) 1994-04-21

Family

ID=23287887

Family Applications (1)

Application Number Title Priority Date Filing Date
DE90105765T Expired - Fee Related DE69005342T2 (de) 1989-03-29 1990-03-27 Zwischenstruktur zur Wärmeableitung vom elektrischen Modul.

Country Status (7)

Country Link
US (1) US4958257A (de)
EP (1) EP0390053B1 (de)
JP (1) JPH06105839B2 (de)
CA (1) CA2011487C (de)
DE (1) DE69005342T2 (de)
ES (1) ES2047738T3 (de)
IL (1) IL93652A0 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5424916A (en) * 1989-07-28 1995-06-13 The Charles Stark Draper Laboratory, Inc. Combination conductive and convective heatsink
US5245508A (en) * 1990-08-21 1993-09-14 International Business Machines Corporation Close card cooling method
JPH04253579A (ja) * 1991-02-01 1992-09-09 Honda Motor Co Ltd 直流抵抗溶接装置
ES2065606T3 (es) * 1991-02-25 1995-02-16 Bell Telephone Mfg Sistema de refrigeracion.
US5404272A (en) * 1991-10-24 1995-04-04 Transcal Carrier for a card carrying electronic components and of low heat resistance
US5385487A (en) * 1993-08-30 1995-01-31 At&T Corp. Apparatus for electrically operating devices in a controlled environment
US5513070A (en) * 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe
US5825621A (en) * 1997-06-12 1998-10-20 Harris Corporation Closed loop cooling housing for printed circuit card-mounted, sealed heat exchanger
US5982619A (en) * 1997-06-12 1999-11-09 Harris Corporation Housing for diverse cooling configuration printed circuit cards
US5835349A (en) * 1997-06-12 1998-11-10 Harris Corporation Printed circuit board-mounted, sealed heat exchanger
US6115251A (en) * 1999-04-15 2000-09-05 Hewlett Packard Company Cooling apparatus for computer subsystem
US6796372B2 (en) 2001-06-12 2004-09-28 Liebert Corporation Single or dual buss thermal transfer system
US6665184B2 (en) 2001-07-13 2003-12-16 Lytron, Inc. Tapered cold plate
US6679315B2 (en) * 2002-01-14 2004-01-20 Marconi Communications, Inc. Small scale chip cooler assembly
WO2006029527A1 (en) * 2004-09-13 2006-03-23 Lighthaus Logic Inc. Structures for holding cards incorporating electronic and/or micromachined components
US20070204646A1 (en) * 2006-03-01 2007-09-06 Thomas Gagliano Cold plate incorporating a heat pipe
US7450384B2 (en) * 2006-07-06 2008-11-11 Hybricon Corporation Card cage with parallel flow paths having substantially similar lengths
WO2008104796A2 (en) * 2007-03-01 2008-09-04 Carter, Stephen Data centers
US7911796B2 (en) * 2009-06-19 2011-03-22 General Electric Company Avionics chassis
US8059409B2 (en) * 2009-06-19 2011-11-15 General Electric Company Avionics chassis
US8023267B2 (en) * 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US8222541B2 (en) * 2009-06-19 2012-07-17 General Electric Company Avionics chassis
US20110232866A1 (en) * 2010-03-29 2011-09-29 Zaffetti Mark A Integral cold plate and honeycomb facesheet assembly
US8780556B1 (en) * 2012-03-26 2014-07-15 Lochheed Martin Corporation Fluid actuated cooling card retainer
EP2885957B1 (de) * 2012-08-20 2019-12-25 ADC Technologies Inc. Vorrichtungen zum übertragen von wärme zwischen einer schiene einer regalmontierten vorrichtung und einem kanal zur kühlung eines regalgehäuses sowie entsprechende komponenten
US9315280B2 (en) * 2012-11-20 2016-04-19 Lockheed Martin Corporation Heat pipe with axial wick
US9144178B2 (en) 2013-03-01 2015-09-22 International Business Machines Corporation Selective clamping of electronics card to coolant-cooled structure
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
CA3070742A1 (en) * 2016-07-29 2018-02-01 Adc Technologies Inc. Fanless rail cooled electronics apparatus
CA3030592C (en) 2016-08-12 2021-09-07 Hypertechnologie Ciara Inc Fluid flow tunnelling in a non-metallic computer chassis
IL308091B1 (en) 2016-09-13 2026-01-01 Allergan Inc Protein-free stabilized Clostridium toxin preparations
EP3361847B1 (de) * 2017-02-14 2021-03-31 ABB Schweiz AG Wärmetauscher
US10602635B2 (en) 2018-01-19 2020-03-24 Lockheed Martin Corporation Two-phase fluid-actuated cooling device, system, and method
CN112965325B (zh) * 2019-11-27 2022-03-11 杭州海康威视数字技术股份有限公司 摄像机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2047928C3 (de) * 1970-09-29 1974-07-04 Siemens Ag, 1000 Berlin U. 8000 Muenchen Einrichtung zur indirekten Flüssigkeitskühlung von Baugruppen mit hoher Verlustleistungsdichte
US4366526A (en) * 1980-10-03 1982-12-28 Grumman Aerospace Corporation Heat-pipe cooled electronic circuit card
FR2519508A1 (fr) * 1981-12-31 1983-07-08 Thomson Csf Dispositif de refroidissement pour carte de circuit imprime et procede de fabrication d'un tel dispositif
FR2524246A1 (fr) * 1982-03-26 1983-09-30 Socapex Systeme d'interconnexion thermique
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
US4777561A (en) * 1985-03-26 1988-10-11 Hughes Aircraft Company Electronic module with self-activated heat pipe
EP0217676B1 (de) * 1985-10-04 1993-09-01 Fujitsu Limited Kühlsystem für eine elektronische Schaltungsanordnung
US4829402A (en) * 1987-06-30 1989-05-09 Lockhart Industries, Inc. Circuit board retainer and panel assembly

Also Published As

Publication number Publication date
US4958257A (en) 1990-09-18
CA2011487A1 (en) 1990-09-29
EP0390053B1 (de) 1993-12-22
ES2047738T3 (es) 1994-03-01
JPH06105839B2 (ja) 1994-12-21
CA2011487C (en) 1993-08-17
DE69005342T2 (de) 1994-04-21
JPH02281799A (ja) 1990-11-19
IL93652A0 (en) 1990-12-23
EP0390053A1 (de) 1990-10-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee