DE68911441D1 - Anordnung mit einer elektronischen Schaltung, montiert auf einem biegsamen Träger, geschützt gegen elektrostatische Entladungen, und biegsame Karte mit dieser Anordnung. - Google Patents

Anordnung mit einer elektronischen Schaltung, montiert auf einem biegsamen Träger, geschützt gegen elektrostatische Entladungen, und biegsame Karte mit dieser Anordnung.

Info

Publication number
DE68911441D1
DE68911441D1 DE89202282T DE68911441T DE68911441D1 DE 68911441 D1 DE68911441 D1 DE 68911441D1 DE 89202282 T DE89202282 T DE 89202282T DE 68911441 T DE68911441 T DE 68911441T DE 68911441 D1 DE68911441 D1 DE 68911441D1
Authority
DE
Germany
Prior art keywords
arrangement
flexible
electronic circuit
electrostatic discharge
protected against
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89202282T
Other languages
English (en)
Other versions
DE68911441T2 (de
Inventor
Lucien Amiot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
De la Rue Cartes et Systemes SAS
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of DE68911441D1 publication Critical patent/DE68911441D1/de
Publication of DE68911441T2 publication Critical patent/DE68911441T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
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DE68911441T 1988-09-16 1989-09-11 Anordnung mit einer elektronischen Schaltung, montiert auf einem biegsamen Träger, geschützt gegen elektrostatische Entladungen, und biegsame Karte mit dieser Anordnung. Expired - Fee Related DE68911441T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8812103A FR2636776A1 (fr) 1988-09-16 1988-09-16 Dispositif comportant un circuit electronique monte sur un support souple, protege contre les decharges d'electricite statique, et carte souple le comprenant

Publications (2)

Publication Number Publication Date
DE68911441D1 true DE68911441D1 (de) 1994-01-27
DE68911441T2 DE68911441T2 (de) 1994-06-16

Family

ID=9370071

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68911441T Expired - Fee Related DE68911441T2 (de) 1988-09-16 1989-09-11 Anordnung mit einer elektronischen Schaltung, montiert auf einem biegsamen Träger, geschützt gegen elektrostatische Entladungen, und biegsame Karte mit dieser Anordnung.

Country Status (4)

Country Link
EP (1) EP0359328B1 (de)
JP (1) JP2744923B2 (de)
DE (1) DE68911441T2 (de)
FR (1) FR2636776A1 (de)

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JP3016884B2 (ja) * 1991-02-06 2000-03-06 ローム株式会社 サーマルヘッド
DE4224103A1 (de) * 1992-07-22 1994-01-27 Manfred Dr Ing Michalk Miniaturgehäuse mit elektronischen Bauelementen
GB2279611A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd An integrated circuit or smart card.
DE19608513A1 (de) * 1996-03-05 1997-09-11 Siemens Ag Chipkarte mit ESD-Schutz
DE19614914A1 (de) * 1996-04-16 1997-10-23 Telesensomatic Gmbh Transponderanordnung und Verfahren zur Herstellung einer solchen Transponderanordnung
JP4852276B2 (ja) * 2005-08-10 2012-01-11 富士通セミコンダクター株式会社 半導体装置の製造方法
US20090079097A1 (en) 2007-09-25 2009-03-26 Silverbrook Research Pty Ltd Electronic component with wire bonds in low modulus fill encapsulant

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154344A (en) * 1976-11-09 1979-05-15 Minnesota Mining And Manufacturing Company Material for forming envelopes used to protect electronic components
US4301040A (en) * 1978-06-23 1981-11-17 Charleswater Products, Inc. Electrically conductive foam and method of preparation and use
FR2480008A1 (fr) * 1980-04-04 1981-10-09 Flonic Sa Perfectionnements aux cartes a memoire
JPS5785866A (en) * 1980-11-18 1982-05-28 Mitsubishi Metal Corp Antistatic transparent paint
FR2517165A1 (fr) * 1981-11-20 1983-05-27 Radiotechnique Compelec Procede pour munir d'un ecran un circuit electronique, et carte de paiement munie d'un ecran
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique

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EP0359328A1 (de) 1990-03-21
EP0359328B1 (de) 1993-12-15
DE68911441T2 (de) 1994-06-16
JP2744923B2 (ja) 1998-04-28
FR2636776A1 (fr) 1990-03-23
JPH02127095A (ja) 1990-05-15

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