DE60320494D1 - MEMS enthaltende Halbleitereinheit - Google Patents

MEMS enthaltende Halbleitereinheit

Info

Publication number
DE60320494D1
DE60320494D1 DE60320494T DE60320494T DE60320494D1 DE 60320494 D1 DE60320494 D1 DE 60320494D1 DE 60320494 T DE60320494 T DE 60320494T DE 60320494 T DE60320494 T DE 60320494T DE 60320494 D1 DE60320494 D1 DE 60320494D1
Authority
DE
Germany
Prior art keywords
semiconductor unit
containing semiconductor
mems
mems containing
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60320494T
Other languages
English (en)
Other versions
DE60320494T2 (de
Inventor
Urano Masami
Ishii Hiromu
Shimamura Toshishige
Tanabe Yasuyuki
Machida Katsuyuki
Sakata Tomomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002272897A external-priority patent/JP3819820B2/ja
Priority claimed from JP2002319478A external-priority patent/JP3833988B2/ja
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Publication of DE60320494D1 publication Critical patent/DE60320494D1/de
Application granted granted Critical
Publication of DE60320494T2 publication Critical patent/DE60320494T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00Forming microstructural systems
    • B81C2203/07Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0707Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure
    • B81C2203/0735Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
DE60320494T 2002-09-19 2003-09-18 MEMS enthaltende Halbleitereinheit Expired - Lifetime DE60320494T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2002272897 2002-09-19
JP2002272897A JP3819820B2 (ja) 2002-09-19 2002-09-19 光スイッチ装置の製造方法
JP2002272905 2002-09-19
JP2002272905 2002-09-19
JP2002297835 2002-10-10
JP2002297835 2002-10-10
JP2002319478A JP3833988B2 (ja) 2002-11-01 2002-11-01 光スイッチ装置
JP2002319478 2002-11-01

Publications (2)

Publication Number Publication Date
DE60320494D1 true DE60320494D1 (de) 2008-06-05
DE60320494T2 DE60320494T2 (de) 2009-05-28

Family

ID=31950742

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60320494T Expired - Lifetime DE60320494T2 (de) 2002-09-19 2003-09-18 MEMS enthaltende Halbleitereinheit

Country Status (4)

Country Link
US (2) US7208809B2 (de)
EP (1) EP1400487B1 (de)
CN (1) CN100356566C (de)
DE (1) DE60320494T2 (de)

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US8658452B2 (en) * 2008-07-09 2014-02-25 The Royal Institution For The Advancement Of Learning / Mcgill University Low temperature ceramic microelectromechanical structures
DE102008041178B4 (de) 2008-08-12 2018-11-15 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches Bauteil
US8368490B2 (en) * 2008-12-18 2013-02-05 Analog Devices, Inc. Micro-electro-mechanical switch beam construction with minimized beam distortion and method for constructing
US8294539B2 (en) * 2008-12-18 2012-10-23 Analog Devices, Inc. Micro-electro-mechanical switch beam construction with minimized beam distortion and method for constructing
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US8928602B1 (en) 2009-03-03 2015-01-06 MCube Inc. Methods and apparatus for object tracking on a hand-held device
US8421082B1 (en) 2010-01-19 2013-04-16 Mcube, Inc. Integrated CMOS and MEMS with air dielectric method and system
US8823007B2 (en) 2009-10-28 2014-09-02 MCube Inc. Integrated system on chip using multiple MEMS and CMOS devices
US8476129B1 (en) 2010-05-24 2013-07-02 MCube Inc. Method and structure of sensors and MEMS devices using vertical mounting with interconnections
US8477473B1 (en) 2010-08-19 2013-07-02 MCube Inc. Transducer structure and method for MEMS devices
US8553389B1 (en) 2010-08-19 2013-10-08 MCube Inc. Anchor design and method for MEMS transducer apparatuses
US8710597B1 (en) 2010-04-21 2014-04-29 MCube Inc. Method and structure for adding mass with stress isolation to MEMS structures
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US8587328B2 (en) 2009-08-25 2013-11-19 Analog Devices, Inc. Automatic characterization of an actuator based on capacitance measurement
US9709509B1 (en) * 2009-11-13 2017-07-18 MCube Inc. System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process
US8637943B1 (en) 2010-01-04 2014-01-28 MCube Inc. Multi-axis integrated MEMS devices with CMOS circuits and method therefor
US8936959B1 (en) 2010-02-27 2015-01-20 MCube Inc. Integrated rf MEMS, control systems and methods
US8794065B1 (en) 2010-02-27 2014-08-05 MCube Inc. Integrated inertial sensing apparatus using MEMS and quartz configured on crystallographic planes
US8367522B1 (en) 2010-04-08 2013-02-05 MCube Inc. Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads
US8928696B1 (en) 2010-05-25 2015-01-06 MCube Inc. Methods and apparatus for operating hysteresis on a hand held device
US8869616B1 (en) 2010-06-18 2014-10-28 MCube Inc. Method and structure of an inertial sensor using tilt conversion
US8652961B1 (en) 2010-06-18 2014-02-18 MCube Inc. Methods and structure for adapting MEMS structures to form electrical interconnections for integrated circuits
US8993362B1 (en) 2010-07-23 2015-03-31 MCube Inc. Oxide retainer method for MEMS devices
US8723986B1 (en) 2010-11-04 2014-05-13 MCube Inc. Methods and apparatus for initiating image capture on a hand-held device
US8969101B1 (en) 2011-08-17 2015-03-03 MCube Inc. Three axis magnetic sensor device and method using flex cables
EP2805199B1 (de) * 2012-01-20 2017-05-03 IMEC vzw Asymmetrische neigung für mikrospiegelanordnungen
US10209511B2 (en) 2012-09-12 2019-02-19 C. Anthony Hester Spatial light modulator for actuating microelectromechanical systems (MEMS) structures
JP5952850B2 (ja) 2014-03-31 2016-07-13 株式会社豊田中央研究所 Memsデバイス
US20160004068A1 (en) * 2014-07-02 2016-01-07 Himax Display, Inc. Micro-mirror device and method for driving mirror thereof
CN105334625A (zh) * 2014-08-15 2016-02-17 立景光电股份有限公司 微镜面组件以及用于驱动其镜面的方法
US10167933B1 (en) 2015-03-20 2019-01-01 C. Anthony Hester Actuator systems and methods
GB201621911D0 (en) 2016-12-21 2017-02-01 Sofant Tech Ltd Antenna array
CN109141216A (zh) * 2018-09-17 2019-01-04 江苏师范大学 一种基于单片机的电阻应变仪
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Also Published As

Publication number Publication date
CN100356566C (zh) 2007-12-19
US7208809B2 (en) 2007-04-24
CN1492508A (zh) 2004-04-28
US20060115920A1 (en) 2006-06-01
US7482196B2 (en) 2009-01-27
EP1400487B1 (de) 2008-04-23
DE60320494T2 (de) 2009-05-28
EP1400487A3 (de) 2004-11-17
US20040063325A1 (en) 2004-04-01
EP1400487A2 (de) 2004-03-24

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