DE60334936D1 - Kameramodul - Google Patents

Kameramodul

Info

Publication number
DE60334936D1
DE60334936D1 DE60334936T DE60334936T DE60334936D1 DE 60334936 D1 DE60334936 D1 DE 60334936D1 DE 60334936 T DE60334936 T DE 60334936T DE 60334936 T DE60334936 T DE 60334936T DE 60334936 D1 DE60334936 D1 DE 60334936D1
Authority
DE
Germany
Prior art keywords
camera module
camera
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60334936T
Other languages
German (de)
English (en)
Inventor
Masanori Onodera
Susumu Moriya
Izumi Kobayashi
Hiroshi Aoki
Koji Sawahata
Shigeo Iriguchi
Toshiyuki Honda
Katsuro Hiraiwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Semiconductor Ltd
Original Assignee
Fujitsu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Semiconductor Ltd filed Critical Fujitsu Semiconductor Ltd
Application granted granted Critical
Publication of DE60334936D1 publication Critical patent/DE60334936D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
DE60334936T 2003-09-30 2003-09-30 Kameramodul Expired - Lifetime DE60334936D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/012537 WO2005034508A1 (ja) 2003-09-30 2003-09-30 カメラモジュール

Publications (1)

Publication Number Publication Date
DE60334936D1 true DE60334936D1 (de) 2010-12-23

Family

ID=34401436

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60334936T Expired - Lifetime DE60334936D1 (de) 2003-09-30 2003-09-30 Kameramodul

Country Status (7)

Country Link
US (1) US7659937B2 (zh)
EP (1) EP1670238B1 (zh)
JP (1) JP4012924B2 (zh)
CN (3) CN100576885C (zh)
AU (1) AU2003268702A1 (zh)
DE (1) DE60334936D1 (zh)
WO (1) WO2005034508A1 (zh)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4585409B2 (ja) 2005-08-24 2010-11-24 株式会社東芝 小型カメラモジュール
US7531773B2 (en) 2005-09-08 2009-05-12 Flextronics Ap, Llc Auto-focus and zoom module having a lead screw with its rotation results in translation of an optics group
KR100770690B1 (ko) * 2006-03-15 2007-10-29 삼성전기주식회사 카메라모듈 패키지
WO2008093830A1 (ja) * 2007-02-02 2008-08-07 Panasonic Corporation 撮像装置、その製造方法および携帯端末装置
CA2685080A1 (en) 2007-04-24 2008-11-06 Flextronics Ap Llc Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly
US7825985B2 (en) * 2007-07-19 2010-11-02 Flextronics Ap, Llc Camera module back-focal length adjustment method and ultra compact components packaging
US8488046B2 (en) 2007-12-27 2013-07-16 Digitaloptics Corporation Configurable tele wide module
DE102008047088B4 (de) * 2008-09-12 2019-05-29 Jabil Circuit Inc. Kamera-Modul für ein Mobiltelefon
KR20110127913A (ko) * 2010-05-20 2011-11-28 삼성전자주식회사 카메라 모듈
CN102893593B (zh) * 2010-06-28 2016-11-23 京瓷株式会社 布线基板及摄像装置以及摄像装置模块
US10009528B2 (en) 2011-02-24 2018-06-26 Nan Chang O-Film Optoelectronics Technology Ltd Autofocus camera module packaging with circuitry-integrated actuator system
US8545114B2 (en) 2011-03-11 2013-10-01 Digitaloptics Corporation Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane
US8982267B2 (en) 2011-07-27 2015-03-17 Flextronics Ap, Llc Camera module with particle trap
US9197796B2 (en) * 2011-11-23 2015-11-24 Lg Innotek Co., Ltd. Camera module
JP2013229675A (ja) * 2012-04-24 2013-11-07 Sony Corp 撮像ユニット及び撮像装置
US9370107B2 (en) * 2014-04-18 2016-06-14 Unimicron Technology Corp. Embedded component structure and process thereof
JP2016057384A (ja) * 2014-09-08 2016-04-21 株式会社ケンコー・トキナー フィルターユニット
CN109547680A (zh) * 2016-02-18 2019-03-29 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组及其模塑线路板组件及制造方法
US10750071B2 (en) * 2016-03-12 2020-08-18 Ningbo Sunny Opotech Co., Ltd. Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof
TWI743429B (zh) * 2016-04-01 2021-10-21 大陸商寧波舜宇光電信息有限公司 基於一體封裝工藝的攝像模組及其一體基座組件和製造方法
JP6989275B2 (ja) * 2017-03-30 2022-01-05 日本電産サンキョー株式会社 振れ補正機能付き光学ユニット
TWI706180B (zh) * 2017-09-28 2020-10-01 大陸商寧波舜宇光電信息有限公司 減少雜散光的攝像模組及其感光組件和電子設備
CN109581785B (zh) * 2017-09-28 2021-05-04 宁波舜宇光电信息有限公司 减少杂散光的摄像模组及其感光组件
FR3078855A1 (fr) * 2018-03-08 2019-09-13 St Microelectronics Grenoble 2 Sas Capot d'encapsulation pour boitier electronique et procede de fabrication
CN110650269A (zh) * 2018-06-27 2020-01-03 三赢科技(深圳)有限公司 相机模组及其形成方法
KR102558354B1 (ko) 2018-08-08 2023-07-21 삼성전자주식회사 적외선 필터를 포함하는 카메라 모듈 및 이를 포함하는 전자 장치

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
JPS5853277A (ja) * 1981-09-25 1983-03-29 Oki Electric Ind Co Ltd 固体撮像装置
JPH067587B2 (ja) 1986-09-01 1994-01-26 三菱電機株式会社 固体撮像装置
JPH0423469A (ja) 1990-05-18 1992-01-27 Toshiba Corp 固体撮像素子モジュール
JP2798853B2 (ja) 1992-06-26 1998-09-17 三洋電機株式会社 ドライクリ−ナのフィルタ−浄化方法
FR2737566B1 (fr) * 1995-08-02 1997-09-19 Sofradir Procede pour realiser l'assemblage d'un bloc de detection d'ondes electromagnetiques, notamment infrarouges, avec un support conducteur thermique, et detecteur d'ondes electromagnetiques mettant en oeuvre ce procede
US6144031A (en) * 1997-04-21 2000-11-07 Inframetrics Inc. Infrared video camera system with uncooled focal plane array and radiation shield
US5949655A (en) * 1997-09-09 1999-09-07 Amkor Technology, Inc. Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device
CN2378391Y (zh) 1999-06-17 2000-05-17 常堡同 高强度太阳光调节膜
JP4004705B2 (ja) * 2000-02-29 2007-11-07 松下電器産業株式会社 撮像装置と撮像装置組立方法
JP3880278B2 (ja) * 2000-03-10 2007-02-14 オリンパス株式会社 固体撮像装置及びその製造方法
JP2001339055A (ja) * 2000-05-29 2001-12-07 Asahi Optical Co Ltd 固体撮像装置のカバー部材と固体撮像装置
JP2001358997A (ja) * 2000-06-12 2001-12-26 Mitsubishi Electric Corp 半導体装置
JP4405062B2 (ja) * 2000-06-16 2010-01-27 株式会社ルネサステクノロジ 固体撮像装置
JP3821652B2 (ja) * 2001-02-26 2006-09-13 三菱電機株式会社 撮像装置
TW548843B (en) * 2001-02-28 2003-08-21 Fujitsu Ltd Semiconductor device and method for making the same
JP2002373977A (ja) 2001-06-14 2002-12-26 Canon Inc 固体撮像装置
KR100673950B1 (ko) * 2004-02-20 2007-01-24 삼성테크윈 주식회사 이미지 센서 모듈과 이를 구비하는 카메라 모듈 패키지

Also Published As

Publication number Publication date
CN100438572C (zh) 2008-11-26
JP4012924B2 (ja) 2007-11-28
US7659937B2 (en) 2010-02-09
US20060243884A1 (en) 2006-11-02
CN101175155A (zh) 2008-05-07
CN1839620A (zh) 2006-09-27
EP1670238B1 (en) 2010-11-10
EP1670238A4 (en) 2009-04-01
EP1670238A1 (en) 2006-06-14
CN100576885C (zh) 2009-12-30
JPWO2005034508A1 (ja) 2006-12-21
CN101175156A (zh) 2008-05-07
AU2003268702A1 (en) 2005-04-21
WO2005034508A1 (ja) 2005-04-14

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