DE68927959D1 - Verfahren zur herstellung einer metallisierten folie für chipschichtkondensatoren - Google Patents

Verfahren zur herstellung einer metallisierten folie für chipschichtkondensatoren

Info

Publication number
DE68927959D1
DE68927959D1 DE68927959T DE68927959T DE68927959D1 DE 68927959 D1 DE68927959 D1 DE 68927959D1 DE 68927959 T DE68927959 T DE 68927959T DE 68927959 T DE68927959 T DE 68927959T DE 68927959 D1 DE68927959 D1 DE 68927959D1
Authority
DE
Germany
Prior art keywords
producing
layer capacitors
chip layer
metalized film
metalized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68927959T
Other languages
English (en)
Other versions
DE68927959T2 (de
Inventor
Tsunetatsu Yamauchi
Masataka Okaniwa
Mamoru Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Oji Paper Co Ltd
Original Assignee
Honshu Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honshu Paper Co Ltd filed Critical Honshu Paper Co Ltd
Application granted granted Critical
Publication of DE68927959D1 publication Critical patent/DE68927959D1/de
Publication of DE68927959T2 publication Critical patent/DE68927959T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/015—Special provisions for self-healing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/06—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00 with provision for removing metal surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Physical Vapour Deposition (AREA)
DE68927959T 1988-12-07 1989-12-07 Verfahren zur herstellung einer metallisierten folie für chipschichtkondensatoren Expired - Fee Related DE68927959T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30779988 1988-12-07
PCT/JP1989/001229 WO1990006586A1 (en) 1988-12-07 1989-12-07 Metallized film for laminated chip capacitors and method of producing the same

Publications (2)

Publication Number Publication Date
DE68927959D1 true DE68927959D1 (de) 1997-05-15
DE68927959T2 DE68927959T2 (de) 1997-11-27

Family

ID=17973369

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68927959T Expired - Fee Related DE68927959T2 (de) 1988-12-07 1989-12-07 Verfahren zur herstellung einer metallisierten folie für chipschichtkondensatoren

Country Status (5)

Country Link
EP (1) EP0447550B1 (de)
JP (1) JPH02263419A (de)
KR (2) KR930010422B1 (de)
DE (1) DE68927959T2 (de)
WO (1) WO1990006586A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4100643C1 (de) * 1991-01-11 1991-10-31 Leybold Ag, 6450 Hanau, De
DE19734477B4 (de) * 1996-08-09 2005-11-03 Matsushita Electric Industrial Co., Ltd., Kadoma Metallisierter Filmkondensator und Vorrichtung und Verfahren für die Herstellung eines metallisierten Films für den metallisierten Filmkondensator
KR100483944B1 (ko) * 2000-04-14 2005-04-15 마쯔시다덴기산교 가부시키가이샤 적층체, 콘덴서, 전자부품 및 이들의 제조 방법과 제조 장치
US20040209197A1 (en) * 2003-04-17 2004-10-21 Murata Manufacturing Co., Ltd. Photogravure press and method for manufacturing multilayer-ceramic electronic component
JP4007335B2 (ja) * 2003-04-17 2007-11-14 株式会社村田製作所 グラビアロール、グラビア印刷機および積層セラミック電子部品の製造方法
EP1693481A1 (de) 2005-11-23 2006-08-23 Galileo Vacuum Systems S.R.L. Kammer zur Metallisierung unter Vakuum mit Vorrichtungen zur partiellen Beschichtung
US8169014B2 (en) 2006-01-09 2012-05-01 Taiwan Semiconductor Manufacturing Co., Ltd. Interdigitated capacitive structure for an integrated circuit
KR101082852B1 (ko) * 2006-10-06 2011-11-11 가부시키가이샤 알박 권취식 진공성막장치
JP2008124245A (ja) * 2006-11-13 2008-05-29 Matsushita Electric Ind Co Ltd 金属化フィルムの製造装置と金属化フィルムの製造方法
EP1975272A1 (de) 2007-03-27 2008-10-01 Galileo Vacuum Systems S.p.A. Vorrichtung zur Vakuumabscheidung einer Beschichtung auf ein endloses Material mit einem Gerät zum Auftragen von Flüssigkeit.
EP1978126B1 (de) * 2007-04-03 2010-05-19 Applied Materials, Inc. Vorrichtung zum kontinuierlichen Beschichten eines bandförmigen Substrates
JP5450348B2 (ja) * 2010-10-27 2014-03-26 小島プレス工業株式会社 金属化フィルムの製造装置
KR101422938B1 (ko) * 2012-12-04 2014-07-23 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 이의 제조방법, 기판 내장용 적층 세라믹 전자부품을 구비하는 인쇄회로기판
JP6269187B2 (ja) * 2014-03-07 2018-01-31 株式会社村田製作所 積層型フィルムコンデンサ、コンデンサモジュール、および電力変換システム
EP3671779A4 (de) * 2017-08-15 2021-05-26 Oji Holdings Corporation Metallisierte folie, rolle von metallisierter folien, plattenzylinder
JP6383933B1 (ja) * 2018-02-02 2018-09-05 王子ホールディングス株式会社 金属化フィルム、版ロール

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL69653C (de) * 1945-08-14 1952-02-16
LU42919A1 (de) * 1962-12-21 1963-02-21
GB1106364A (en) * 1964-03-04 1968-03-13 Bostik Ltd Improvements in or relating to metallized surfaces
JPS5158649A (en) * 1974-11-15 1976-05-22 Matsushita Electric Ind Co Ltd Ratsukaamaajinno keiseihoho
JPS57177518A (en) * 1981-04-24 1982-11-01 Tdk Electronics Co Ltd Laminated condenser and method of producing same
IT1185177B (it) * 1985-07-03 1987-11-04 Metalvuoto Films Spa Dispositivo per realizzare film plastici metallizzati presentanti zone ben delimitate prive di metallizzazione
JPS6240714A (ja) * 1985-08-16 1987-02-21 株式会社村田製作所 積層コンデンサの製造方法
JPS63114956A (ja) * 1986-03-06 1988-05-19 Shizuki Denki Seisakusho:Kk 金属化プラスチツクフイルムの製造方法
DE3725454A1 (de) * 1987-07-31 1989-02-09 Siemens Ag Elektrisches vielschichtbauelement mit einem gesinterten, monolithischen keramikkoerper und verfahren zur herstellung des elektrischen vielschichtbauelementes

Also Published As

Publication number Publication date
WO1990006586A1 (en) 1990-06-14
JPH02263419A (ja) 1990-10-26
DE68927959T2 (de) 1997-11-27
KR910700536A (ko) 1991-03-15
KR930010422B1 (ko) 1993-10-23
EP0447550A1 (de) 1991-09-25
EP0447550B1 (de) 1997-04-09
EP0447550A4 (en) 1992-12-02

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: OJI PAPER CO., LTD., TOKIO/TOKYO, JP

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee