DE60302388D1 - Lithographischer Apparat und Verfahren zur Herstellung eines Artikels - Google Patents

Lithographischer Apparat und Verfahren zur Herstellung eines Artikels

Info

Publication number
DE60302388D1
DE60302388D1 DE60302388T DE60302388T DE60302388D1 DE 60302388 D1 DE60302388 D1 DE 60302388D1 DE 60302388 T DE60302388 T DE 60302388T DE 60302388 T DE60302388 T DE 60302388T DE 60302388 D1 DE60302388 D1 DE 60302388D1
Authority
DE
Germany
Prior art keywords
article
making
lithographic apparatus
lithographic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60302388T
Other languages
English (en)
Other versions
DE60302388T2 (de
Inventor
Petrus Matthijs Henric Vosters
Hernes Jacobs
Heumen Mark Van
Nicolaas Rudolf Kemper
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP03253057A external-priority patent/EP1477852A1/de
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of DE60302388D1 publication Critical patent/DE60302388D1/de
Application granted granted Critical
Publication of DE60302388T2 publication Critical patent/DE60302388T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • G03F7/70725Stages control

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE60302388T 2002-06-13 2003-06-11 Lithographischer Apparat und Verfahren zur Herstellung eines Artikels Expired - Lifetime DE60302388T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP02077355 2002-06-13
EP02077355 2002-06-13
EP03253057A EP1477852A1 (de) 2003-05-16 2003-05-16 Lithographischer Apparat, Verfahren zur Herstellung eines Artikels und dabei hergestellter Artikel
EP03253057 2003-05-16

Publications (2)

Publication Number Publication Date
DE60302388D1 true DE60302388D1 (de) 2005-12-29
DE60302388T2 DE60302388T2 (de) 2006-07-27

Family

ID=31716849

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60302388T Expired - Lifetime DE60302388T2 (de) 2002-06-13 2003-06-11 Lithographischer Apparat und Verfahren zur Herstellung eines Artikels

Country Status (8)

Country Link
US (1) US6995379B2 (de)
EP (1) EP1372038B1 (de)
JP (1) JP3955555B2 (de)
KR (1) KR100525655B1 (de)
CN (1) CN1327295C (de)
DE (1) DE60302388T2 (de)
SG (1) SG107660A1 (de)
TW (1) TWI251125B (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1477852A1 (de) * 2003-05-16 2004-11-17 ASML Netherlands B.V. Lithographischer Apparat, Verfahren zur Herstellung eines Artikels und dabei hergestellter Artikel
WO2005024921A1 (ja) * 2003-09-03 2005-03-17 Nikon Corporation 露光装置及びデバイス製造方法
US20070164234A1 (en) * 2004-01-15 2007-07-19 Nikon Corporation Exposure apparatus and device manufacturing method
US7184128B2 (en) * 2004-06-25 2007-02-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100490066C (zh) * 2004-11-25 2009-05-20 株式会社尼康 移动体系统、曝光装置及组件制造方法
JP4677267B2 (ja) * 2005-04-04 2011-04-27 キヤノン株式会社 平面ステージ装置及び露光装置
US7310132B2 (en) * 2006-03-17 2007-12-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
AP2013006819A0 (en) 2006-07-21 2013-04-30 Xyleco Inc Conversion systems for biomass
WO2008078688A1 (ja) * 2006-12-27 2008-07-03 Nikon Corporation ステージ装置、露光装置、及びデバイスの製造方法
NL2002888A1 (nl) 2008-06-12 2009-12-15 Asml Netherlands Bv Lithographic apparatus, composite material and manufacturing method.
US8796644B2 (en) 2008-08-18 2014-08-05 Mapper Lithography Ip B.V. Charged particle beam lithography system and target positioning device
NL2004401A (en) * 2009-04-15 2010-10-18 Asml Netherlands Bv Lithographic apparatus, positioning system, and positioning method.
KR101113136B1 (ko) * 2009-06-02 2012-02-15 유한회사 미래시아건설 회전식 탄성볼라드
NL2010628A (en) * 2012-04-27 2013-10-29 Asml Netherlands Bv Lithographic apparatus comprising an actuator, and method for protecting such actuator.
CN103019045A (zh) * 2012-12-11 2013-04-03 清华大学 一种具有防撞功能的硅片台
CN104238273B (zh) * 2013-06-19 2016-09-28 上海微电子装备有限公司 一种工件台安全防护装置
CN104343885B (zh) * 2013-08-09 2016-08-24 上海微电子装备有限公司 高精密磁悬浮主动减震设备
AU2015240513B2 (en) * 2014-04-03 2019-04-18 Evolv Technologies, Inc. Feature extraction for radar
CN105425548A (zh) * 2016-01-14 2016-03-23 哈尔滨工业大学 基于人字形线圈排布的动线圈磁浮无线微动台矢量圆弧换台方法及装置
US11003095B2 (en) * 2016-09-13 2021-05-11 Asml Netherlands B.V. Positioning system and lithographic apparatus
DE102017200645A1 (de) * 2017-01-17 2017-12-28 Carl Zeiss Smt Gmbh Optische Anordnung, insbesondere Lithographiesystem
CN109725495B (zh) * 2017-10-31 2020-10-16 上海微电子装备(集团)股份有限公司 防撞装置及曝光机台
CN108345181A (zh) * 2018-03-29 2018-07-31 清华大学 一种具有二级防撞保护结构的硅片台双台交换系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5977912A (ja) * 1982-10-26 1984-05-04 Nec Home Electronics Ltd シヨツクアブソ−バ
JPS6055570A (ja) * 1983-09-06 1985-03-30 Fujitsu Ltd 磁気ヘツド
US5040431A (en) * 1988-01-22 1991-08-20 Canon Kabushiki Kaisha Movement guiding mechanism
US5508518A (en) * 1995-05-03 1996-04-16 International Business Machines Corporation Lithography tool with vibration isolation
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
SG88824A1 (en) 1996-11-28 2002-05-21 Nikon Corp Projection exposure method
EP1107067B1 (de) * 1999-12-01 2006-12-27 ASML Netherlands B.V. Positionierungsapparat und damit versehener lithographischer Apparat
TWI223734B (en) * 1999-12-21 2004-11-11 Asml Netherlands Bv Crash prevention in positioning apparatus for use in lithographic projection apparatus
EP1111469B1 (de) * 1999-12-21 2007-10-17 ASML Netherlands B.V. Lithographischer Apparat mit einem ausbalancierten Positionierungssystem
EP1111471B1 (de) * 1999-12-21 2005-11-23 ASML Netherlands B.V. Lithographischer Projektionsapparat mit kollisionsvermeidender Vorrichtung
US6476402B1 (en) * 2000-07-19 2002-11-05 Samsung Electronics Co., Ltd. Apparatus for pyroelectric emission lithography using patterned emitter

Also Published As

Publication number Publication date
CN1501168A (zh) 2004-06-02
EP1372038B1 (de) 2005-11-23
JP3955555B2 (ja) 2007-08-08
TWI251125B (en) 2006-03-11
EP1372038A1 (de) 2003-12-17
KR100525655B1 (ko) 2005-11-02
SG107660A1 (en) 2004-12-29
US6995379B2 (en) 2006-02-07
DE60302388T2 (de) 2006-07-27
JP2004040106A (ja) 2004-02-05
KR20040026102A (ko) 2004-03-27
CN1327295C (zh) 2007-07-18
TW200424781A (en) 2004-11-16
US20040031932A1 (en) 2004-02-19

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