DE60319988T2 - Verfahren zur Herstellung einer Mikrostruktur - Google Patents
Verfahren zur Herstellung einer Mikrostruktur Download PDFInfo
- Publication number
- DE60319988T2 DE60319988T2 DE60319988T DE60319988T DE60319988T2 DE 60319988 T2 DE60319988 T2 DE 60319988T2 DE 60319988 T DE60319988 T DE 60319988T DE 60319988 T DE60319988 T DE 60319988T DE 60319988 T2 DE60319988 T2 DE 60319988T2
- Authority
- DE
- Germany
- Prior art keywords
- molding
- manufacturing
- carrier
- substrate
- microstructure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 50
- 238000000465 moulding Methods 0.000 claims abstract description 83
- 239000000463 material Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims description 30
- 239000011248 coating agent Substances 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 20
- 239000012778 molding material Substances 0.000 claims description 17
- -1 polyethylene terephthalate Polymers 0.000 claims description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 8
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 claims description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 238000005273 aeration Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 20
- 239000010410 layer Substances 0.000 description 41
- 239000002985 plastic film Substances 0.000 description 39
- 229920006255 plastic film Polymers 0.000 description 37
- 239000005357 flat glass Substances 0.000 description 27
- 229910052751 metal Inorganic materials 0.000 description 25
- 239000002184 metal Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 21
- 239000007858 starting material Substances 0.000 description 20
- 238000010030 laminating Methods 0.000 description 19
- 229920002799 BoPET Polymers 0.000 description 13
- 239000011521 glass Substances 0.000 description 10
- 238000005192 partition Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000003570 air Substances 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002996 emotional effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
- H01J9/242—Spacers between faceplate and backplate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/40—Plastics, e.g. foam or rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2217/00—Gas-filled discharge tubes
- H01J2217/38—Cold-cathode tubes
- H01J2217/49—Display panels, e.g. not making use of alternating current
- H01J2217/492—Details
- H01J2217/49264—Vessels
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Lubricants (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002208326A JP3986386B2 (ja) | 2002-07-17 | 2002-07-17 | 微細構造体の製造方法 |
| JP2002208326 | 2002-07-17 | ||
| PCT/US2003/019495 WO2004010452A2 (en) | 2002-07-17 | 2003-06-20 | Flexible mold and method of manufacturing microstructure using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60319988D1 DE60319988D1 (de) | 2008-05-08 |
| DE60319988T2 true DE60319988T2 (de) | 2009-04-16 |
Family
ID=30767670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60319988T Expired - Lifetime DE60319988T2 (de) | 2002-07-17 | 2003-06-20 | Verfahren zur Herstellung einer Mikrostruktur |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20050212182A1 (https=) |
| EP (1) | EP1525079B9 (https=) |
| JP (1) | JP3986386B2 (https=) |
| KR (1) | KR100951278B1 (https=) |
| CN (1) | CN1668435B (https=) |
| AT (1) | ATE390260T1 (https=) |
| AU (1) | AU2003245601A1 (https=) |
| CA (1) | CA2491415A1 (https=) |
| DE (1) | DE60319988T2 (https=) |
| TW (1) | TWI275465B (https=) |
| WO (1) | WO2004010452A2 (https=) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7361409B2 (en) | 2003-08-22 | 2008-04-22 | 3M Innovative Properties Company | Microstructured article comprising a polymerized composition having low glass transition temperature |
| JP2005066836A (ja) * | 2003-08-22 | 2005-03-17 | Three M Innovative Properties Co | 可とう性成形型及びその製造方法ならびに微細構造体の製造方法 |
| US7288013B2 (en) | 2003-10-31 | 2007-10-30 | 3M Innovative Properties Company | Method of forming microstructures on a substrate and a microstructured assembly used for same |
| JP2005288933A (ja) * | 2004-04-01 | 2005-10-20 | Three M Innovative Properties Co | 可とう性成形型及びその製造方法 |
| JP2008511124A (ja) | 2004-08-26 | 2008-04-10 | スリーエム イノベイティブ プロパティズ カンパニー | テンプレートで微細構造を形成する方法 |
| KR100697197B1 (ko) * | 2004-12-29 | 2007-03-21 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널 |
| JP4773729B2 (ja) * | 2005-02-28 | 2011-09-14 | キヤノン株式会社 | 転写装置およびデバイス製造方法 |
| US7478791B2 (en) | 2005-04-15 | 2009-01-20 | 3M Innovative Properties Company | Flexible mold comprising cured polymerizable resin composition |
| KR100744573B1 (ko) * | 2005-04-21 | 2007-08-01 | 미래나노텍(주) | 플라즈마 디스플레이 패널 |
| JP4455488B2 (ja) * | 2005-12-19 | 2010-04-21 | 三菱電機株式会社 | 半導体装置 |
| KR100822043B1 (ko) * | 2006-06-29 | 2008-04-15 | 주식회사 싸이노스 | 플렉시블 플라즈마 디스플레이 패널의 제조 방법 |
| CN101501809A (zh) * | 2006-08-14 | 2009-08-05 | 3M创新有限公司 | 具有表面改性的非模制区域的模具 |
| US20080093776A1 (en) * | 2006-10-05 | 2008-04-24 | 3M Innovative Properties Company | Method of molding ultraviolet cured microstructures and molds |
| WO2008073719A1 (en) * | 2006-12-07 | 2008-06-19 | 3M Innovative Properties Company | Method of molding barrier ribs with hygroscopic polymeric molds |
| JP5456465B2 (ja) * | 2007-06-04 | 2014-03-26 | 丸善石油化学株式会社 | 微細加工品およびその製造方法 |
| JP2010218597A (ja) * | 2009-03-13 | 2010-09-30 | Toshiba Corp | パターン転写用樹脂スタンパ、及びこれを用いた磁気記録媒体の製造方法 |
| JP5559574B2 (ja) * | 2010-03-08 | 2014-07-23 | 東芝機械株式会社 | 転写方法 |
| JP5351096B2 (ja) | 2010-06-02 | 2013-11-27 | 日東電工株式会社 | 光導波路の製法 |
| JP5351101B2 (ja) * | 2010-07-05 | 2013-11-27 | 日東電工株式会社 | 光導波路の製法 |
| JP5351102B2 (ja) | 2010-07-05 | 2013-11-27 | 日東電工株式会社 | 光導波路の製法 |
| JP4774125B2 (ja) * | 2010-10-04 | 2011-09-14 | キヤノン株式会社 | 転写装置、型、および、デバイス製造方法 |
| JP5379774B2 (ja) | 2010-10-27 | 2013-12-25 | 日東電工株式会社 | 光導波路の製法 |
| US8875356B2 (en) | 2011-10-06 | 2014-11-04 | Intercontinental Great Brands Llc | Mechanical and adhesive based reclosable fasteners |
| WO2014037044A1 (de) | 2012-09-06 | 2014-03-13 | Ev Group E. Thallner Gmbh | Strukturstempel, vorrichtung und verfahren zum prägen |
| US9480931B1 (en) * | 2012-11-16 | 2016-11-01 | Mattel, Inc. | Building components |
| DE102013107909B4 (de) * | 2013-07-24 | 2015-04-09 | Schott Ag | Verfahren und Anlage zum Einprägen einer Struktur auf einem mit einem Lack beschichteten Substrat |
| WO2018208229A1 (en) * | 2017-05-09 | 2018-11-15 | Heptagon Micro Optics Pte. Ltd. | Method for conditioning a replication tool and related method for manufacturing a multitude of devices |
| CN108908820B (zh) * | 2018-06-19 | 2020-12-25 | 深圳摩方新材科技有限公司 | 一种树脂类光学镜片的制造方法 |
| CN119002173A (zh) * | 2023-05-19 | 2024-11-22 | 香港理工大学 | 板对辊压印设备及在光学玻璃板上加工微纳结构的方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4340709A (en) * | 1980-07-16 | 1982-07-20 | General Electric Company | Addition curing silicone compositions |
| US4912948A (en) * | 1985-03-22 | 1990-04-03 | Union Carbide Chemicals And Plastics Company Inc. | Vacuum guide used in flexible sheet material treatment |
| US4929403A (en) * | 1989-07-25 | 1990-05-29 | Audsley Edwin F | Process for forming multi-layer flexible molds |
| US5462702A (en) * | 1992-02-04 | 1995-10-31 | Slaughter, Jr.; Gibbs M. | Method for resurfacing fiberglass boat hulls |
| JP3128312B2 (ja) * | 1992-02-28 | 2001-01-29 | 株式会社ダイセン工業 | 合成樹脂の発泡成形用金型装置および発泡成形法 |
| US5840465A (en) * | 1995-07-17 | 1998-11-24 | Taiyo Ink Manufacturing Co., Ltd. | Compositions and method for formation of barrier ribs of plasma display panel |
| JP3591910B2 (ja) * | 1995-03-30 | 2004-11-24 | 大日本印刷株式会社 | プラズマディスプレイパネルのセル障壁製造方法 |
| US6251208B1 (en) * | 1996-10-29 | 2001-06-26 | Toshiba Machine Co., Ltd. | Method for manufacturing a structure with fine ribs |
| US6247986B1 (en) * | 1998-12-23 | 2001-06-19 | 3M Innovative Properties Company | Method for precise molding and alignment of structures on a substrate using a stretchable mold |
| US6843952B1 (en) * | 1999-03-25 | 2005-01-18 | 3M Innovative Properties Company | Method of producing substrate for plasma display panel and mold used in the method |
| US6306948B1 (en) * | 1999-10-26 | 2001-10-23 | 3M Innovative Properties Company | Molding composition containing a debinding catalyst for making ceramic microstructures |
| JP4082545B2 (ja) * | 2000-01-11 | 2008-04-30 | スリーエム イノベイティブ プロパティズ カンパニー | プラズマディスプレイパネル用基板を製造するための装置、成形型及び方法 |
| US7176492B2 (en) * | 2001-10-09 | 2007-02-13 | 3M Innovative Properties Company | Method for forming ceramic microstructures on a substrate using a mold and articles formed by the method |
| US7033534B2 (en) * | 2001-10-09 | 2006-04-25 | 3M Innovative Properties Company | Method for forming microstructures on a substrate using a mold |
| JP4326190B2 (ja) * | 2002-07-10 | 2009-09-02 | スリーエム イノベイティブ プロパティズ カンパニー | 可とう性成形型及びその製造方法 |
-
2002
- 2002-07-17 JP JP2002208326A patent/JP3986386B2/ja not_active Expired - Fee Related
-
2003
- 2003-06-20 DE DE60319988T patent/DE60319988T2/de not_active Expired - Lifetime
- 2003-06-20 WO PCT/US2003/019495 patent/WO2004010452A2/en not_active Ceased
- 2003-06-20 AU AU2003245601A patent/AU2003245601A1/en not_active Abandoned
- 2003-06-20 EP EP03739230A patent/EP1525079B9/en not_active Expired - Lifetime
- 2003-06-20 KR KR1020057000763A patent/KR100951278B1/ko not_active Expired - Fee Related
- 2003-06-20 US US10/518,959 patent/US20050212182A1/en not_active Abandoned
- 2003-06-20 CA CA002491415A patent/CA2491415A1/en not_active Abandoned
- 2003-06-20 AT AT03739230T patent/ATE390260T1/de not_active IP Right Cessation
- 2003-06-20 CN CN03816857XA patent/CN1668435B/zh not_active Expired - Fee Related
- 2003-07-01 TW TW092117984A patent/TWI275465B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP1525079B1 (en) | 2008-03-26 |
| TW200408521A (en) | 2004-06-01 |
| EP1525079A2 (en) | 2005-04-27 |
| WO2004010452A2 (en) | 2004-01-29 |
| JP3986386B2 (ja) | 2007-10-03 |
| ATE390260T1 (de) | 2008-04-15 |
| US20050212182A1 (en) | 2005-09-29 |
| WO2004010452A3 (en) | 2004-06-10 |
| KR100951278B1 (ko) | 2010-04-02 |
| DE60319988D1 (de) | 2008-05-08 |
| AU2003245601A8 (en) | 2004-02-09 |
| CN1668435A (zh) | 2005-09-14 |
| TWI275465B (en) | 2007-03-11 |
| KR20050039831A (ko) | 2005-04-29 |
| AU2003245601A1 (en) | 2004-02-09 |
| EP1525079B9 (en) | 2009-08-26 |
| CN1668435B (zh) | 2010-05-26 |
| CA2491415A1 (en) | 2004-01-29 |
| JP2004050493A (ja) | 2004-02-19 |
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|---|---|---|---|
| 8364 | No opposition during term of opposition |