DE68927959T2 - Verfahren zur herstellung einer metallisierten folie für chipschichtkondensatoren - Google Patents
Verfahren zur herstellung einer metallisierten folie für chipschichtkondensatorenInfo
- Publication number
- DE68927959T2 DE68927959T2 DE68927959T DE68927959T DE68927959T2 DE 68927959 T2 DE68927959 T2 DE 68927959T2 DE 68927959 T DE68927959 T DE 68927959T DE 68927959 T DE68927959 T DE 68927959T DE 68927959 T2 DE68927959 T2 DE 68927959T2
- Authority
- DE
- Germany
- Prior art keywords
- producing
- layer capacitors
- chip layer
- metalized film
- metalized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011104 metalized film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/015—Special provisions for self-healing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/06—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00 with provision for removing metal surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30779988 | 1988-12-07 | ||
PCT/JP1989/001229 WO1990006586A1 (en) | 1988-12-07 | 1989-12-07 | Metallized film for laminated chip capacitors and method of producing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68927959D1 DE68927959D1 (de) | 1997-05-15 |
DE68927959T2 true DE68927959T2 (de) | 1997-11-27 |
Family
ID=17973369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68927959T Expired - Fee Related DE68927959T2 (de) | 1988-12-07 | 1989-12-07 | Verfahren zur herstellung einer metallisierten folie für chipschichtkondensatoren |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0447550B1 (de) |
JP (1) | JPH02263419A (de) |
KR (2) | KR910700536A (de) |
DE (1) | DE68927959T2 (de) |
WO (1) | WO1990006586A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19734477B4 (de) * | 1996-08-09 | 2005-11-03 | Matsushita Electric Industrial Co., Ltd., Kadoma | Metallisierter Filmkondensator und Vorrichtung und Verfahren für die Herstellung eines metallisierten Films für den metallisierten Filmkondensator |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4100643C1 (de) * | 1991-01-11 | 1991-10-31 | Leybold Ag, 6450 Hanau, De | |
US6829135B2 (en) * | 2000-04-14 | 2004-12-07 | Matsushita Electric Industrial Co., Ltd. | Layered product, capacitor, electronic component and method and apparatus manufacturing the same |
JP4007335B2 (ja) * | 2003-04-17 | 2007-11-14 | 株式会社村田製作所 | グラビアロール、グラビア印刷機および積層セラミック電子部品の製造方法 |
US20040209197A1 (en) * | 2003-04-17 | 2004-10-21 | Murata Manufacturing Co., Ltd. | Photogravure press and method for manufacturing multilayer-ceramic electronic component |
EP1693481A1 (de) | 2005-11-23 | 2006-08-23 | Galileo Vacuum Systems S.R.L. | Kammer zur Metallisierung unter Vakuum mit Vorrichtungen zur partiellen Beschichtung |
US8169014B2 (en) | 2006-01-09 | 2012-05-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interdigitated capacitive structure for an integrated circuit |
CN101501239B (zh) * | 2006-10-06 | 2012-03-07 | 株式会社爱发科 | 卷绕式真空成膜装置 |
JP2008124245A (ja) * | 2006-11-13 | 2008-05-29 | Matsushita Electric Ind Co Ltd | 金属化フィルムの製造装置と金属化フィルムの製造方法 |
EP1990442A1 (de) | 2007-03-27 | 2008-11-12 | Galileo Vacuum Systems S.p.A. | Vorrichtung zur Vakuumbeschichtung eines durchgehenden Material, mit einem Flüssigkeitsapplikator |
EP1978126B1 (de) * | 2007-04-03 | 2010-05-19 | Applied Materials, Inc. | Vorrichtung zum kontinuierlichen Beschichten eines bandförmigen Substrates |
JP5450348B2 (ja) * | 2010-10-27 | 2014-03-26 | 小島プレス工業株式会社 | 金属化フィルムの製造装置 |
KR101422938B1 (ko) * | 2012-12-04 | 2014-07-23 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 이의 제조방법, 기판 내장용 적층 세라믹 전자부품을 구비하는 인쇄회로기판 |
JP6269187B2 (ja) * | 2014-03-07 | 2018-01-31 | 株式会社村田製作所 | 積層型フィルムコンデンサ、コンデンサモジュール、および電力変換システム |
JP7115481B2 (ja) * | 2017-08-15 | 2022-08-09 | 王子ホールディングス株式会社 | 金属化フィルム、金属化フィルムロール、版ロール |
JP6383933B1 (ja) * | 2018-02-02 | 2018-09-05 | 王子ホールディングス株式会社 | 金属化フィルム、版ロール |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL69653C (de) * | 1945-08-14 | 1952-02-16 | ||
LU42919A1 (de) * | 1962-12-21 | 1963-02-21 | ||
GB1106364A (en) * | 1964-03-04 | 1968-03-13 | Bostik Ltd | Improvements in or relating to metallized surfaces |
JPS5158649A (en) * | 1974-11-15 | 1976-05-22 | Matsushita Electric Ind Co Ltd | Ratsukaamaajinno keiseihoho |
JPS57177518A (en) * | 1981-04-24 | 1982-11-01 | Tdk Electronics Co Ltd | Laminated condenser and method of producing same |
IT1185177B (it) * | 1985-07-03 | 1987-11-04 | Metalvuoto Films Spa | Dispositivo per realizzare film plastici metallizzati presentanti zone ben delimitate prive di metallizzazione |
JPS6240714A (ja) * | 1985-08-16 | 1987-02-21 | 株式会社村田製作所 | 積層コンデンサの製造方法 |
JPS63114956A (ja) * | 1986-03-06 | 1988-05-19 | Shizuki Denki Seisakusho:Kk | 金属化プラスチツクフイルムの製造方法 |
DE3725454A1 (de) * | 1987-07-31 | 1989-02-09 | Siemens Ag | Elektrisches vielschichtbauelement mit einem gesinterten, monolithischen keramikkoerper und verfahren zur herstellung des elektrischen vielschichtbauelementes |
-
1989
- 1989-12-07 DE DE68927959T patent/DE68927959T2/de not_active Expired - Fee Related
- 1989-12-07 WO PCT/JP1989/001229 patent/WO1990006586A1/ja active IP Right Grant
- 1989-12-07 KR KR1019900701719A patent/KR910700536A/ko not_active IP Right Cessation
- 1989-12-07 EP EP90900328A patent/EP0447550B1/de not_active Expired - Lifetime
- 1989-12-07 KR KR1019900701719A patent/KR930010422B1/ko active
- 1989-12-07 JP JP1316472A patent/JPH02263419A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19734477B4 (de) * | 1996-08-09 | 2005-11-03 | Matsushita Electric Industrial Co., Ltd., Kadoma | Metallisierter Filmkondensator und Vorrichtung und Verfahren für die Herstellung eines metallisierten Films für den metallisierten Filmkondensator |
Also Published As
Publication number | Publication date |
---|---|
KR910700536A (ko) | 1991-03-15 |
DE68927959D1 (de) | 1997-05-15 |
EP0447550A1 (de) | 1991-09-25 |
WO1990006586A1 (en) | 1990-06-14 |
KR930010422B1 (ko) | 1993-10-23 |
JPH02263419A (ja) | 1990-10-26 |
EP0447550A4 (en) | 1992-12-02 |
EP0447550B1 (de) | 1997-04-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: OJI PAPER CO., LTD., TOKIO/TOKYO, JP |
|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |