DE60237000D1 - Formbaugruppe zum formen von schutzkappen auf wafer-massstab - Google Patents

Formbaugruppe zum formen von schutzkappen auf wafer-massstab

Info

Publication number
DE60237000D1
DE60237000D1 DE60237000T DE60237000T DE60237000D1 DE 60237000 D1 DE60237000 D1 DE 60237000D1 DE 60237000 T DE60237000 T DE 60237000T DE 60237000 T DE60237000 T DE 60237000T DE 60237000 D1 DE60237000 D1 DE 60237000D1
Authority
DE
Germany
Prior art keywords
wafer scale
form assembly
molds
protection caps
forming protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60237000T
Other languages
English (en)
Inventor
Kia Silverbrook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silverbrook Research Pty Ltd
Original Assignee
Silverbrook Research Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silverbrook Research Pty Ltd filed Critical Silverbrook Research Pty Ltd
Application granted granted Critical
Publication of DE60237000D1 publication Critical patent/DE60237000D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B29C2043/503—Removing moulded articles using ejector pins, rods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0022—Multi-cavity moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/06—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using radiation, e.g. electro-magnetic waves, induction heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0272—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using lost heating elements, i.e. heating means incorporated and remaining in the formed article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2883/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/56—Stoppers or lids for bottles, jars, or the like, e.g. closures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE60237000T 2001-01-10 2002-01-08 Formbaugruppe zum formen von schutzkappen auf wafer-massstab Expired - Lifetime DE60237000D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AUPR2452A AUPR245201A0 (en) 2001-01-10 2001-01-10 An apparatus and method (WSM05)
PCT/AU2002/000012 WO2002056373A1 (en) 2001-01-10 2002-01-08 Molding assembly for wafer scale molding of protective caps

Publications (1)

Publication Number Publication Date
DE60237000D1 true DE60237000D1 (de) 2010-08-26

Family

ID=3826487

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60237000T Expired - Lifetime DE60237000D1 (de) 2001-01-10 2002-01-08 Formbaugruppe zum formen von schutzkappen auf wafer-massstab

Country Status (7)

Country Link
US (3) US7014451B2 (de)
EP (1) EP1356515B1 (de)
JP (1) JP4018541B2 (de)
AT (1) ATE474326T1 (de)
AU (2) AUPR245201A0 (de)
DE (1) DE60237000D1 (de)
WO (1) WO2002056373A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101354424B1 (ko) * 2011-03-18 2014-01-22 이세현 전원 연결용 인넷 소켓 플러그 핀 성형어셈블리와 다이캐스팅에 의한 전원 연결용 인넷 소켓 플러그 핀 제조방법
US8586408B2 (en) * 2011-11-08 2013-11-19 Taiwan Semiconductor Manufacturing Company, Ltd. Contact and method of formation
CN104465790B (zh) * 2014-12-17 2017-09-29 杭州士兰集成电路有限公司 Mems压力传感器及其封装方法
US10629468B2 (en) 2016-02-11 2020-04-21 Skyworks Solutions, Inc. Device packaging using a recyclable carrier substrate
US20170345676A1 (en) * 2016-05-31 2017-11-30 Skyworks Solutions, Inc. Wafer level packaging using a transferable structure
EP3493517B1 (de) * 2016-08-01 2023-05-31 Ningbo Sunny Opotech Co., Ltd. Fotografiemodul, gegossene leiterplattenanordnung und gegossene lichtempfindliche anordnung dafür sowie herstellungsverfahren
US10453763B2 (en) 2016-08-10 2019-10-22 Skyworks Solutions, Inc. Packaging structures with improved adhesion and strength
JP7142691B2 (ja) * 2017-10-17 2022-09-27 マジック リープ， インコーポレイテッド ポリマー製品を成型する方法および装置
CN113380644B (zh) * 2021-06-11 2022-05-13 广州市粤创芯科技有限公司 一种全自动贴片集成电路封装装置
CN116238134B (zh) * 2022-12-07 2023-09-22 浙江星耀箱包有限公司 一种用于行李箱制造的吸塑成型机

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3325629A (en) * 1963-12-26 1967-06-13 Monsanto Co Infrared heating apparatus for molding machines and the like
US3626053A (en) * 1968-03-19 1971-12-07 Union Carbide Corp Method of molding thermoplastic sheet material
US3671159A (en) * 1970-03-06 1972-06-20 Walter H Greenberg Ejecting giant articles from injection mold
US4452943A (en) * 1971-09-10 1984-06-05 Conrad Goldman Thermoforming of thermoplastic polymers
CH632430A5 (de) * 1978-10-05 1982-10-15 Inventio Ag Verfahren und vorrichtung zur herstellung von giessformteilen.
JPS58171918A (ja) * 1982-04-01 1983-10-08 Asahi Chem Ind Co Ltd 強靭なるアクリルシ−ト
JPS59127842A (ja) * 1983-01-13 1984-07-23 Toshiba Corp 樹脂モ−ルド装置
JPS59211238A (ja) * 1983-05-17 1984-11-30 Nec Kyushu Ltd 半導体集積回路の封止用金型
US4890725A (en) * 1984-03-06 1990-01-02 Asm Fico Tooling B.V. Automatic continuously cycleable molding system and method
IT1202154B (it) * 1985-06-24 1989-02-02 Sacmi Apparecchiatura per l'applicazione di una guarnizione all'interno di tappi comprendenti uno scodellino,come i tappi a vite ed a corona
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
US5082436A (en) * 1989-07-14 1992-01-21 General Electric Company Apparatus for deforming thermoplastic material using RF heating
EP0412891B1 (de) * 1989-08-07 1996-07-17 Nissan Motor Co., Ltd. Form aus metallpulvergefülltem Epoxyharz und Verfahren zu deren Herstellung
US5108529A (en) * 1989-09-05 1992-04-28 Shuert Lyle H Method of forming a twin sheet plastic pallet using preforming
US5118271A (en) * 1991-02-22 1992-06-02 Motorola, Inc. Apparatus for encapsulating a semiconductor device
US5061164A (en) * 1991-04-01 1991-10-29 Micron Technology, Inc. Dowel-less mold chase for use in transfer molding
US5441675A (en) * 1993-11-01 1995-08-15 Davidson Textron, Inc. Forming method and apparatus
JPH081698A (ja) * 1994-06-15 1996-01-09 Sumitomo Chem Co Ltd 繊維強化熱可塑性樹脂成形体の製造方法およびそれに用いる金型
JP2861821B2 (ja) * 1994-09-06 1999-02-24 松下電器産業株式会社 モールドプレス装置
IT1274905B (it) * 1994-09-19 1997-07-25 Sacmi Apparecchiatura per la fabbricazione di articoli di materiale plasticoin particolare tappi a vite, mediante stampaggio a pressione.
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
JP3496347B2 (ja) * 1995-07-13 2004-02-09 株式会社デンソー 半導体装置及びその製造方法
US6482742B1 (en) * 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
DE19607212C1 (de) * 1996-02-26 1997-04-10 Richard Herbst Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen
US6257866B1 (en) * 1996-06-18 2001-07-10 Hy-Tech Forming Systems, Inc. Apparatus for accurately forming plastic sheet
US6135756A (en) * 1997-06-13 2000-10-24 Arends; Albert W. Differential pressure forming, trimming and stacking apparatus
US6162376A (en) * 1999-02-24 2000-12-19 Mead Opthalmics Compression molding of optical lenses
US20010033478A1 (en) * 2000-04-21 2001-10-25 Shielding For Electronics, Inc. EMI and RFI shielding for printed circuit boards
AUPR245501A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM08)

Also Published As

Publication number Publication date
JP2004523109A (ja) 2004-07-29
JP4018541B2 (ja) 2007-12-05
ATE474326T1 (de) 2010-07-15
AU2002218867B2 (en) 2004-03-11
AUPR245201A0 (en) 2001-02-01
US7014451B2 (en) 2006-03-21
EP1356515A1 (de) 2003-10-29
EP1356515B1 (de) 2010-07-14
WO2002056373A1 (en) 2002-07-18
US20030091674A1 (en) 2003-05-15
US7875230B2 (en) 2011-01-25
US20040219245A1 (en) 2004-11-04
EP1356515A4 (de) 2006-05-17
US20020089095A1 (en) 2002-07-11

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