DE60320494D1 - MEMS enthaltende Halbleitereinheit - Google Patents
MEMS enthaltende HalbleitereinheitInfo
- Publication number
- DE60320494D1 DE60320494D1 DE60320494T DE60320494T DE60320494D1 DE 60320494 D1 DE60320494 D1 DE 60320494D1 DE 60320494 T DE60320494 T DE 60320494T DE 60320494 T DE60320494 T DE 60320494T DE 60320494 D1 DE60320494 D1 DE 60320494D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor unit
- containing semiconductor
- mems
- mems containing
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
- B81C2203/0707—Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
- B81C2203/0735—Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002272897 | 2002-09-19 | ||
JP2002272897A JP3819820B2 (ja) | 2002-09-19 | 2002-09-19 | 光スイッチ装置の製造方法 |
JP2002272905 | 2002-09-19 | ||
JP2002272905 | 2002-09-19 | ||
JP2002297835 | 2002-10-10 | ||
JP2002297835 | 2002-10-10 | ||
JP2002319478A JP3833988B2 (ja) | 2002-11-01 | 2002-11-01 | 光スイッチ装置 |
JP2002319478 | 2002-11-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60320494D1 true DE60320494D1 (de) | 2008-06-05 |
DE60320494T2 DE60320494T2 (de) | 2009-05-28 |
Family
ID=31950742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60320494T Expired - Lifetime DE60320494T2 (de) | 2002-09-19 | 2003-09-18 | MEMS enthaltende Halbleitereinheit |
Country Status (4)
Country | Link |
---|---|
US (2) | US7208809B2 (de) |
EP (1) | EP1400487B1 (de) |
CN (1) | CN100356566C (de) |
DE (1) | DE60320494T2 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7190509B2 (en) * | 2001-11-07 | 2007-03-13 | Trex Enterprises Corp. | Optically addressed MEMS |
US6951769B2 (en) * | 2003-06-04 | 2005-10-04 | Texas Instruments Incorporated | Method for stripping sacrificial layer in MEMS assembly |
ES2246693B1 (es) * | 2003-11-18 | 2006-11-01 | Baolab Microsystems S.L. | Circuito integrado con matriz de conexion analogica. |
NL1025523C2 (nl) * | 2004-02-19 | 2005-08-22 | Iku Holding Montfoort Bv | Mechatronisch regelsysteem. |
US20050225412A1 (en) * | 2004-03-31 | 2005-10-13 | Limcangco Naomi O | Microelectromechanical switch with an arc reduction environment |
US20060280202A1 (en) * | 2005-06-13 | 2006-12-14 | Analog Devices, Inc. | MEMS sensor with configuration module |
US7640805B2 (en) * | 2006-12-18 | 2010-01-05 | Akustica, Inc. | Proof-mass with supporting structure on integrated circuit-MEMS platform |
TW200919593A (en) * | 2007-10-18 | 2009-05-01 | Asia Pacific Microsystems Inc | Elements and modules with micro caps and wafer level packaging method thereof |
US8482843B2 (en) * | 2008-02-29 | 2013-07-09 | Nippon Telegraph And Telephone Corporation | MEMS device and method of manufacturing the same |
US8872287B2 (en) | 2008-03-27 | 2014-10-28 | United Microelectronics Corp. | Integrated structure for MEMS device and semiconductor device and method of fabricating the same |
TW200947508A (en) * | 2008-05-13 | 2009-11-16 | Univ Nat Chiao Tung | Integration structure of semiconductor circuit and microprobe sensing elements and method for fabricating the same |
US8658452B2 (en) * | 2008-07-09 | 2014-02-25 | The Royal Institution For The Advancement Of Learning / Mcgill University | Low temperature ceramic microelectromechanical structures |
DE102008041178B4 (de) | 2008-08-12 | 2018-11-15 | Robert Bosch Gmbh | Herstellungsverfahren für ein mikromechanisches Bauteil |
US8368490B2 (en) * | 2008-12-18 | 2013-02-05 | Analog Devices, Inc. | Micro-electro-mechanical switch beam construction with minimized beam distortion and method for constructing |
US8294539B2 (en) * | 2008-12-18 | 2012-10-23 | Analog Devices, Inc. | Micro-electro-mechanical switch beam construction with minimized beam distortion and method for constructing |
US8797279B2 (en) | 2010-05-25 | 2014-08-05 | MCube Inc. | Analog touchscreen methods and apparatus |
US8928602B1 (en) | 2009-03-03 | 2015-01-06 | MCube Inc. | Methods and apparatus for object tracking on a hand-held device |
US8421082B1 (en) | 2010-01-19 | 2013-04-16 | Mcube, Inc. | Integrated CMOS and MEMS with air dielectric method and system |
US8823007B2 (en) | 2009-10-28 | 2014-09-02 | MCube Inc. | Integrated system on chip using multiple MEMS and CMOS devices |
US8476129B1 (en) | 2010-05-24 | 2013-07-02 | MCube Inc. | Method and structure of sensors and MEMS devices using vertical mounting with interconnections |
US8477473B1 (en) | 2010-08-19 | 2013-07-02 | MCube Inc. | Transducer structure and method for MEMS devices |
US8553389B1 (en) | 2010-08-19 | 2013-10-08 | MCube Inc. | Anchor design and method for MEMS transducer apparatuses |
US8710597B1 (en) | 2010-04-21 | 2014-04-29 | MCube Inc. | Method and structure for adding mass with stress isolation to MEMS structures |
US8102637B2 (en) * | 2009-07-22 | 2012-01-24 | Analog Devices, Inc. | Control techniques for electrostatic microelectromechanical (MEM) structure |
TWI388038B (zh) * | 2009-07-23 | 2013-03-01 | Ind Tech Res Inst | 感測元件結構與製造方法 |
US8587328B2 (en) | 2009-08-25 | 2013-11-19 | Analog Devices, Inc. | Automatic characterization of an actuator based on capacitance measurement |
US9709509B1 (en) * | 2009-11-13 | 2017-07-18 | MCube Inc. | System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process |
US8637943B1 (en) | 2010-01-04 | 2014-01-28 | MCube Inc. | Multi-axis integrated MEMS devices with CMOS circuits and method therefor |
US8936959B1 (en) | 2010-02-27 | 2015-01-20 | MCube Inc. | Integrated rf MEMS, control systems and methods |
US8794065B1 (en) | 2010-02-27 | 2014-08-05 | MCube Inc. | Integrated inertial sensing apparatus using MEMS and quartz configured on crystallographic planes |
US8367522B1 (en) | 2010-04-08 | 2013-02-05 | MCube Inc. | Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads |
US8928696B1 (en) | 2010-05-25 | 2015-01-06 | MCube Inc. | Methods and apparatus for operating hysteresis on a hand held device |
US8869616B1 (en) | 2010-06-18 | 2014-10-28 | MCube Inc. | Method and structure of an inertial sensor using tilt conversion |
US8652961B1 (en) | 2010-06-18 | 2014-02-18 | MCube Inc. | Methods and structure for adapting MEMS structures to form electrical interconnections for integrated circuits |
US8993362B1 (en) | 2010-07-23 | 2015-03-31 | MCube Inc. | Oxide retainer method for MEMS devices |
US8723986B1 (en) | 2010-11-04 | 2014-05-13 | MCube Inc. | Methods and apparatus for initiating image capture on a hand-held device |
US8969101B1 (en) | 2011-08-17 | 2015-03-03 | MCube Inc. | Three axis magnetic sensor device and method using flex cables |
EP2805199B1 (de) * | 2012-01-20 | 2017-05-03 | IMEC vzw | Asymmetrische neigung für mikrospiegelanordnungen |
US10209511B2 (en) | 2012-09-12 | 2019-02-19 | C. Anthony Hester | Spatial light modulator for actuating microelectromechanical systems (MEMS) structures |
JP5952850B2 (ja) | 2014-03-31 | 2016-07-13 | 株式会社豊田中央研究所 | Memsデバイス |
US20160004068A1 (en) * | 2014-07-02 | 2016-01-07 | Himax Display, Inc. | Micro-mirror device and method for driving mirror thereof |
CN105334625A (zh) * | 2014-08-15 | 2016-02-17 | 立景光电股份有限公司 | 微镜面组件以及用于驱动其镜面的方法 |
US10167933B1 (en) | 2015-03-20 | 2019-01-01 | C. Anthony Hester | Actuator systems and methods |
GB201621911D0 (en) | 2016-12-21 | 2017-02-01 | Sofant Tech Ltd | Antenna array |
CN109141216A (zh) * | 2018-09-17 | 2019-01-04 | 江苏师范大学 | 一种基于单片机的电阻应变仪 |
WO2022112037A1 (en) * | 2020-11-30 | 2022-06-02 | Asml Netherlands B.V. | Mems array interconnection design |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2924200B2 (ja) | 1990-01-18 | 1999-07-26 | 富士電機株式会社 | ねじり振動子およびその応用素子 |
US5018256A (en) | 1990-06-29 | 1991-05-28 | Texas Instruments Incorporated | Architecture and process for integrating DMD with control circuit substrates |
US5285196A (en) | 1992-10-15 | 1994-02-08 | Texas Instruments Incorporated | Bistable DMD addressing method |
US6087930A (en) * | 1994-02-22 | 2000-07-11 | Computer Methods Corporation | Active integrated circuit transponder and sensor apparatus for transmitting vehicle tire parameter data |
EP0670521A1 (de) * | 1994-02-28 | 1995-09-06 | Toray Industries, Inc. | Fotoempfindliche Harzzusammensetzung und ihr Herstellungsverfahren |
JP3787879B2 (ja) | 1996-02-29 | 2006-06-21 | セイコーエプソン株式会社 | 空間光変調器の製造方法 |
DE19712201A1 (de) * | 1997-03-24 | 1998-10-01 | Bodenseewerk Geraetetech | Mikromechanische Spiegel-Anordnung |
US6200882B1 (en) * | 1998-06-10 | 2001-03-13 | Seagate Technology, Inc. | Method for processing a plurality of micro-machined mirror assemblies |
US6022756A (en) * | 1998-07-31 | 2000-02-08 | Delco Electronics Corp. | Metal diaphragm sensor with polysilicon sensing elements and methods therefor |
JP3065611B1 (ja) | 1999-05-28 | 2000-07-17 | 三菱電機株式会社 | マイクロミラ―装置およびその製造方法 |
MY125299A (en) | 1999-09-15 | 2006-07-31 | Ericsson Inc | Methods and systems for specifying a quality of service for communication between a mobile station and a packet wireless communications network based upon an application that is executing on the mobile station. |
US6275326B1 (en) * | 1999-09-21 | 2001-08-14 | Lucent Technologies Inc. | Control arrangement for microelectromechanical devices and systems |
EP1093143A1 (de) | 1999-10-15 | 2001-04-18 | Lucent Technologies Inc. | Flip-chip montiertes Mikrorelais auf einer integrierten Schaltung |
US20020071169A1 (en) * | 2000-02-01 | 2002-06-13 | Bowers John Edward | Micro-electro-mechanical-system (MEMS) mirror device |
JP2001311900A (ja) | 2000-04-27 | 2001-11-09 | Ricoh Co Ltd | 光走査装置 |
US20020110312A1 (en) * | 2000-07-20 | 2002-08-15 | Nayna Networks, Inc. | Integrated mirror array and circuit device with improved electrode configuration |
US6300665B1 (en) * | 2000-09-28 | 2001-10-09 | Xerox Corporation | Structure for an optical switch on a silicon on insulator substrate |
US6522801B1 (en) * | 2000-10-10 | 2003-02-18 | Agere Systems Inc. | Micro-electro-optical mechanical device having an implanted dopant included therein and a method of manufacture therefor |
JP2002169008A (ja) | 2000-11-30 | 2002-06-14 | Olympus Optical Co Ltd | 可変形状鏡 |
JP4560958B2 (ja) | 2000-12-21 | 2010-10-13 | 日本テキサス・インスツルメンツ株式会社 | マイクロ・エレクトロ・メカニカル・システム |
US7437071B2 (en) * | 2001-03-18 | 2008-10-14 | Cisco Technology, Inc. | Distributive optical switching control system |
US6504385B2 (en) * | 2001-05-31 | 2003-01-07 | Hewlett-Pakcard Company | Three-axis motion sensor |
US7203393B2 (en) * | 2002-03-08 | 2007-04-10 | Movaz Networks, Inc. | MEMS micro mirrors driven by electrodes fabricated on another substrate |
US6912336B2 (en) * | 2002-03-15 | 2005-06-28 | Nippon Telegraph And Telephone Corporation | Optical switch device |
US20030227035A1 (en) * | 2002-06-05 | 2003-12-11 | Hiromu Ishii | Micromachine and manufacturing method therefor |
US20040121505A1 (en) * | 2002-09-30 | 2004-06-24 | Magfusion, Inc. | Method for fabricating a gold contact on a microswitch |
US6844214B1 (en) * | 2003-08-21 | 2005-01-18 | Xerox, Corporation | Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication |
-
2003
- 2003-09-17 US US10/664,258 patent/US7208809B2/en not_active Expired - Fee Related
- 2003-09-18 EP EP03090304A patent/EP1400487B1/de not_active Expired - Lifetime
- 2003-09-18 DE DE60320494T patent/DE60320494T2/de not_active Expired - Lifetime
- 2003-09-19 CN CNB031586473A patent/CN100356566C/zh not_active Expired - Fee Related
-
2006
- 2006-01-11 US US11/330,951 patent/US7482196B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100356566C (zh) | 2007-12-19 |
US7208809B2 (en) | 2007-04-24 |
CN1492508A (zh) | 2004-04-28 |
US20060115920A1 (en) | 2006-06-01 |
US7482196B2 (en) | 2009-01-27 |
EP1400487B1 (de) | 2008-04-23 |
DE60320494T2 (de) | 2009-05-28 |
EP1400487A3 (de) | 2004-11-17 |
US20040063325A1 (en) | 2004-04-01 |
EP1400487A2 (de) | 2004-03-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |