DE68925939T2 - Packung für elektronische Anordnungen zum Betrieb bei verschiedenen jeweiligen Temperaturen - Google Patents

Packung für elektronische Anordnungen zum Betrieb bei verschiedenen jeweiligen Temperaturen

Info

Publication number
DE68925939T2
DE68925939T2 DE68925939T DE68925939T DE68925939T2 DE 68925939 T2 DE68925939 T2 DE 68925939T2 DE 68925939 T DE68925939 T DE 68925939T DE 68925939 T DE68925939 T DE 68925939T DE 68925939 T2 DE68925939 T2 DE 68925939T2
Authority
DE
Germany
Prior art keywords
pack
various temperatures
electronic assemblies
assemblies
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68925939T
Other languages
English (en)
Other versions
DE68925939D1 (de
Inventor
Seigo Kotani
Hiroyuki Sakai
Toshikazu Takenouchi
Fumio Miyagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Fujitsu Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd, Fujitsu Ltd filed Critical Shinko Electric Industries Co Ltd
Application granted granted Critical
Publication of DE68925939D1 publication Critical patent/DE68925939D1/de
Publication of DE68925939T2 publication Critical patent/DE68925939T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DE68925939T 1988-11-02 1989-11-02 Packung für elektronische Anordnungen zum Betrieb bei verschiedenen jeweiligen Temperaturen Expired - Fee Related DE68925939T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63276023A JP2681288B2 (ja) 1988-11-02 1988-11-02 超伝導素子用パッケージ

Publications (2)

Publication Number Publication Date
DE68925939D1 DE68925939D1 (de) 1996-04-18
DE68925939T2 true DE68925939T2 (de) 1996-08-08

Family

ID=17563717

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68925939T Expired - Fee Related DE68925939T2 (de) 1988-11-02 1989-11-02 Packung für elektronische Anordnungen zum Betrieb bei verschiedenen jeweiligen Temperaturen

Country Status (4)

Country Link
US (1) US4980754A (de)
EP (1) EP0367630B1 (de)
JP (1) JP2681288B2 (de)
DE (1) DE68925939T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014013958A1 (de) * 2014-09-19 2016-03-24 Audi Ag Flüssigkeitsgekühltes Kraftfahrzeugsteuergerät, Kraftfahrzeug mit diesem, sowie Verfahren zur Kühlung eines elektronischen Bauelements eines Kraftfahrzeugsteuergeräts

Families Citing this family (29)

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Publication number Priority date Publication date Assignee Title
JPH0710005B2 (ja) * 1989-08-31 1995-02-01 アメリカン テレフォン アンド テレグラフ カムパニー 超伝導体相互接続装置
US5126830A (en) * 1989-10-31 1992-06-30 General Electric Company Cryogenic semiconductor power devices
US5247189A (en) * 1989-11-15 1993-09-21 Sumitomo Electric Industries, Ltd. Superconducting device composed of oxide superconductor material
US5121292A (en) * 1990-01-23 1992-06-09 International Business Machines Corporation Field replaceable cryocooled computer logic unit
US5212626A (en) * 1990-11-09 1993-05-18 International Business Machines Corporation Electronic packaging and cooling system using superconductors for power distribution
CA2088821C (en) * 1992-02-05 1999-09-07 Hironobu Ikeda Cooling structure for integrated circuit
US5474834A (en) * 1992-03-09 1995-12-12 Kyocera Corporation Superconducting circuit sub-assembly having an oxygen shielding barrier layer
JPH063427A (ja) * 1992-06-23 1994-01-11 Fujitsu Ltd 磁気検出装置
US5436793A (en) * 1993-03-31 1995-07-25 Ncr Corporation Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
US5861574A (en) * 1993-04-14 1999-01-19 Fujitsu Limited Apparatus for mounting a superconducting element
JPH06350146A (ja) * 1993-06-14 1994-12-22 Sharp Corp 超電導装置
JP2953273B2 (ja) * 1993-10-22 1999-09-27 住友電気工業株式会社 低温に冷却する素子の接続方法
US5448108A (en) * 1993-11-02 1995-09-05 Hughes Aircraft Company Cooling of semiconductor power modules by flushing with dielectric liquid
US5789704A (en) * 1995-12-06 1998-08-04 Sumitomo Wiring Systems, Ltd. Container with heat removing features for containing an electronic contol unit
US6188358B1 (en) * 1997-10-20 2001-02-13 Infrared Components Corporation Antenna signal conduit for different temperature and pressure environments
US6434000B1 (en) * 1998-12-03 2002-08-13 Iv Phoenix Group, Inc. Environmental system for rugged disk drive
US7335965B2 (en) 1999-08-25 2008-02-26 Micron Technology, Inc. Packaging of electronic chips with air-bridge structures
JP2001093821A (ja) * 1999-09-24 2001-04-06 Toshiba Corp 製造装置組立部品、製造装置組立部品の製造方法、半導体製造装置及び電子ビーム露光装置
JP4236408B2 (ja) 2000-01-31 2009-03-11 富士通株式会社 熱遮断信号伝送ユニットおよび超伝導信号伝送装置
KR20080041305A (ko) * 2000-09-07 2008-05-09 이 아이 듀폰 디 네모아 앤드 캄파니 극저온 수신기를 동조시키는 방법
US6744136B2 (en) * 2001-10-29 2004-06-01 International Rectifier Corporation Sealed liquid cooled electronic device
US7300821B2 (en) * 2004-08-31 2007-11-27 Micron Technology, Inc. Integrated circuit cooling and insulating device and method
US7202562B2 (en) * 2004-12-02 2007-04-10 Micron Technology, Inc. Integrated circuit cooling system and method
US20060274502A1 (en) * 2005-06-01 2006-12-07 Rapp Robert J Electronic package whereby an electronic assembly is packaged within an enclosure that is designed to act as a heat pipe
US9524470B1 (en) * 2015-06-12 2016-12-20 International Business Machines Corporation Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
US9702906B2 (en) 2015-06-26 2017-07-11 International Business Machines Corporation Non-permanent termination structure for microprobe measurements
US10390455B2 (en) * 2017-03-27 2019-08-20 Raytheon Company Thermal isolation of cryo-cooled components from circuit boards or other structures
US11159127B2 (en) 2019-04-30 2021-10-26 Quantum Opus, LLC Noise suppressing interface circuit for device with control circuits in different noise environments
US11917794B2 (en) * 2020-10-30 2024-02-27 Advanced Micro Devices, Inc. Separating temperature domains in cooled systems

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
JPS59144190A (ja) * 1983-02-08 1984-08-18 Agency Of Ind Science & Technol 超伝導回路用実装基板
EP0213421A3 (de) * 1985-08-07 1989-02-22 Honeywell Inc. Infrarotdetektoranordnung mit Vakuumkammern
JPH0325419Y2 (de) * 1985-10-07 1991-06-03
JPH0325420Y2 (de) * 1985-10-07 1991-06-03
EP0228212B1 (de) * 1985-12-16 1991-08-07 Hitachi, Ltd. Integriertes Halbleiterbauelement
US4734820A (en) * 1987-04-16 1988-03-29 Ncr Corporation Cryogenic packaging scheme
US4805420A (en) * 1987-06-22 1989-02-21 Ncr Corporation Cryogenic vessel for cooling electronic components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014013958A1 (de) * 2014-09-19 2016-03-24 Audi Ag Flüssigkeitsgekühltes Kraftfahrzeugsteuergerät, Kraftfahrzeug mit diesem, sowie Verfahren zur Kühlung eines elektronischen Bauelements eines Kraftfahrzeugsteuergeräts
DE102014013958B4 (de) * 2014-09-19 2017-06-08 Audi Ag Kühlanordnung für ein Kraftfahrzeugsteuergerät, Kraftfahrzeug und Kraftfahrzeugsteuergerät

Also Published As

Publication number Publication date
EP0367630B1 (de) 1996-03-13
JP2681288B2 (ja) 1997-11-26
JPH02123774A (ja) 1990-05-11
DE68925939D1 (de) 1996-04-18
US4980754A (en) 1990-12-25
EP0367630A1 (de) 1990-05-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee