DE60319314T2 - Herstellungsverfahren eines Halbleiterbeugungsgitters - Google Patents

Herstellungsverfahren eines Halbleiterbeugungsgitters Download PDF

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Publication number
DE60319314T2
DE60319314T2 DE60319314T DE60319314T DE60319314T2 DE 60319314 T2 DE60319314 T2 DE 60319314T2 DE 60319314 T DE60319314 T DE 60319314T DE 60319314 T DE60319314 T DE 60319314T DE 60319314 T2 DE60319314 T2 DE 60319314T2
Authority
DE
Germany
Prior art keywords
layer
semiconductor
semiconductor layer
diffraction
growing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60319314T
Other languages
German (de)
English (en)
Other versions
DE60319314D1 (de
Inventor
Michael P. Oregon Nesnidal
David V. Oregon Forbes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Corp
Original Assignee
Northrop Grumman Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northrop Grumman Corp filed Critical Northrop Grumman Corp
Application granted granted Critical
Publication of DE60319314D1 publication Critical patent/DE60319314D1/de
Publication of DE60319314T2 publication Critical patent/DE60319314T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3418—Phosphides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1861—Reflection gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/124—Geodesic lenses or integrated gratings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/27—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
    • H10P14/271—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3421—Arsenides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
    • H01S5/1231—Grating growth or overgrowth details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Semiconductor Lasers (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
DE60319314T 2002-08-01 2003-07-29 Herstellungsverfahren eines Halbleiterbeugungsgitters Expired - Fee Related DE60319314T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US210799 1988-06-24
US10/210,799 US6649439B1 (en) 2002-08-01 2002-08-01 Semiconductor-air gap grating fabrication using a sacrificial layer process

Publications (2)

Publication Number Publication Date
DE60319314D1 DE60319314D1 (de) 2008-04-10
DE60319314T2 true DE60319314T2 (de) 2009-02-26

Family

ID=29420053

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60319314T Expired - Fee Related DE60319314T2 (de) 2002-08-01 2003-07-29 Herstellungsverfahren eines Halbleiterbeugungsgitters

Country Status (4)

Country Link
US (2) US6649439B1 (https=)
EP (1) EP1394911B1 (https=)
JP (1) JP2004133407A (https=)
DE (1) DE60319314T2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6649439B1 (en) * 2002-08-01 2003-11-18 Northrop Grumman Corporation Semiconductor-air gap grating fabrication using a sacrificial layer process
US6944373B2 (en) * 2002-08-01 2005-09-13 Northrop Grumman Corporation High index-step grating fabrication using a regrowth-over-dielectric process
US7116878B2 (en) * 2003-04-24 2006-10-03 Mesophotonics Ltd. Optical waveguide structure
US7251386B1 (en) 2004-01-14 2007-07-31 Luxtera, Inc Integrated photonic-electronic circuits and systems
US7773836B2 (en) 2005-12-14 2010-08-10 Luxtera, Inc. Integrated transceiver with lightpipe coupler
KR100852110B1 (ko) * 2004-06-26 2008-08-13 삼성에스디아이 주식회사 유기 전계 발광 소자 및 그 제조 방법
SG139547A1 (en) * 2004-08-04 2008-02-29 Agency Science Tech & Res Distributed feedback and distributed bragg reflector semiconductor lasers
DE102006036831B9 (de) * 2006-08-07 2016-04-14 Friedrich-Schiller-Universität Jena Verschlossene, binäre Transmissionsgitter
US20090229651A1 (en) * 2008-03-14 2009-09-17 Fay Jr Theodore Denis Solar energy production system
DE102008054217A1 (de) * 2008-10-31 2010-05-06 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
US20110068279A1 (en) * 2009-08-11 2011-03-24 Fay Jr Theodore Denis Ultra dark field microscope
JP5573309B2 (ja) * 2010-04-01 2014-08-20 住友電気工業株式会社 マッハツェンダー型光変調素子
WO2021168853A1 (zh) * 2020-02-29 2021-09-02 华为技术有限公司 一种dfb激光器
PL439368A1 (pl) 2021-10-30 2023-05-02 Instytut Wysokich Ciśnień Polskiej Akademii Nauk Unipress Sposób wytwarzania obszaru o regularnie zmiennym współczynniku załamania światła w wybranej warstwie warstwowej struktury półprzewodnikowej

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0231488A (ja) * 1988-07-20 1990-02-01 Mitsubishi Electric Corp 半導体レーザ装置及びその製造方法
IT1245541B (it) * 1991-05-13 1994-09-29 Cselt Centro Studi Lab Telecom Laser a semiconduttore a reazione distribuita ed accoppiamento di guadagno ,e procedimento per la sua fabbricazione
US5955749A (en) * 1996-12-02 1999-09-21 Massachusetts Institute Of Technology Light emitting device utilizing a periodic dielectric structure
FR2765347B1 (fr) * 1997-06-26 1999-09-24 Alsthom Cge Alcatel Reflecteur de bragg en semi-conducteur et procede de fabrication
US6358854B1 (en) * 1999-04-21 2002-03-19 Sandia Corporation Method to fabricate layered material compositions
US6468823B1 (en) * 1999-09-30 2002-10-22 California Institute Of Technology Fabrication of optical devices based on two dimensional photonic crystal structures and apparatus made thereby
EP1094345A1 (en) * 1999-10-19 2001-04-25 BRITISH TELECOMMUNICATIONS public limited company Method of making a photonic band gap structure
EP1265326B1 (en) * 2000-03-13 2009-05-13 Sharp Kabushiki Kaisha Gain-coupled distributed feedback semiconductor laser device and production method therefor
JP2001281473A (ja) * 2000-03-28 2001-10-10 Toshiba Corp フォトニクス結晶及びその製造方法、光モジュール並びに光システム
US6365428B1 (en) * 2000-06-15 2002-04-02 Sandia Corporation Embedded high-contrast distributed grating structures
US6560006B2 (en) * 2001-04-30 2003-05-06 Agilent Technologies, Inc. Two-dimensional photonic crystal slab waveguide
US6944373B2 (en) * 2002-08-01 2005-09-13 Northrop Grumman Corporation High index-step grating fabrication using a regrowth-over-dielectric process
US6649439B1 (en) * 2002-08-01 2003-11-18 Northrop Grumman Corporation Semiconductor-air gap grating fabrication using a sacrificial layer process

Also Published As

Publication number Publication date
EP1394911B1 (en) 2008-02-27
US20040082152A1 (en) 2004-04-29
EP1394911A2 (en) 2004-03-03
US6893891B2 (en) 2005-05-17
US6649439B1 (en) 2003-11-18
JP2004133407A (ja) 2004-04-30
DE60319314D1 (de) 2008-04-10
EP1394911A3 (en) 2005-06-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee