DE68924092D1 - Bildbearbeitungsapparat und Verfahren zur Inspektion von Fehlern von Halbleiterbehältern. - Google Patents

Bildbearbeitungsapparat und Verfahren zur Inspektion von Fehlern von Halbleiterbehältern.

Info

Publication number
DE68924092D1
DE68924092D1 DE68924092T DE68924092T DE68924092D1 DE 68924092 D1 DE68924092 D1 DE 68924092D1 DE 68924092 T DE68924092 T DE 68924092T DE 68924092 T DE68924092 T DE 68924092T DE 68924092 D1 DE68924092 D1 DE 68924092D1
Authority
DE
Germany
Prior art keywords
processing apparatus
image processing
inspecting defects
semiconductor containers
containers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68924092T
Other languages
English (en)
Other versions
DE68924092T2 (de
Inventor
Takayuki C O Intellectua Ozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE68924092D1 publication Critical patent/DE68924092D1/de
Application granted granted Critical
Publication of DE68924092T2 publication Critical patent/DE68924092T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
DE68924092T 1988-05-10 1989-05-10 Bildbearbeitungsapparat und Verfahren zur Inspektion von Fehlern von Halbleiterbehältern. Expired - Fee Related DE68924092T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63113355A JPH01284743A (ja) 1988-05-10 1988-05-10 半導体装置の樹脂モールドの外観検査方法とその検査装置

Publications (2)

Publication Number Publication Date
DE68924092D1 true DE68924092D1 (de) 1995-10-12
DE68924092T2 DE68924092T2 (de) 1996-03-21

Family

ID=14610172

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68924092T Expired - Fee Related DE68924092T2 (de) 1988-05-10 1989-05-10 Bildbearbeitungsapparat und Verfahren zur Inspektion von Fehlern von Halbleiterbehältern.

Country Status (5)

Country Link
US (1) US5568564A (de)
EP (1) EP0341685B1 (de)
JP (1) JPH01284743A (de)
KR (1) KR920003932B1 (de)
DE (1) DE68924092T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2803388B2 (ja) * 1991-04-26 1998-09-24 三菱電機株式会社 部品検査装置
US5793642A (en) * 1997-01-21 1998-08-11 Tektronix, Inc. Histogram based testing of analog signals
JP3793977B2 (ja) * 1997-01-30 2006-07-05 ソニー株式会社 画像照合装置
AU2005200A (en) * 1999-01-18 2000-08-01 Nikon Corporation Pattern matching method and device, position determining method and device, position aligning method and device, exposing method and device, and device and its production method
US6488405B1 (en) * 2000-03-08 2002-12-03 Advanced Micro Devices, Inc. Flip chip defect analysis using liquid crystal
JP4743805B2 (ja) * 2000-04-06 2011-08-10 ルネサスエレクトロニクス株式会社 外観検査方法および装置
US7151850B2 (en) * 2001-10-30 2006-12-19 Matsushita Electric Industrial Co., Ltd. Apparatus and method for setting teaching data, teaching data providing system over network
JP2003248008A (ja) * 2001-12-18 2003-09-05 Inst Of Physical & Chemical Res 反応液の攪拌方法
JP4254204B2 (ja) * 2001-12-19 2009-04-15 富士ゼロックス株式会社 画像照合装置、画像形成装置及び画像照合プログラム
JP2003240521A (ja) * 2002-02-21 2003-08-27 Bridgestone Corp 被検体の外観・形状検査方法とその装置、及び、被検体の外観・形状検出装置
DE102005017642B4 (de) * 2005-04-15 2010-04-08 Vistec Semiconductor Systems Jena Gmbh Verfahren zur Inspektion eines Wafers
JP5004478B2 (ja) * 2006-02-17 2012-08-22 日立造船株式会社 物体の判別方法および判別装置
KR100940301B1 (ko) * 2008-03-26 2010-02-05 호서대학교 산학협력단 마크 분할 검사 방법
JP7303720B2 (ja) * 2019-10-15 2023-07-05 ケミカルグラウト株式会社 地層構造解析システム及びプログラム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4472736A (en) * 1980-03-11 1984-09-18 Dainippon Ink And Chemicals Incorporated Lithographic reproduction original classification and color separation tone curve adjustment
US4484081A (en) * 1980-09-19 1984-11-20 Trw Inc. Defect analysis system
JPS57137978A (en) * 1981-02-20 1982-08-25 Toshiba Corp Pattern detecting device
JPH0722166B2 (ja) * 1982-09-22 1995-03-08 株式会社東芝 ダイボンダ等におけるペレツト認識方法
JPS6083328A (ja) * 1983-10-13 1985-05-11 Fujitsu Ltd フオトマスクの検査方法
GB8331248D0 (en) * 1983-11-23 1983-12-29 Kearney & Trecker Marwin Ltd Inspecting articles
JPS6342575A (ja) * 1986-08-08 1988-02-23 Dainippon Screen Mfg Co Ltd 階調変換方法およびその装置
DE3750285T2 (de) * 1986-10-03 1995-03-30 Omron Tateisi Electronics Co Gerät zur Untersuchung einer elektronischen Vorrichtung in fester Baugruppe.

Also Published As

Publication number Publication date
EP0341685B1 (de) 1995-09-06
JPH0588779B2 (de) 1993-12-24
EP0341685A3 (en) 1990-12-19
KR920003932B1 (ko) 1992-05-18
EP0341685A2 (de) 1989-11-15
JPH01284743A (ja) 1989-11-16
DE68924092T2 (de) 1996-03-21
US5568564A (en) 1996-10-22
KR890017545A (ko) 1989-12-16

Similar Documents

Publication Publication Date Title
DE68923611D1 (de) Verfahren und apparat zur beförderung von gegenständen.
DE3852134D1 (de) Vorrichtung und verfahren zur aufbereitung von abgetasteten mikrofilmbildern.
ATA902991A (de) System und verfahren zum bearbeiten von biologischen flüssigkeiten
IL82037A0 (en) Method and apparatus for automatically inspecting and classifying different objects
DE69233207D1 (de) Verfahren und gerät zur bildverarbeitung.
DE69307722D1 (de) Vorrichtung und verfahren zur inspektion transparenten materials
DE69425645D1 (de) Vorrichtung zum Verarbeiten von Dokumenten und Verfahren dafür
DE3774578D1 (de) Bildverarbeitungsverfahren und geraet zur entfernung von fehlerhaften lichtflecken.
DE3483434D1 (de) Verfahren und geraet zur bearbeitung eines defekten speichers.
DE3853301D1 (de) Verfahren und Vorrichtung zur Positionierung von Vorlagen in Bildabtastern.
DE69214003D1 (de) Verfahren und Vorrichtung zum Auflösen von Gasen in Flüssigkeiten
DE69014354D1 (de) Verfahren und Anordnung zur Bearbeitung der Röntgenstrahlabbildung im Röntgenstrahlgerät.
DE68924286D1 (de) Verfahren und Apparat zum Lesen und zur Reproduktion von Bildern und Lichtquelleneinrichtung mehrerer Halbleiterlaser dazu.
DE68924092D1 (de) Bildbearbeitungsapparat und Verfahren zur Inspektion von Fehlern von Halbleiterbehältern.
DE69706763D1 (de) Verfahren und Vorrichtung zum selektiven Bearbeiten von abgetasteten Bildvorlagen
DE69525317D1 (de) Vorrichtung und Verfahren zum Verarbeiten von bewegten Bildern
EP0641992A3 (de) Vorrichtungs- und Verfahrungssysteme zum Messen von Fabrikationsfehlern in Halbleitern.
EP0289615A4 (en) Surface defect inspection method and surface defect inspection apparatus
DE69115234D1 (de) Verfahren und Vorrichtung zur Handhabung von Wafern.
DE69008623D1 (de) Verfahren und Vorrichtung zur Untersuchung von Oberflächenfehlern.
DE3578585D1 (de) Verfahren und vorrichtung zum auslesen und zur gradationsverarbeitung von strahlungsbildern.
DE68910203D1 (de) Verfahren und Vorrichtung zur Kühlmittelleckprüfung.
DE3762460D1 (de) Verfahren und vorrichtung zum feststellen von undichtigkeiten bei behaeltnissen.
DE69014273D1 (de) Verfahren und Vorrichtung zur Feststellung von Unreinheiten in Halbleitern.
DE68928692T2 (de) Verfahren und Vorrichtung zur Verbesserung von Einzelheiten in Bildern

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee