DE60329738D1 - Verfahren und System zum Drucken von integrierten Schaltungsplänen - Google Patents

Verfahren und System zum Drucken von integrierten Schaltungsplänen

Info

Publication number
DE60329738D1
DE60329738D1 DE60329738T DE60329738T DE60329738D1 DE 60329738 D1 DE60329738 D1 DE 60329738D1 DE 60329738 T DE60329738 T DE 60329738T DE 60329738 T DE60329738 T DE 60329738T DE 60329738 D1 DE60329738 D1 DE 60329738D1
Authority
DE
Germany
Prior art keywords
integrated circuit
circuit diagrams
printing integrated
printing
diagrams
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60329738T
Other languages
English (en)
Inventor
Steven E Ready
William S Wong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Application granted granted Critical
Publication of DE60329738D1 publication Critical patent/DE60329738D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ink Jet (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE60329738T 2002-08-20 2003-08-15 Verfahren und System zum Drucken von integrierten Schaltungsplänen Expired - Lifetime DE60329738D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/224,701 US6890050B2 (en) 2002-08-20 2002-08-20 Method for the printing of homogeneous electronic material with a multi-ejector print head

Publications (1)

Publication Number Publication Date
DE60329738D1 true DE60329738D1 (de) 2009-12-03

Family

ID=31187975

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60329738T Expired - Lifetime DE60329738D1 (de) 2002-08-20 2003-08-15 Verfahren und System zum Drucken von integrierten Schaltungsplänen

Country Status (4)

Country Link
US (7) US6890050B2 (de)
EP (1) EP1392091B1 (de)
JP (1) JP4592267B2 (de)
DE (1) DE60329738D1 (de)

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AUPQ130999A0 (en) * 1999-06-30 1999-07-22 Silverbrook Research Pty Ltd A method and apparatus (IJ47V11)
GB2379413A (en) * 2001-09-10 2003-03-12 Seiko Epson Corp Printhead alignment method
US7085622B2 (en) * 2002-04-19 2006-08-01 Applied Material, Inc. Vision system
US7233841B2 (en) * 2002-04-19 2007-06-19 Applied Materials, Inc. Vision system
US7559619B2 (en) * 2002-08-20 2009-07-14 Palo Alto Research Center Incorporated Digital lithography using real time quality control
US6890050B2 (en) * 2002-08-20 2005-05-10 Palo Alto Research Center Incorporated Method for the printing of homogeneous electronic material with a multi-ejector print head
JP3693050B2 (ja) * 2002-09-24 2005-09-07 セイコーエプソン株式会社 印刷制御装置における印刷位置の調整
US7087444B2 (en) * 2002-12-16 2006-08-08 Palo Alto Research Center Incorporated Method for integration of microelectronic components with microfluidic devices
JP4689159B2 (ja) * 2003-10-28 2011-05-25 株式会社半導体エネルギー研究所 液滴吐出システム
US7309563B2 (en) * 2003-12-19 2007-12-18 Palo Alto Research Center Incorporated Patterning using wax printing and lift off
JP4419015B2 (ja) * 2004-03-04 2010-02-24 リコープリンティングシステムズ株式会社 インクジェット塗布方法及び装置
CN1710489A (zh) * 2004-06-18 2005-12-21 松下电器产业株式会社 药液涂敷装置及药液涂敷方法
US20060123194A1 (en) * 2004-12-02 2006-06-08 Claudio Alex Cukierkopf Variable effective depth write buffer and methods thereof
TW200640596A (en) 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US20060160373A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
US20060158478A1 (en) * 2005-01-14 2006-07-20 Howarth James J Circuit modeling and selective deposition
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US20060176350A1 (en) * 2005-01-14 2006-08-10 Howarth James J Replacement of passive electrical components
JP2006195863A (ja) * 2005-01-17 2006-07-27 Fujitsu Ten Ltd エラー検出装置
TWI412138B (zh) * 2005-01-28 2013-10-11 Semiconductor Energy Lab 半導體裝置，電子裝置，和半導體裝置的製造方法
TWI481024B (zh) 2005-01-28 2015-04-11 Semiconductor Energy Lab 半導體裝置，電子裝置，和半導體裝置的製造方法
US7459400B2 (en) * 2005-07-18 2008-12-02 Palo Alto Research Center Incorporated Patterned structures fabricated by printing mask over lift-off pattern
JP5100070B2 (ja) * 2005-09-22 2012-12-19 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7756600B2 (en) 2005-09-22 2010-07-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US20070068404A1 (en) * 2005-09-29 2007-03-29 Edwin Hirahara Systems and methods for additive deposition of materials onto a substrate
WO2007042966A2 (en) * 2005-10-07 2007-04-19 Koninklijke Philips Electronics N.V. Inkjet device and method for the controlled positioning of droplets of a substance onto a substrate
US7784173B2 (en) * 2005-12-27 2010-08-31 Palo Alto Research Center Incorporated Producing layered structures using printing
US8637138B2 (en) 2005-12-27 2014-01-28 Palo Alto Research Center Incorporated Layered structures on thin substrates
US7816146B2 (en) * 2005-12-27 2010-10-19 Palo Alto Research Center Incorporated Passive electronic devices
US7498119B2 (en) * 2006-01-20 2009-03-03 Palo Alto Research Center Incorporated Process for forming a feature by undercutting a printed mask
US7365022B2 (en) * 2006-01-20 2008-04-29 Palo Alto Research Center Incorporated Additive printed mask process and structures produced thereby
JP5369367B2 (ja) * 2006-03-28 2013-12-18 凸版印刷株式会社 薄膜トランジスタおよびその製造方法
US7384568B2 (en) * 2006-03-31 2008-06-10 Palo Alto Research Center Incorporated Method of forming a darkfield etch mask
US20070289467A1 (en) * 2006-06-16 2007-12-20 Taiwan Semiconductor Manufacturing Co., Ltd. Direct printing lithography system and method
US7347530B2 (en) * 2006-06-22 2008-03-25 Orbotech Ltd Inkjet printing of color filters
US7524015B2 (en) * 2006-12-20 2009-04-28 Palo Alto Research Center Incorporated Method of printing smooth micro-scale features
US7926900B2 (en) * 2006-12-22 2011-04-19 Palo Alto Research Center Incorporated Method of printing with high spot placement accuracy
US7835583B2 (en) * 2006-12-22 2010-11-16 Palo Alto Research Center Incorporated Method of separating vertical and horizontal components of a rasterized image
US8079656B2 (en) * 2006-12-22 2011-12-20 Palo Alto Research Center Incorporated Method for decimation of images
JP5371240B2 (ja) * 2006-12-27 2013-12-18 株式会社半導体エネルギー研究所 配線の作製方法
US9164037B2 (en) * 2007-01-26 2015-10-20 Palo Alto Research Center Incorporated Method and system for evaluation of signals received from spatially modulated excitation and emission to accurately determine particle positions and distances
US8821799B2 (en) * 2007-01-26 2014-09-02 Palo Alto Research Center Incorporated Method and system implementing spatially modulated excitation or emission for particle characterization with enhanced sensitivity
GB2446884B (en) * 2007-02-20 2012-02-01 Dtg Int Gmbh Screen printing machine
TWI327047B (en) * 2007-03-21 2010-07-01 Ind Tech Res Inst Method for calculating ink-jet printing data
US8968985B2 (en) * 2007-03-30 2015-03-03 Palo Alto Research Center Incorporated Method and system for patterning a mask layer
DE102007019073A1 (de) * 2007-04-23 2008-11-06 Ekra Automatisierungssysteme Gmbh Asys Group Verfahren und Vorrichtung zum Aufbringen von Medien auf flächige Substrate
US7681986B2 (en) * 2007-06-12 2010-03-23 Applied Materials, Inc. Methods and apparatus for depositing ink onto substrates
US7955783B2 (en) * 2007-11-09 2011-06-07 Palo Alto Research Center Incorporated Lamination for printed photomask
US8551556B2 (en) * 2007-11-20 2013-10-08 Palo Alto Research Center Incorporated Method for obtaining controlled sidewall profile in print-patterned structures
US20090139868A1 (en) * 2007-12-03 2009-06-04 Palo Alto Research Center Incorporated Method of Forming Conductive Lines and Similar Features
US8765226B2 (en) 2007-12-13 2014-07-01 Palo Alto Research Center Incorporated Method for patterning using phase-change material
US20090155732A1 (en) * 2007-12-13 2009-06-18 Palo Alto Research Center Incorporated Method for Patterning Using Phase-Change Material
US8373860B2 (en) 2008-02-01 2013-02-12 Palo Alto Research Center Incorporated Transmitting/reflecting emanating light with time variation
US8629981B2 (en) 2008-02-01 2014-01-14 Palo Alto Research Center Incorporated Analyzers with time variation based on color-coded spatial modulation
US20100112220A1 (en) * 2008-11-03 2010-05-06 Molecular Imprints, Inc. Dispense system set-up and characterization
US20100214338A1 (en) * 2009-02-26 2010-08-26 Hewlett-Packard Development Company, L.P. Compensation for thermal distortion in a printing system
JP5251609B2 (ja) * 2009-03-03 2013-07-31 株式会社リコー 記録装置、制御方法及びプログラム
JP5245943B2 (ja) * 2009-03-13 2013-07-24 株式会社リコー 記録装置、制御方法及びプログラム
US8322811B2 (en) * 2009-12-17 2012-12-04 Ricoh Production Print Solutions LLC Multi-pass calibration in fixed printhead array printers
US9156204B2 (en) * 2010-05-17 2015-10-13 Synerdyne Corporation Hybrid scanner fabricator
KR20130100312A (ko) 2010-09-14 2013-09-10 피피지 인더스트리즈 오하이오 인코포레이티드 내탄도 용도를 위한 저밀도 및 고강도 섬유 유리
JP5923935B2 (ja) * 2010-11-25 2016-05-25 セイコーエプソン株式会社 液体吐出装置、及び、液体吐出方法
ES2777174T3 (es) * 2011-04-17 2020-08-04 Stratasys Ltd Sistema y método para la fabricación aditiva de un objeto
US8723140B2 (en) 2011-08-09 2014-05-13 Palo Alto Research Center Incorporated Particle analyzer with spatial modulation and long lifetime bioprobes
US9029800B2 (en) 2011-08-09 2015-05-12 Palo Alto Research Center Incorporated Compact analyzer with spatial modulation and multiple intensity modulated excitation sources
US20130084404A1 (en) * 2011-09-30 2013-04-04 Semes Co., Ltd. Apparatuses and methods for treating substrate
US20130133574A1 (en) * 2011-11-29 2013-05-30 Illinois Tool Works Inc. Material deposition system for depositing materials on a substrate
US20130136850A1 (en) * 2011-11-29 2013-05-30 Illinois Tool Works Inc. Method for depositing materials on a substrate
CN106985520B (zh) * 2012-01-02 2019-12-06 穆特拉茨国际有限公司 虚拟平面
NL2008066C2 (en) * 2012-01-02 2013-07-03 Mutracx B V Method and inkjet system for printing an ink pattern on a substrate.
CN103386821A (zh) * 2012-05-11 2013-11-13 四川优的科技有限公司 流水线打标信息采集系统
US9484309B2 (en) * 2012-08-06 2016-11-01 Sharp Kabushiki Kaisha Light emitting device and method for manufacturing light emitting device
US9411779B2 (en) * 2012-09-28 2016-08-09 Illinois Tool Works Inc. Method of dispensing material based on edge detection
KR20140093109A (ko) * 2013-01-17 2014-07-25 삼성디스플레이 주식회사 인쇄 장치
US9591268B2 (en) * 2013-03-15 2017-03-07 Qiagen Waltham, Inc. Flow cell alignment methods and systems
US20150104562A1 (en) * 2013-10-10 2015-04-16 Omega Optics, Inc. Method Of Manufacturing Multilayer Interconnects For Printed Electronic Systems
JP2014064022A (ja) * 2013-11-11 2014-04-10 Canon Inc インプリント装置
US10548231B2 (en) 2013-11-29 2020-01-28 Botfactory Inc. Apparatus for depositing conductive and nonconductive material to form a printed circuit
WO2015081347A1 (en) 2013-11-29 2015-06-04 Michael Knox Apparatus and method for the manufacturing of printed wiring boards and component attachment
WO2015095991A1 (zh) * 2013-12-23 2015-07-02 北京美科艺数码科技发展有限公司 喷墨打印装置及打印方法
US10082417B2 (en) * 2013-12-30 2018-09-25 Nordson Corporation Calibration methods for a viscous fluid dispensing system
WO2015107789A1 (ja) * 2014-01-16 2015-07-23 コニカミノルタ株式会社 二次元画像形成装置、三次元造形装置、二次元画像形成方法および三次元造形方法
JP6691488B2 (ja) 2014-06-17 2020-04-28 カティーバ， インコーポレイテッド 印刷システムアセンブリおよび方法
CN104376178A (zh) * 2014-11-25 2015-02-25 中国兵器工业集团第二一四研究所苏州研发中心 一种集成电路布图登记所需图层的制作方法
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
US9991412B2 (en) * 2014-12-05 2018-06-05 Solarcity Corporation Systems for precision application of conductive adhesive paste on photovoltaic structures
US10386799B2 (en) 2015-05-05 2019-08-20 Palo Alto Research Center Incorporated Method and system for defining a 3D printed object
US9566799B1 (en) * 2015-10-14 2017-02-14 Funai Electric Co., Ltd. (Jp) Imaging apparatus and method for reducing banding
EP3436236A4 (de) 2016-07-27 2019-11-27 Hewlett-Packard Development Company, L.P. Herstellung von dreidimensionalen (3d) elektronischen bauteilen
CN106739501B (zh) * 2017-02-03 2018-06-29 盐城工学院 一种喷印机及印制电路板喷印系统
WO2019140423A1 (en) * 2018-01-15 2019-07-18 Tokyo Electron Limited System and method for fluid dispense and coverage control
CN110065317A (zh) * 2019-04-29 2019-07-30 南通东川数码科技有限公司 一种自打印光栅定位系统及打印方法
CN114683729B (zh) * 2022-06-01 2022-08-26 芯体素(杭州)科技发展有限公司 一种Mini-LED背光板反射层的打印方法及装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2839534B2 (ja) 1989-02-28 1998-12-16 株式会社東芝 印刷機および印刷方法
US5689428A (en) * 1990-09-28 1997-11-18 Texas Instruments Incorporated Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture
US5250956A (en) * 1991-10-31 1993-10-05 Hewlett-Packard Company Print cartridge bidirectional alignment in carriage axis
US5404020A (en) * 1993-04-30 1995-04-04 Hewlett-Packard Company Phase plate design for aligning multiple inkjet cartridges by scanning a reference pattern
FR2708233B1 (fr) 1993-07-27 1995-09-01 Matra Communication Procédé et dispositif d'impression par points.
JPH07276630A (ja) * 1994-04-12 1995-10-24 Rohm Co Ltd インクジェットプリントヘッド及びインクジェットプリンタ
US5984470A (en) * 1995-04-20 1999-11-16 Canon Kabushiki Kaisha Apparatus for producing color filter with alignment error detection
JPH09234862A (ja) * 1995-12-26 1997-09-09 Seiko Epson Corp インクジェットプリンタ及びその駆動方法
JP3683983B2 (ja) * 1996-05-15 2005-08-17 キヤノン株式会社 カラーフィルタの製造方法及び製造装置及び表示装置の製造方法及び表示装置を備えた装置の製造方法
JPH1134303A (ja) * 1997-07-15 1999-02-09 Brother Ind Ltd 記録装置
WO1999014050A1 (fr) * 1997-09-12 1999-03-25 Citizen Watch Co. Ltd. Actionnement de tete jet d'encre
US6109722A (en) * 1997-11-17 2000-08-29 Hewlett-Packard Company Ink jet printing system with pen alignment and method
JP4028067B2 (ja) 1998-02-26 2007-12-26 東芝テック株式会社 記録ヘッドの駆動方法
JP4741045B2 (ja) * 1998-03-25 2011-08-03 セイコーエプソン株式会社 電気回路、その製造方法および電気回路製造装置
US6786563B1 (en) * 2001-04-18 2004-09-07 Elesys, Inc. Interleaving apparatus and methods for radial printing
GB9808806D0 (en) * 1998-04-24 1998-06-24 Cambridge Display Tech Ltd Selective deposition of polymer films
DE19842379A1 (de) 1998-09-16 2000-05-11 Tron Elektronik Gmbh F Verfahren zum zweidimensional-gerasterten Herstellen von Schichtstrukturen auf Schaltungsplatinen
US6158344A (en) * 1998-12-03 2000-12-12 Hewlett-Packard Company Linefeed calibration using an integrated optical sensor
US6328418B1 (en) * 1999-08-11 2001-12-11 Hitachi Koki Co., Ltd Print head having array of printing elements for printer
US6386671B1 (en) 1999-12-29 2002-05-14 Hewlett-Packard Company Orientation independent indicia for print media
JP3645776B2 (ja) * 2000-02-24 2005-05-11 武藤工業株式会社 インクジェットプリンタ
US6460958B2 (en) * 2000-02-29 2002-10-08 Minolta Co., Ltd. Three-dimensional object printing apparatus and method
WO2002003322A1 (de) 2000-07-03 2002-01-10 Isa Conductive Microsystems Gmbh Verfahren zum herstellen eines kartenförmigen datenträgers und vorrichtung zur durchführung des verfahrens
JP4182657B2 (ja) * 2000-10-17 2008-11-19 セイコーエプソン株式会社 インクジェット式記録装置
JP3491155B2 (ja) * 2000-11-21 2004-01-26 セイコーエプソン株式会社 材料の吐出方法、及び吐出装置、カラーフィルタの製造方法及び製造装置、液晶装置の製造方法及び製造装置、ｅｌ装置の製造方法及び製造装置
JP3953776B2 (ja) * 2001-01-15 2007-08-08 セイコーエプソン株式会社 材料の吐出装置、及び吐出方法、カラーフィルタの製造装置及び製造方法、液晶装置の製造装置及び製造方法、ｅｌ装置の製造装置及び製造方法
US6478401B1 (en) * 2001-07-06 2002-11-12 Lexmark International, Inc. Method for determining vertical misalignment between printer print heads
US6890050B2 (en) * 2002-08-20 2005-05-10 Palo Alto Research Center Incorporated Method for the printing of homogeneous electronic material with a multi-ejector print head

Also Published As

Publication number Publication date
US7997680B2 (en) 2011-08-16
EP1392091B1 (de) 2009-10-21
US8104863B2 (en) 2012-01-31
US20100231638A1 (en) 2010-09-16
US20090201325A1 (en) 2009-08-13
US7992958B2 (en) 2011-08-09
EP1392091A3 (de) 2004-12-01
US7303244B2 (en) 2007-12-04
JP4592267B2 (ja) 2010-12-01
EP1392091A2 (de) 2004-02-25
US20050142293A1 (en) 2005-06-30
US20040196329A1 (en) 2004-10-07
US6890050B2 (en) 2005-05-10
US7549719B2 (en) 2009-06-23
US20100231636A1 (en) 2010-09-16
US20040036731A1 (en) 2004-02-26
JP2004080041A (ja) 2004-03-11
US7963628B2 (en) 2011-06-21
US20100231637A1 (en) 2010-09-16

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