DE68915519T2 - Kupfer-Plattierungsverfahren für Metalle, die schwer zu plattieren sind. - Google Patents
Kupfer-Plattierungsverfahren für Metalle, die schwer zu plattieren sind.Info
- Publication number
- DE68915519T2 DE68915519T2 DE1989615519 DE68915519T DE68915519T2 DE 68915519 T2 DE68915519 T2 DE 68915519T2 DE 1989615519 DE1989615519 DE 1989615519 DE 68915519 T DE68915519 T DE 68915519T DE 68915519 T2 DE68915519 T2 DE 68915519T2
- Authority
- DE
- Germany
- Prior art keywords
- liter
- grams
- copper
- bath
- copper plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims description 25
- 229910052751 metal Inorganic materials 0.000 title claims description 17
- 239000002184 metal Substances 0.000 title claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 16
- 229910052802 copper Inorganic materials 0.000 title claims description 16
- 239000010949 copper Substances 0.000 title claims description 16
- 150000002739 metals Chemical class 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 239000008367 deionised water Substances 0.000 claims description 8
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical class [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 7
- 229910021641 deionized water Inorganic materials 0.000 claims description 7
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 6
- 239000004202 carbamide Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical group [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 235000019333 sodium laurylsulphate Nutrition 0.000 claims description 4
- 125000002088 tosyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C([H])([H])[H])S(*)(=O)=O 0.000 claims description 4
- 239000003093 cationic surfactant Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- CVPPUZPZPFOFPK-UHFFFAOYSA-N 2-phenylethyl 4-methylbenzenesulfonate Chemical group C1=CC(C)=CC=C1S(=O)(=O)OCCC1=CC=CC=C1 CVPPUZPZPFOFPK-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 238000005282 brightening Methods 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- XRZXISLUGUUKPW-UHFFFAOYSA-N sulfosulfonylmethane Chemical class CS(=O)(=O)S(O)(=O)=O XRZXISLUGUUKPW-UHFFFAOYSA-N 0.000 claims 3
- 239000011260 aqueous acid Substances 0.000 claims 1
- -1 copper Chemical class 0.000 claims 1
- 238000007598 dipping method Methods 0.000 claims 1
- 238000001914 filtration Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 150000003459 sulfonic acid esters Chemical class 0.000 claims 1
- 239000000080 wetting agent Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 7
- 239000010937 tungsten Substances 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 206010014357 Electric shock Diseases 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000004170 methylsulfonyl group Chemical group [H]C([H])([H])S(*)(=O)=O 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28999388A | 1988-12-21 | 1988-12-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68915519D1 DE68915519D1 (de) | 1994-06-30 |
DE68915519T2 true DE68915519T2 (de) | 1994-12-01 |
Family
ID=23114070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1989615519 Expired - Fee Related DE68915519T2 (de) | 1988-12-21 | 1989-11-29 | Kupfer-Plattierungsverfahren für Metalle, die schwer zu plattieren sind. |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0375179B1 (enrdf_load_stackoverflow) |
JP (1) | JPH02232390A (enrdf_load_stackoverflow) |
DE (1) | DE68915519T2 (enrdf_load_stackoverflow) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2818294A1 (fr) * | 2000-12-15 | 2002-06-21 | Thomson Csf | Revetement metallique conducteur anticorrosion, procede de fabrication dudit revetement, et produit utilise dans ledit procede |
RU2194098C1 (ru) * | 2001-06-29 | 2002-12-10 | Калининградский государственный университет | Электролит блестящего меднения |
JP2010150622A (ja) * | 2008-12-26 | 2010-07-08 | Hitachi Ltd | めっき液,凸状金属構造体を有する導電体基板、及び、その製造方法 |
CN103668355B (zh) * | 2013-12-06 | 2016-05-11 | 南京三乐电子信息产业集团有限公司 | 一种行波管钨螺旋线表面的镀铜方法 |
FR3053352A1 (fr) | 2016-07-04 | 2018-01-05 | Airbus Safran Launchers Sas | Composition de protection anticorrosion |
DE102016113641A1 (de) | 2016-07-25 | 2018-01-25 | Christian-Albrechts-Universität Zu Kiel | Aluminium-Kupfer-Konnektor aufweisend eine Heterostruktur und Verfahren zur Herstellung der Heterostruktur |
CN107447239B (zh) * | 2017-08-21 | 2018-08-28 | 安徽省含山县兴建铸造厂 | 一种耐腐蚀防振锤的制备方法 |
-
1989
- 1989-11-21 JP JP30096289A patent/JPH02232390A/ja active Granted
- 1989-11-29 EP EP19890312444 patent/EP0375179B1/en not_active Expired - Lifetime
- 1989-11-29 DE DE1989615519 patent/DE68915519T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH02232390A (ja) | 1990-09-14 |
EP0375179A2 (en) | 1990-06-27 |
EP0375179B1 (en) | 1994-05-25 |
EP0375179A3 (en) | 1991-01-30 |
JPH0317913B2 (enrdf_load_stackoverflow) | 1991-03-11 |
DE68915519D1 (de) | 1994-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |