ATE474326T1 - Formbaugruppe zum formen von schutzkappen auf wafer-massstab - Google Patents

Formbaugruppe zum formen von schutzkappen auf wafer-massstab

Info

Publication number
ATE474326T1
ATE474326T1 AT02729356T AT02729356T ATE474326T1 AT E474326 T1 ATE474326 T1 AT E474326T1 AT 02729356 T AT02729356 T AT 02729356T AT 02729356 T AT02729356 T AT 02729356T AT E474326 T1 ATE474326 T1 AT E474326T1
Authority
AT
Austria
Prior art keywords
mold assembly
wafer scale
protective caps
molds
shaping protective
Prior art date
Application number
AT02729356T
Other languages
English (en)
Inventor
Kia Silverbrook
Original Assignee
Silverbrook Res Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silverbrook Res Pty Ltd filed Critical Silverbrook Res Pty Ltd
Application granted granted Critical
Publication of ATE474326T1 publication Critical patent/ATE474326T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B29C2043/503—Removing moulded articles using ejector pins, rods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0022—Multi-cavity moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/06—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using radiation, e.g. electro-magnetic waves, induction heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0272—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using lost heating elements, i.e. heating means incorporated and remaining in the formed article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2883/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/56—Stoppers or lids for bottles, jars, or the like, e.g. closures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped

Landscapes

  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
AT02729356T 2001-01-10 2002-01-08 Formbaugruppe zum formen von schutzkappen auf wafer-massstab ATE474326T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AUPR2452A AUPR245201A0 (en) 2001-01-10 2001-01-10 An apparatus and method (WSM05)
PCT/AU2002/000012 WO2002056373A1 (en) 2001-01-10 2002-01-08 Molding assembly for wafer scale molding of protective caps

Publications (1)

Publication Number Publication Date
ATE474326T1 true ATE474326T1 (de) 2010-07-15

Family

ID=3826487

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02729356T ATE474326T1 (de) 2001-01-10 2002-01-08 Formbaugruppe zum formen von schutzkappen auf wafer-massstab

Country Status (7)

Country Link
US (3) US7014451B2 (de)
EP (1) EP1356515B1 (de)
JP (1) JP4018541B2 (de)
AT (1) ATE474326T1 (de)
AU (2) AUPR245201A0 (de)
DE (1) DE60237000D1 (de)
WO (1) WO2002056373A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101354424B1 (ko) * 2011-03-18 2014-01-22 이세현 전원 연결용 인넷 소켓 플러그 핀 성형어셈블리와 다이캐스팅에 의한 전원 연결용 인넷 소켓 플러그 핀 제조방법
US8586408B2 (en) * 2011-11-08 2013-11-19 Taiwan Semiconductor Manufacturing Company, Ltd. Contact and method of formation
CN104465790B (zh) * 2014-12-17 2017-09-29 杭州士兰集成电路有限公司 Mems压力传感器及其封装方法
TW201735286A (zh) 2016-02-11 2017-10-01 天工方案公司 使用可回收載體基板之裝置封裝
US20170345676A1 (en) * 2016-05-31 2017-11-30 Skyworks Solutions, Inc. Wafer level packaging using a transferable structure
WO2018023887A1 (zh) * 2016-08-01 2018-02-08 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和模塑感光组件和制造方法
US10453763B2 (en) 2016-08-10 2019-10-22 Skyworks Solutions, Inc. Packaging structures with improved adhesion and strength
CN115257026A (zh) * 2017-10-17 2022-11-01 奇跃公司 用于铸造聚合物产品的方法和装置
CN113380644B (zh) * 2021-06-11 2022-05-13 广州市粤创芯科技有限公司 一种全自动贴片集成电路封装装置
CN116238134B (zh) * 2022-12-07 2023-09-22 浙江星耀箱包有限公司 一种用于行李箱制造的吸塑成型机

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US3325629A (en) * 1963-12-26 1967-06-13 Monsanto Co Infrared heating apparatus for molding machines and the like
US3626053A (en) * 1968-03-19 1971-12-07 Union Carbide Corp Method of molding thermoplastic sheet material
US3671159A (en) * 1970-03-06 1972-06-20 Walter H Greenberg Ejecting giant articles from injection mold
US4452943A (en) * 1971-09-10 1984-06-05 Conrad Goldman Thermoforming of thermoplastic polymers
CH632430A5 (de) * 1978-10-05 1982-10-15 Inventio Ag Verfahren und vorrichtung zur herstellung von giessformteilen.
JPS58171918A (ja) * 1982-04-01 1983-10-08 Asahi Chem Ind Co Ltd 強靭なるアクリルシ−ト
JPS59127842A (ja) * 1983-01-13 1984-07-23 Toshiba Corp 樹脂モ−ルド装置
JPS59211238A (ja) * 1983-05-17 1984-11-30 Nec Kyushu Ltd 半導体集積回路の封止用金型
US4890725A (en) * 1984-03-06 1990-01-02 Asm Fico Tooling B.V. Automatic continuously cycleable molding system and method
IT1202154B (it) * 1985-06-24 1989-02-02 Sacmi Apparecchiatura per l'applicazione di una guarnizione all'interno di tappi comprendenti uno scodellino,come i tappi a vite ed a corona
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
US5082436A (en) * 1989-07-14 1992-01-21 General Electric Company Apparatus for deforming thermoplastic material using RF heating
EP0412891B1 (de) * 1989-08-07 1996-07-17 Nissan Motor Co., Ltd. Form aus metallpulvergefülltem Epoxyharz und Verfahren zu deren Herstellung
US5108529A (en) * 1989-09-05 1992-04-28 Shuert Lyle H Method of forming a twin sheet plastic pallet using preforming
US5118271A (en) * 1991-02-22 1992-06-02 Motorola, Inc. Apparatus for encapsulating a semiconductor device
US5061164A (en) * 1991-04-01 1991-10-29 Micron Technology, Inc. Dowel-less mold chase for use in transfer molding
US5441675A (en) * 1993-11-01 1995-08-15 Davidson Textron, Inc. Forming method and apparatus
JPH081698A (ja) * 1994-06-15 1996-01-09 Sumitomo Chem Co Ltd 繊維強化熱可塑性樹脂成形体の製造方法およびそれに用いる金型
JP2861821B2 (ja) * 1994-09-06 1999-02-24 松下電器産業株式会社 モールドプレス装置
IT1274905B (it) * 1994-09-19 1997-07-25 Sacmi Apparecchiatura per la fabbricazione di articoli di materiale plasticoin particolare tappi a vite, mediante stampaggio a pressione.
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
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AUPR245501A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM08)

Also Published As

Publication number Publication date
EP1356515A1 (de) 2003-10-29
WO2002056373A1 (en) 2002-07-18
AU2002218867B2 (en) 2004-03-11
AUPR245201A0 (en) 2001-02-01
DE60237000D1 (de) 2010-08-26
US20040219245A1 (en) 2004-11-04
JP2004523109A (ja) 2004-07-29
EP1356515B1 (de) 2010-07-14
US7014451B2 (en) 2006-03-21
US7875230B2 (en) 2011-01-25
JP4018541B2 (ja) 2007-12-05
US20020089095A1 (en) 2002-07-11
EP1356515A4 (de) 2006-05-17
US20030091674A1 (en) 2003-05-15

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties