DE60323521D1 - Fluorierte polymere, die zur verwendung als photoresists geeignet sind, und mikrolithographieverfahren - Google Patents
Fluorierte polymere, die zur verwendung als photoresists geeignet sind, und mikrolithographieverfahrenInfo
- Publication number
- DE60323521D1 DE60323521D1 DE60323521T DE60323521T DE60323521D1 DE 60323521 D1 DE60323521 D1 DE 60323521D1 DE 60323521 T DE60323521 T DE 60323521T DE 60323521 T DE60323521 T DE 60323521T DE 60323521 D1 DE60323521 D1 DE 60323521D1
- Authority
- DE
- Germany
- Prior art keywords
- photoresists
- polymers suitable
- fluorinated polymers
- unit derived
- repeat unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F14/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F14/18—Monomers containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F214/18—Monomers containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F214/18—Monomers containing fluorine
- C08F214/26—Tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/22—Esters containing halogen
- C08F220/24—Esters containing halogen containing perhaloalkyl radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
- C08F232/08—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/12—Hydrolysis
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2800/00—Copolymer characterised by the proportions of the comonomers expressed
- C08F2800/20—Copolymer characterised by the proportions of the comonomers expressed as weight or mass percentages
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40437402P | 2002-08-19 | 2002-08-19 | |
PCT/US2003/026088 WO2004016664A1 (en) | 2002-08-19 | 2003-08-19 | Fluorinated polymers useful as photoresists, and processes for microlithography |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60323521D1 true DE60323521D1 (de) | 2008-10-23 |
Family
ID=31888358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60323521T Expired - Lifetime DE60323521D1 (de) | 2002-08-19 | 2003-08-19 | Fluorierte polymere, die zur verwendung als photoresists geeignet sind, und mikrolithographieverfahren |
Country Status (10)
Country | Link |
---|---|
US (1) | US7312287B2 (de) |
EP (1) | EP1551886B1 (de) |
JP (1) | JP4578971B2 (de) |
KR (1) | KR20050062540A (de) |
CN (1) | CN1675262A (de) |
AT (1) | ATE408173T1 (de) |
AU (1) | AU2003259951A1 (de) |
DE (1) | DE60323521D1 (de) |
TW (1) | TW200403257A (de) |
WO (1) | WO2004016664A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1675262A (zh) * | 2002-08-19 | 2005-09-28 | E·I·内穆尔杜邦公司 | 用作光致抗蚀剂的氟化聚合物和用于微石印术的方法 |
JP5560854B2 (ja) * | 2010-03-31 | 2014-07-30 | Jsr株式会社 | 感放射線性樹脂組成物およびそれに用いる重合体 |
US9388009B2 (en) * | 2010-11-24 | 2016-07-12 | Asahi Glass Co., Ltd. | Sliding member for sheet-shaped recording material detachment, seal ring for automobile, and seal ring and sliding member for industrial gas compressor |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5229473A (en) * | 1989-07-07 | 1993-07-20 | Daikin Industries Ltd. | Fluorine-containing copolymer and method of preparing the same |
JP4034896B2 (ja) * | 1997-11-19 | 2008-01-16 | 松下電器産業株式会社 | レジスト組成物及びこれを用いたパターン形成方法 |
JPH11265067A (ja) * | 1998-01-16 | 1999-09-28 | Jsr Corp | 感放射線性樹脂組成物 |
AU6056099A (en) * | 1998-09-23 | 2000-04-10 | E.I. Du Pont De Nemours And Company | Photoresists, polymers and processes for microlithography |
AU4678100A (en) * | 1999-05-04 | 2000-11-17 | E.I. Du Pont De Nemours And Company | Fluorinated polymers, photoresists and processes for microlithography |
KR100535149B1 (ko) * | 1999-08-17 | 2005-12-07 | 주식회사 하이닉스반도체 | 신규의 포토레지스트용 공중합체 및 이를 이용한 포토레지스트조성물 |
JP4240786B2 (ja) * | 1999-09-17 | 2009-03-18 | Jsr株式会社 | 感放射線性樹脂組成物 |
US6872503B2 (en) * | 2000-05-05 | 2005-03-29 | E. I. Du Pont De Nemours And Company | Copolymers for photoresists and processes therefor |
EP1246013A3 (de) * | 2001-03-30 | 2003-11-19 | E.I. Du Pont De Nemours And Company | Photoresists, Polymere und Verfahren für die Mikrolithographie |
US6737215B2 (en) * | 2001-05-11 | 2004-05-18 | Clariant Finance (Bvi) Ltd | Photoresist composition for deep ultraviolet lithography |
CN1675262A (zh) * | 2002-08-19 | 2005-09-28 | E·I·内穆尔杜邦公司 | 用作光致抗蚀剂的氟化聚合物和用于微石印术的方法 |
-
2003
- 2003-08-19 CN CNA038189178A patent/CN1675262A/zh active Pending
- 2003-08-19 US US10/523,490 patent/US7312287B2/en not_active Expired - Fee Related
- 2003-08-19 WO PCT/US2003/026088 patent/WO2004016664A1/en active Application Filing
- 2003-08-19 JP JP2004529165A patent/JP4578971B2/ja not_active Expired - Fee Related
- 2003-08-19 DE DE60323521T patent/DE60323521D1/de not_active Expired - Lifetime
- 2003-08-19 EP EP03788676A patent/EP1551886B1/de not_active Expired - Lifetime
- 2003-08-19 AU AU2003259951A patent/AU2003259951A1/en not_active Abandoned
- 2003-08-19 AT AT03788676T patent/ATE408173T1/de not_active IP Right Cessation
- 2003-08-19 KR KR1020057002754A patent/KR20050062540A/ko not_active Application Discontinuation
- 2003-08-19 TW TW092122760A patent/TW200403257A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW200403257A (en) | 2004-03-01 |
US7312287B2 (en) | 2007-12-25 |
CN1675262A (zh) | 2005-09-28 |
EP1551886A4 (de) | 2007-11-14 |
JP2005536589A (ja) | 2005-12-02 |
JP4578971B2 (ja) | 2010-11-10 |
ATE408173T1 (de) | 2008-09-15 |
KR20050062540A (ko) | 2005-06-23 |
EP1551886A1 (de) | 2005-07-13 |
EP1551886B1 (de) | 2008-09-10 |
WO2004016664A1 (en) | 2004-02-26 |
AU2003259951A1 (en) | 2004-03-03 |
US20060166129A1 (en) | 2006-07-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |