DE60304931T2 - Monolithische Mehrwellenlängen Anordnung von Oberflächenemittierenden Lasern mit vertikalem Resonator und Herstellungsverfahren derselben - Google Patents

Monolithische Mehrwellenlängen Anordnung von Oberflächenemittierenden Lasern mit vertikalem Resonator und Herstellungsverfahren derselben Download PDF

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Publication number
DE60304931T2
DE60304931T2 DE60304931T DE60304931T DE60304931T2 DE 60304931 T2 DE60304931 T2 DE 60304931T2 DE 60304931 T DE60304931 T DE 60304931T DE 60304931 T DE60304931 T DE 60304931T DE 60304931 T2 DE60304931 T2 DE 60304931T2
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DE
Germany
Prior art keywords
reflector
producing
vertical cavity
cavity optical
sacrificial
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60304931T
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German (de)
English (en)
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DE60304931D1 (de
Inventor
Steven D. Palo Alto Lester
Virginia M. Los Gatos Robbins
Jeffrey N. Los Altos Hills Miller
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Agilent Technologies Inc
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Agilent Technologies Inc
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Publication of DE60304931D1 publication Critical patent/DE60304931D1/de
Publication of DE60304931T2 publication Critical patent/DE60304931T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42Arrays of surface emitting lasers
    • H01S5/423Arrays of surface emitting lasers having a vertical cavity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18341Intra-cavity contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18358Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] containing spacer layers to adjust the phase of the light wave in the cavity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18361Structure of the reflectors, e.g. hybrid mirrors
    • H01S5/18363Structure of the reflectors, e.g. hybrid mirrors comprising air layers
    • H01S5/18366Membrane DBR, i.e. a movable DBR on top of the VCSEL
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18361Structure of the reflectors, e.g. hybrid mirrors
    • H01S5/18369Structure of the reflectors, e.g. hybrid mirrors based on dielectric materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
DE60304931T 2002-05-16 2003-02-03 Monolithische Mehrwellenlängen Anordnung von Oberflächenemittierenden Lasern mit vertikalem Resonator und Herstellungsverfahren derselben Expired - Fee Related DE60304931T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US151646 1993-11-15
US10/151,646 US6806110B2 (en) 2002-05-16 2002-05-16 Monolithic multi-wavelength vertical-cavity surface emitting laser array and method of manufacture therefor

Publications (2)

Publication Number Publication Date
DE60304931D1 DE60304931D1 (de) 2006-06-08
DE60304931T2 true DE60304931T2 (de) 2007-01-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE60304931T Expired - Fee Related DE60304931T2 (de) 2002-05-16 2003-02-03 Monolithische Mehrwellenlängen Anordnung von Oberflächenemittierenden Lasern mit vertikalem Resonator und Herstellungsverfahren derselben

Country Status (4)

Country Link
US (1) US6806110B2 (enExample)
EP (1) EP1363369B1 (enExample)
JP (1) JP2003332686A (enExample)
DE (1) DE60304931T2 (enExample)

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US7781850B2 (en) 2002-09-20 2010-08-24 Qualcomm Mems Technologies, Inc. Controlling electromechanical behavior of structures within a microelectromechanical systems device
US7039075B2 (en) * 2003-04-11 2006-05-02 Thornton Robert L Fiber extended, semiconductor laser
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US7221495B2 (en) 2003-06-24 2007-05-22 Idc Llc Thin film precursor stack for MEMS manufacturing
KR101354520B1 (ko) 2004-07-29 2014-01-21 퀄컴 엠이엠에스 테크놀로지스, 인크. 간섭 변조기의 미소기전 동작을 위한 시스템 및 방법
DE102004052686A1 (de) * 2004-08-23 2006-03-02 Osram Opto Semiconductors Gmbh Halbleiterbauelement mit einem gekrümmten Spiegel und Verfahren zum Herstellen eines Halbleiterbauelements mit einem gekrümmten Halbleiterkörper
US7492502B2 (en) 2004-09-27 2009-02-17 Idc, Llc Method of fabricating a free-standing microstructure
TW200628877A (en) * 2005-02-04 2006-08-16 Prime View Int Co Ltd Method of manufacturing optical interference type color display
US7831520B2 (en) * 2005-06-28 2010-11-09 Ebay Inc. Mobile device communication system
EP2495212A3 (en) 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
JP2009503564A (ja) 2005-07-22 2009-01-29 クアルコム,インコーポレイテッド Memsデバイスのための支持構造、およびその方法
KR20080040715A (ko) 2005-07-22 2008-05-08 콸콤 인코포레이티드 Mems 장치를 위한 지지 구조물 및 그 방법들
US7795061B2 (en) 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US7382515B2 (en) 2006-01-18 2008-06-03 Qualcomm Mems Technologies, Inc. Silicon-rich silicon nitrides as etch stops in MEMS manufacture
US7547568B2 (en) 2006-02-22 2009-06-16 Qualcomm Mems Technologies, Inc. Electrical conditioning of MEMS device and insulating layer thereof
US7450295B2 (en) 2006-03-02 2008-11-11 Qualcomm Mems Technologies, Inc. Methods for producing MEMS with protective coatings using multi-component sacrificial layers
US7623287B2 (en) 2006-04-19 2009-11-24 Qualcomm Mems Technologies, Inc. Non-planar surface structures and process for microelectromechanical systems
US7527996B2 (en) 2006-04-19 2009-05-05 Qualcomm Mems Technologies, Inc. Non-planar surface structures and process for microelectromechanical systems
US7321457B2 (en) 2006-06-01 2008-01-22 Qualcomm Incorporated Process and structure for fabrication of MEMS device having isolated edge posts
US7763546B2 (en) 2006-08-02 2010-07-27 Qualcomm Mems Technologies, Inc. Methods for reducing surface charges during the manufacture of microelectromechanical systems devices
US7733552B2 (en) 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US7569488B2 (en) 2007-06-22 2009-08-04 Qualcomm Mems Technologies, Inc. Methods of making a MEMS device by monitoring a process parameter
JP2009272375A (ja) * 2008-05-01 2009-11-19 Sumitomo Electric Ind Ltd 半導体レーザの製造方法及び半導体レーザ
US7851239B2 (en) 2008-06-05 2010-12-14 Qualcomm Mems Technologies, Inc. Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices
US7864403B2 (en) 2009-03-27 2011-01-04 Qualcomm Mems Technologies, Inc. Post-release adjustment of interferometric modulator reflectivity
CN102714396B (zh) * 2010-01-29 2014-12-10 惠普发展公司,有限责任合伙企业 多模垂直腔表面发射激光器阵列
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CN107565380B (zh) * 2017-08-29 2019-04-16 中国航空工业集团公司洛阳电光设备研究所 一种共轴输出的多波长激光装置
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Also Published As

Publication number Publication date
US20030214992A1 (en) 2003-11-20
EP1363369B1 (en) 2006-05-03
JP2003332686A (ja) 2003-11-21
US6806110B2 (en) 2004-10-19
DE60304931D1 (de) 2006-06-08
EP1363369A1 (en) 2003-11-19

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8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D. STAATES, US

8339 Ceased/non-payment of the annual fee