DE60333642D1 - Verbesserte platte für eine elektrostatische wafer-klemmvorrichtung - Google Patents

Verbesserte platte für eine elektrostatische wafer-klemmvorrichtung

Info

Publication number
DE60333642D1
DE60333642D1 DE60333642T DE60333642T DE60333642D1 DE 60333642 D1 DE60333642 D1 DE 60333642D1 DE 60333642 T DE60333642 T DE 60333642T DE 60333642 T DE60333642 T DE 60333642T DE 60333642 D1 DE60333642 D1 DE 60333642D1
Authority
DE
Germany
Prior art keywords
platen
grains
electrically conductive
conductive material
dielectric material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60333642T
Other languages
English (en)
Inventor
Hiroaki Yanagida
Hideaki Matsubara
Yoshiki Okuhara
Shoji Aoki
Naoki Kawashima
Bruce T Williams
Toshio Uehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trek Inc
Original Assignee
Trek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trek Inc filed Critical Trek Inc
Application granted granted Critical
Publication of DE60333642D1 publication Critical patent/DE60333642D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Discharging, Photosensitive Material Shape In Electrophotography (AREA)
DE60333642T 2002-05-01 2003-04-30 Verbesserte platte für eine elektrostatische wafer-klemmvorrichtung Expired - Lifetime DE60333642D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/137,790 US6660665B2 (en) 2002-05-01 2002-05-01 Platen for electrostatic wafer clamping apparatus
PCT/US2003/013459 WO2003094335A1 (en) 2002-05-01 2003-04-30 Improved platen for electrostatic wafer clamping apparatus

Publications (1)

Publication Number Publication Date
DE60333642D1 true DE60333642D1 (de) 2010-09-16

Family

ID=29269158

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60333642T Expired - Lifetime DE60333642D1 (de) 2002-05-01 2003-04-30 Verbesserte platte für eine elektrostatische wafer-klemmvorrichtung

Country Status (10)

Country Link
US (1) US6660665B2 (de)
EP (1) EP1532728B1 (de)
JP (2) JP5058438B2 (de)
KR (1) KR100979684B1 (de)
CN (1) CN100508355C (de)
AT (1) ATE476782T1 (de)
AU (1) AU2003228776A1 (de)
DE (1) DE60333642D1 (de)
HK (1) HK1081735A1 (de)
WO (1) WO2003094335A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4631748B2 (ja) * 2006-03-02 2011-02-16 Ｔｏｔｏ株式会社 静電吸着方法
CN101221893B (zh) * 2007-01-12 2010-05-19 北京北方微电子基地设备工艺研究中心有限责任公司 一种促进半导体晶片上静电电荷消散的方法
JP4976911B2 (ja) * 2007-04-27 2012-07-18 新光電気工業株式会社 静電チャック
US8363378B2 (en) * 2009-02-17 2013-01-29 Intevac, Inc. Method for optimized removal of wafer from electrostatic chuck
JP6052976B2 (ja) * 2012-10-15 2016-12-27 日本タングステン株式会社 静電チャック誘電体層および静電チャック
US20150062772A1 (en) * 2013-08-27 2015-03-05 Varian Semiconductor Equipment Associates, Inc Barrier Layer For Electrostatic Chucks
WO2016081951A1 (en) * 2014-11-23 2016-05-26 M Cubed Technologies Wafer pin chuck fabrication and repair
CN110491819B (zh) * 2018-05-14 2021-11-12 北京北方华创微电子装备有限公司 平衡静电力的方法和静电卡盘
JP7430489B2 (ja) * 2019-01-16 2024-02-13 セメス株式会社 静電チャック、静電チャック装置
KR102234220B1 (ko) * 2020-07-24 2021-03-30 이준호 도전성의 정전척 리프트 핀, 이를 포함하는 정전척 및 이들을 이용한 반도체 생산방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3772748A (en) * 1971-04-16 1973-11-20 Nl Industries Inc Method for forming electrodes and conductors
US4808315A (en) * 1986-04-28 1989-02-28 Asahi Kasei Kogyo Kabushiki Kaisha Porous hollow fiber membrane and a method for the removal of a virus by using the same
JPH0521584A (ja) * 1991-07-16 1993-01-29 Nikon Corp 保持装置
US5691876A (en) * 1995-01-31 1997-11-25 Applied Materials, Inc. High temperature polyimide electrostatic chuck
JP3887842B2 (ja) * 1995-03-17 2007-02-28 東京エレクトロン株式会社 ステージ装置
JPH0945753A (ja) * 1995-07-28 1997-02-14 Kyocera Corp 物品保持装置
US6399143B1 (en) * 1996-04-09 2002-06-04 Delsys Pharmaceutical Corporation Method for clamping and electrostatically coating a substrate
US5754391A (en) * 1996-05-17 1998-05-19 Saphikon Inc. Electrostatic chuck
JP4256483B2 (ja) * 1996-07-19 2009-04-22 アプライド マテリアルズ インコーポレイテッド 静電チャック、集積回路デバイスを製造するための装置、及び静電チャックの製造方法
JPH11168134A (ja) * 1997-12-03 1999-06-22 Shin Etsu Chem Co Ltd 静電吸着装置およびその製造方法
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
JP2000252351A (ja) * 1999-02-26 2000-09-14 Taiheiyo Cement Corp 静電チャックおよびその製造方法
JP2002016129A (ja) * 2000-06-30 2002-01-18 Taiheiyo Cement Corp 静電チャック
JP2002373769A (ja) * 2001-06-14 2002-12-26 Ibiden Co Ltd ホットプレートユニット
JP4510358B2 (ja) * 2002-03-27 2010-07-21 太平洋セメント株式会社 静電チャックおよびその製造方法

Also Published As

Publication number Publication date
KR100979684B1 (ko) 2010-09-02
CN100508355C (zh) 2009-07-01
CN1663105A (zh) 2005-08-31
EP1532728B1 (de) 2010-08-04
ATE476782T1 (de) 2010-08-15
JP2011176328A (ja) 2011-09-08
AU2003228776A1 (en) 2003-11-17
WO2003094335A1 (en) 2003-11-13
JP5058438B2 (ja) 2012-10-24
US6660665B2 (en) 2003-12-09
EP1532728A4 (de) 2008-07-16
KR20050026385A (ko) 2005-03-15
EP1532728A1 (de) 2005-05-25
HK1081735A1 (en) 2006-05-19
JP2005524247A (ja) 2005-08-11
US20030207596A1 (en) 2003-11-06

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