DE68929103T2 - Halbleiterpackungen auf Basis von Aluminiumlegierung - Google Patents

Halbleiterpackungen auf Basis von Aluminiumlegierung

Info

Publication number
DE68929103T2
DE68929103T2 DE68929103T DE68929103T DE68929103T2 DE 68929103 T2 DE68929103 T2 DE 68929103T2 DE 68929103 T DE68929103 T DE 68929103T DE 68929103 T DE68929103 T DE 68929103T DE 68929103 T2 DE68929103 T2 DE 68929103T2
Authority
DE
Germany
Prior art keywords
aluminum
package
component
base component
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68929103T
Other languages
German (de)
English (en)
Other versions
DE68929103D1 (de
Inventor
Deepak Mahulikar
James M. Popplewell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of DE68929103D1 publication Critical patent/DE68929103D1/de
Application granted granted Critical
Publication of DE68929103T2 publication Critical patent/DE68929103T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE68929103T 1988-10-05 1989-09-14 Halbleiterpackungen auf Basis von Aluminiumlegierung Expired - Fee Related DE68929103T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/253,639 US4939316A (en) 1988-10-05 1988-10-05 Aluminum alloy semiconductor packages

Publications (2)

Publication Number Publication Date
DE68929103D1 DE68929103D1 (de) 1999-12-30
DE68929103T2 true DE68929103T2 (de) 2000-06-29

Family

ID=22961101

Family Applications (2)

Application Number Title Priority Date Filing Date
DE68929103T Expired - Fee Related DE68929103T2 (de) 1988-10-05 1989-09-14 Halbleiterpackungen auf Basis von Aluminiumlegierung
DE68927296T Expired - Fee Related DE68927296T2 (de) 1988-10-05 1989-09-14 Halbleiterverpackungen aus aluminiumlegierung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE68927296T Expired - Fee Related DE68927296T2 (de) 1988-10-05 1989-09-14 Halbleiterverpackungen aus aluminiumlegierung

Country Status (10)

Country Link
US (1) US4939316A (enExample)
EP (2) EP0700083B1 (enExample)
JP (2) JP3016227B2 (enExample)
KR (1) KR0154111B1 (enExample)
AU (1) AU629864B2 (enExample)
CA (1) CA1296815C (enExample)
DE (2) DE68929103T2 (enExample)
MX (1) MX163728B (enExample)
PH (1) PH25542A (enExample)
WO (1) WO1990004262A1 (enExample)

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US5367125A (en) * 1989-01-20 1994-11-22 Dassault Electronique Aluminum based article having an insert with vitreous material hermetically sealed thereto
US5250363A (en) * 1989-10-13 1993-10-05 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil having a dark color
US5073521A (en) * 1989-11-15 1991-12-17 Olin Corporation Method for housing a tape-bonded electronic device and the package employed
US5098864A (en) * 1989-11-29 1992-03-24 Olin Corporation Process for manufacturing a metal pin grid array package
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference
US5066368A (en) * 1990-08-17 1991-11-19 Olin Corporation Process for producing black integrally colored anodized aluminum components
US5122858A (en) * 1990-09-10 1992-06-16 Olin Corporation Lead frame having polymer coated surface portions
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US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5261157A (en) * 1991-01-22 1993-11-16 Olin Corporation Assembly of electronic packages by vacuum lamination
US5132773A (en) * 1991-02-06 1992-07-21 Olin Corporation Carrier ring having first and second ring means with bonded surfaces
JPH05198575A (ja) * 1991-05-01 1993-08-06 Kobe Steel Ltd 耐食性ＡｌまたはＡｌ合金材
US5144709A (en) * 1991-05-03 1992-09-08 Olin Corporation Formation of shapes in a metal workpiece
US5272800A (en) * 1991-07-01 1993-12-28 Olin Corporation Method and apparatus for forming and positioning a preform on a workpiece
US5343073A (en) * 1992-01-17 1994-08-30 Olin Corporation Lead frames having a chromium and zinc alloy coating
US5300158A (en) * 1992-05-26 1994-04-05 Olin Corporation Protective coating having adhesion improving characteristics
US5239131A (en) * 1992-07-13 1993-08-24 Olin Corporation Electronic package having controlled epoxy flow
US5367196A (en) * 1992-09-17 1994-11-22 Olin Corporation Molded plastic semiconductor package including an aluminum alloy heat spreader
TW238419B (enExample) * 1992-08-21 1995-01-11 Olin Corp
US5608267A (en) * 1992-09-17 1997-03-04 Olin Corporation Molded plastic semiconductor package including heat spreader
US5317107A (en) * 1992-09-24 1994-05-31 Motorola, Inc. Shielded stripline configuration semiconductor device and method for making the same
US5324888A (en) * 1992-10-13 1994-06-28 Olin Corporation Metal electronic package with reduced seal width
US6262477B1 (en) 1993-03-19 2001-07-17 Advanced Interconnect Technologies Ball grid array electronic package
US5477008A (en) * 1993-03-19 1995-12-19 Olin Corporation Polymer plug for electronic packages
US5650592A (en) * 1993-04-05 1997-07-22 Olin Corporation Graphite composites for electronic packaging
EP0719453A4 (en) * 1993-09-13 1998-08-19 Olin Corp FLIP-CHIP IN METALLIC ELECTRONIC PACKS
US5540378A (en) * 1993-09-27 1996-07-30 Olin Corporation Method for the assembly of an electronic package
JPH09503888A (ja) * 1993-10-12 1997-04-15 オリン コーポレイション 縁部接続可能な金属パッケージ
US5360942A (en) * 1993-11-16 1994-11-01 Olin Corporation Multi-chip electronic package module utilizing an adhesive sheet
US5455386A (en) * 1994-01-14 1995-10-03 Olin Corporation Chamfered electronic package component
US5644102A (en) * 1994-03-01 1997-07-01 Lsi Logic Corporation Integrated circuit packages with distinctive coloration
US5578869A (en) * 1994-03-29 1996-11-26 Olin Corporation Components for housing an integrated circuit device
AU2231795A (en) * 1994-04-14 1995-11-10 Olin Corporation Electronic package having improved wire bonding capability
AU2371795A (en) * 1994-05-17 1995-12-05 Olin Corporation Electronic packages with improved electrical performance
US5436407A (en) * 1994-06-13 1995-07-25 Integrated Packaging Assembly Corporation Metal semiconductor package with an external plastic seal
US5455387A (en) * 1994-07-18 1995-10-03 Olin Corporation Semiconductor package with chip redistribution interposer
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
US5573845A (en) * 1994-12-09 1996-11-12 Olin Corporation Superficial coating layer having acicular structures for electrical conductors
US5545850A (en) * 1995-01-13 1996-08-13 Olin Corporation Guard ring for integrated circuit package
KR0122423Y1 (ko) * 1995-03-23 1998-10-01 김광호 전자동 세탁기
TW309654B (enExample) * 1995-03-29 1997-07-01 Olin Corp
US5534356A (en) * 1995-04-26 1996-07-09 Olin Corporation Anodized aluminum substrate having increased breakdown voltage
US5650663A (en) * 1995-07-03 1997-07-22 Olin Corporation Electronic package with improved thermal properties
EP0882384A4 (en) * 1995-07-14 1999-03-24 Olin Corp WELDED GRID ELECTRONIC BOX
EP0956589A1 (en) * 1995-11-20 1999-11-17 Olin Corporation Ground ring for metal electronic package
US5764484A (en) * 1996-11-15 1998-06-09 Olin Corporation Ground ring for a metal electronic package
JP2000500618A (ja) * 1995-11-22 2000-01-18 オリン コーポレイション 接地または電源リングを有する半導体パッケージ
US5817544A (en) * 1996-01-16 1998-10-06 Olin Corporation Enhanced wire-bondable leadframe
US5805427A (en) * 1996-02-14 1998-09-08 Olin Corporation Ball grid array electronic package standoff design
US5801074A (en) * 1996-02-20 1998-09-01 Kim; Jong Tae Method of making an air tight cavity in an assembly package
US5892278A (en) * 1996-05-24 1999-04-06 Dai Nippon Printingco., Ltd. Aluminum and aluminum alloy radiator for semiconductor device and process for producing the same
US5943558A (en) * 1996-09-23 1999-08-24 Communications Technology, Inc. Method of making an assembly package having an air tight cavity and a product made by the method
US5952083A (en) * 1997-10-21 1999-09-14 Advanced Technology Interconnect, Inc. Aluminum alloys for electronic components
KR100265563B1 (ko) * 1998-06-29 2000-09-15 김영환 볼 그리드 어레이 패키지 및 그의 제조 방법
DE10039646A1 (de) * 1999-08-18 2001-03-08 Murata Manufacturing Co Leitende Abdeckung, Elektronisches Bauelement und Verfahren zur Bildung einer isolierenden Schicht der leitenden Abdeckung
KR100723454B1 (ko) * 2004-08-21 2007-05-30 페어차일드코리아반도체 주식회사 높은 열 방출 능력을 구비한 전력용 모듈 패키지 및 그제조방법
JP2003007880A (ja) * 2001-06-20 2003-01-10 Sony Corp 中空パッケージ及びその製造方法
US20030112710A1 (en) * 2001-12-18 2003-06-19 Eidson John C. Reducing thermal drift in electronic components
JP2007019107A (ja) * 2005-07-05 2007-01-25 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
KR100656300B1 (ko) 2005-12-29 2006-12-11 (주)웨이브닉스이에스피 3차원 알루미늄 패키지 모듈, 그의 제조방법 및 3차원알루미늄 패키지 모듈에 적용되는 수동소자 제작방법
US20100304180A1 (en) * 2007-12-04 2010-12-02 E.I Du Pont De Nemours And Company Bendable circuit structure for led mounting and interconnection
DE102008004642A1 (de) * 2008-01-16 2009-07-23 Robert Bosch Gmbh Kondensationsfalle für feuchtigkeitsempfindliche Geräte
CN101578018B (zh) * 2008-05-09 2012-07-25 富准精密工业(深圳)有限公司 金属与塑料的结合件及其制造方法
WO2011013581A1 (ja) * 2009-07-30 2011-02-03 日亜化学工業株式会社 発光装置及びその製造方法
KR101064084B1 (ko) * 2010-03-25 2011-09-08 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
KR101095202B1 (ko) * 2010-06-15 2011-12-16 삼성전기주식회사 하이브리드형 방열기판 및 그 제조방법
US10636735B2 (en) * 2011-10-14 2020-04-28 Cyntec Co., Ltd. Package structure and the method to fabricate thereof
FR2984679B1 (fr) * 2011-12-15 2015-03-06 Valeo Sys Controle Moteur Sas Liaison thermiquement conductrice et electriquement isolante entre au moins un composant electronique et un radiateur en tout ou partie metallique
US8933347B2 (en) 2012-05-29 2015-01-13 Bryan P. KIPLE Components of an electronic device
JP6436343B2 (ja) * 2014-11-18 2018-12-12 富士電機株式会社 赤外線ガス分析計用センサ部および赤外線ガス分析計用検出器
CN119381347B (zh) * 2024-09-18 2025-10-14 北京遥测技术研究所 一种轻质高导热石墨烯-铝梯度封装管壳及其设计方法

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US3943623A (en) * 1974-08-23 1976-03-16 Nitto Electric Industrial Co., Ltd. Hollow cavity package electronic unit
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US4461924A (en) * 1982-01-21 1984-07-24 Olin Corporation Semiconductor casing
US4594770A (en) * 1982-07-15 1986-06-17 Olin Corporation Method of making semiconductor casing
US4480262A (en) * 1982-07-15 1984-10-30 Olin Corporation Semiconductor casing
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
CA1201211A (en) * 1982-08-05 1986-02-25 Olin Corporation Hermetically sealed semiconductor casing
US4582556A (en) * 1982-11-22 1986-04-15 Olin Corporation Adhesion primers for encapsulating epoxies
US4521469A (en) * 1982-11-22 1985-06-04 Olin Corporation Casing for electronic components
US4525422A (en) * 1982-11-22 1985-06-25 Olin Corporation Adhesion primers for encapsulating epoxies
US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
US4498121A (en) * 1983-01-13 1985-02-05 Olin Corporation Copper alloys for suppressing growth of Cu-Al intermetallic compounds
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JPH0612796B2 (ja) * 1984-06-04 1994-02-16 株式会社日立製作所 半導体装置
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
JPS61281541A (ja) * 1985-06-06 1986-12-11 Sumitomo Electric Ind Ltd 半導体装置用パツケ−ジ
WO1988005254A1 (en) * 1987-01-12 1988-07-14 Olin Corporation Process for producing formable and high strength leadframes in semiconductor packages
US4769345A (en) * 1987-03-12 1988-09-06 Olin Corporation Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor
JPH0724290B2 (ja) * 1987-03-23 1995-03-15 住友金属工業株式会社 集積回路容器の製造方法

Also Published As

Publication number Publication date
DE68929103D1 (de) 1999-12-30
JPH04505075A (ja) 1992-09-03
US4939316A (en) 1990-07-03
CA1296815C (en) 1992-03-03
HK1008114A1 (en) 1999-04-30
JP3168196B2 (ja) 2001-05-21
JP3016227B2 (ja) 2000-03-06
AU4337389A (en) 1990-05-01
DE68927296D1 (de) 1996-11-07
EP0700083A3 (enExample) 1996-04-10
JP2000068395A (ja) 2000-03-03
EP0438444A4 (en) 1992-07-22
KR900702565A (ko) 1990-12-07
PH25542A (en) 1991-07-24
DE68927296T2 (de) 1997-04-30
EP0700083A2 (en) 1996-03-06
KR0154111B1 (ko) 1998-10-15
MX163728B (es) 1992-06-17
WO1990004262A1 (en) 1990-04-19
EP0700083B1 (en) 1999-11-24
EP0438444A1 (en) 1991-07-31
HK1014611A1 (en) 1999-09-30
AU629864B2 (en) 1992-10-15
EP0438444B1 (en) 1996-10-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee