JP4018541B2 - 成形アセンブリ及びそれを使用して熱可塑性材料から成るシートを扱う方法 - Google Patents
成形アセンブリ及びそれを使用して熱可塑性材料から成るシートを扱う方法 Download PDFInfo
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- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
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- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
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- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/50—Removing moulded articles
- B29C2043/503—Removing moulded articles using ejector pins, rods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0022—Multi-cavity moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
- B29C33/06—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using radiation, e.g. electro-magnetic waves, induction heating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/0272—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using lost heating elements, i.e. heating means incorporated and remaining in the formed article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2883/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/56—Stoppers or lids for bottles, jars, or the like, e.g. closures
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
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Description
溝が形成された第1の成形面を有する第1のモールドと、凹部が形成された第2の成形面を有する第2のモールドを有し、
前記溝は、前記凹部の端に位置合わせされており、
前記溝及び前記凹部よって規定されるキャビティによって、熱可塑性材料から成るシートを成形中空キャップに成形する成形アセンブリにおいて、
前記第1のモールドは、外面から前記第1の成形面へと延びる第1の穴を有し、
前記シート成形後に、前記第1のモールドを前記第2のモールド及び前記シートから引き離す第1の解放機構を有し、前記第1の解放機構は、前記第1のモールドの外面から前記第1の穴内へと延びる第1のピンを有し、
前記第1のモールドは、成形位置と解放位置との間で、前記第2のモールド及び前記第1のピンに対して移動可能であり、
前記成形位置では、前記第1及び第2のモールドが互いに接触もしくは互いに近接するとともに、前記第1のピンは、前記第1の成形面から突出せず、
前記解放位置では、前記第1及び第2のモールドが互いに離間するとともに、前記第1のピンは、前記シートに接触したまま前記第1の成形面を超えて前記第1の穴から突出し、
前記第2のモールドは、外面から前記第2の成形面へと延びる第2の穴を有し、
前記シート成形後に、前記シートを前記第2のモールドから引き離す第2の解放機構を更に有し、前記第2の解放機構は、前記第2のモールドの前記第2の穴内へと延びる第2のピンを有し、
前記第1及び第2のモールドは、シリコンまたはシリコン合金からなる、ことを特徴とする。
a)前記第1及び第2のモールド間に前記シートを挟む工程と、
b)前記シートを塑性状態まで加熱する工程と、
c)前記第1及び第2モールドを互いに押し付けて、前記シートを塑性変形させ、成形中空キャップを成形する工程と、
d)前記第1のピンを前記シートに接触させたまま、前記第1のモールドを前記成形位置から前記開放位置へと移動させる工程と、
e)前記第1のピンと前記シートとの接触状態を解除する工程と、
を含む、ことを特徴とする。
f)前記成形された成形中空キャップを、微細加工デバイスが形成されたウエハに対して接着することを更に含むことが望ましい。
g)前記第2のピンを前記シートに接触させたまま、前記第2のモールドを前記シートから引き離し、
h)前記第2のピンと前記シートとの接触状態を解除することを更に含むことが望ましい。
120 下側リリースウエハ
122,124 リリースピン
102 上側のウエハ
104 下側のウエハ
108 下面
106 凹部
134 シート
110 上面
114 材料部分
126,128 穴
112 溝
Claims (13)
- 溝が形成された第1の成形面を有する第1のモールドと、凹部が形成された第2の成形面を有する第2のモールドを有し、
前記溝は、前記凹部の端に位置合わせされており、
前記溝及び前記凹部よって規定されるキャビティによって、熱可塑性材料から成るシートを成形中空キャップに成形する成形アセンブリにおいて、
前記第1のモールドは、外面から前記第1の成形面へと延びる第1の穴を有し、
前記シート成形後に、前記第1のモールドを前記第2のモールド及び前記シートから引き離す第1の解放機構を有し、前記第1の解放機構は、前記第1のモールドの外面から前記第1の穴内へと延びる第1のピンを有し、
前記第1のモールドは、成形位置と解放位置との間で、前記第2のモールド及び前記第1のピンに対して移動可能であり、
前記成形位置では、前記第1及び第2のモールドが互いに接触もしくは互いに近接するとともに、前記第1のピンは、前記第1の成形面から突出せず、
前記解放位置では、前記第1及び第2のモールドが互いに離間するとともに、前記第1のピンは、前記シートに接触したまま前記第1の成形面を超えて前記第1の穴から突出し、
前記第2のモールドは、外面から前記第2の成形面へと延びる第2の穴を有し、
前記シート成形後に、前記シートを前記第2のモールドから引き離す第2の解放機構を更に有し、前記第2の解放機構は、前記第2のモールドの前記第2の穴内へと延びる第2のピンを有し、
前記第1及び第2のモールドは、シリコンまたはシリコン合金からなる、
成形アセンブリ。 - 前記第1の解放機構及び前記第1のモールドは、隙間を有し、前記隙間に負圧を作用させて前記第1のモールドを成形位置から解放位置へと移動させる真空源を更に有している、請求項1に記載の成形アセンブリ。
- 前記第1又は第2のモールドは、1000nm〜5000nmの範囲の波長を有する赤外線を透過もしくは半透過する、請求項1に記載の成形アセンブリ。
- 前記第1の解放機構は、1000nm〜5000nmの範囲の波長を有する赤外線を透過もしくは半透過する、請求項1に記載の成形アセンブリ。
- 前記第1の解放機構は、半導体材料によって形成されている、請求項1に記載の成形アセンブリ。
- 請求項1の成形アセンブリを使用して熱可塑性材料から成るシートを扱う方法において、
a)前記第1及び第2のモールド間に前記シートを挟む工程と、
b)前記シートを塑性状態まで加熱する工程と、
c)前記第1及び第2モールドを互いに押し付けて、前記シートを塑性変形させ、成形中空キャップを成形する工程と、
d)前記第1のピンを前記シートに接触させたまま、前記第1のモールドを前記成形位置から前記開放位置へと移動させる工程と、
e)前記第1のピンと前記シートとの接触状態を解除する工程と、
を含む方法。 - ステップe)の後に、
f)前記成形された成形中空キャップを、微細加工デバイスが形成されたウエハに対して接着することを更に含む、請求項6に記載の方法。 - ステップf)の後に、
g)前記第2のピンを前記シートに接触させたまま、前記第2のモールドを前記シートから引き離し、
h)前記第2のピンと前記シートとの接触状態を解除することを更に含む、請求項7に記載の方法。 - ステップc)は、前記第1のモールドと前記第1の解放機構との隙間、及び、前記第2のモールドと前記第2の解放機構との隙間に大気圧を超える圧力を作用させることを含む、請求項6に記載の方法。
- ステップd)は、前記第1のモールドと前記第1の解放機構との隙間に負圧を作用させて、前記第1のモールドを前記成形位置から前記開放位置へと移動させることを含む、請求項6に記載の方法。
- ステップg)は、前記第2のモールドと前記第2の解放機構との隙間に負圧を作用させて、前記第2のモールドを前記シートから引き離すことを含む、請求項8に記載の方法。
- ステップb)は、1000nm〜5000nmの範囲の波長を有する赤外線を前記シートに放射することを含む、請求項6に記載の方法。
- ステップc)において、前記成形中空キャップは、シート材料からなる薄い層によって互いに連結され、前記薄い層は、ステップe)の後にエッチングによって除去することを含む、請求項6に記載の方法。
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AUPR2452A AUPR245201A0 (en) | 2001-01-10 | 2001-01-10 | An apparatus and method (WSM05) |
PCT/AU2002/000012 WO2002056373A1 (en) | 2001-01-10 | 2002-01-08 | Molding assembly for wafer scale molding of protective caps |
Publications (2)
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JP2004523109A JP2004523109A (ja) | 2004-07-29 |
JP4018541B2 true JP4018541B2 (ja) | 2007-12-05 |
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JP2002556941A Expired - Fee Related JP4018541B2 (ja) | 2001-01-10 | 2002-01-08 | 成形アセンブリ及びそれを使用して熱可塑性材料から成るシートを扱う方法 |
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US (3) | US7014451B2 (ja) |
EP (1) | EP1356515B1 (ja) |
JP (1) | JP4018541B2 (ja) |
AT (1) | ATE474326T1 (ja) |
AU (2) | AUPR245201A0 (ja) |
DE (1) | DE60237000D1 (ja) |
WO (1) | WO2002056373A1 (ja) |
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US8586408B2 (en) * | 2011-11-08 | 2013-11-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Contact and method of formation |
CN104465790B (zh) * | 2014-12-17 | 2017-09-29 | 杭州士兰集成电路有限公司 | Mems压力传感器及其封装方法 |
US10629468B2 (en) | 2016-02-11 | 2020-04-21 | Skyworks Solutions, Inc. | Device packaging using a recyclable carrier substrate |
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KR102352901B1 (ko) * | 2016-08-01 | 2022-01-19 | 닝보 써니 오포테크 코., 엘티디. | 촬영 모듈과 그 몰딩 회로기판 컴포넌트 및 몰딩 감광 컴포넌트와 제조방법 |
US10453763B2 (en) | 2016-08-10 | 2019-10-22 | Skyworks Solutions, Inc. | Packaging structures with improved adhesion and strength |
KR20230058550A (ko) * | 2017-10-17 | 2023-05-03 | 매직 립, 인코포레이티드 | 중합체 생성물들을 주조하기 위한 방법들 및 장치들 |
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CN116238134B (zh) * | 2022-12-07 | 2023-09-22 | 浙江星耀箱包有限公司 | 一种用于行李箱制造的吸塑成型机 |
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2001
- 2001-01-10 AU AUPR2452A patent/AUPR245201A0/en not_active Abandoned
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2002
- 2002-01-08 JP JP2002556941A patent/JP4018541B2/ja not_active Expired - Fee Related
- 2002-01-08 WO PCT/AU2002/000012 patent/WO2002056373A1/en active IP Right Grant
- 2002-01-08 US US10/129,504 patent/US7014451B2/en not_active Expired - Lifetime
- 2002-01-08 EP EP02729356A patent/EP1356515B1/en not_active Expired - Lifetime
- 2002-01-08 DE DE60237000T patent/DE60237000D1/de not_active Expired - Lifetime
- 2002-01-08 AT AT02729356T patent/ATE474326T1/de not_active IP Right Cessation
- 2002-01-08 AU AU2002218867A patent/AU2002218867B2/en not_active Ceased
- 2002-01-14 US US10/043,296 patent/US20020089095A1/en not_active Abandoned
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US20030091674A1 (en) | 2003-05-15 |
AU2002218867B2 (en) | 2004-03-11 |
EP1356515A4 (en) | 2006-05-17 |
EP1356515B1 (en) | 2010-07-14 |
DE60237000D1 (de) | 2010-08-26 |
US20020089095A1 (en) | 2002-07-11 |
JP2004523109A (ja) | 2004-07-29 |
US7014451B2 (en) | 2006-03-21 |
ATE474326T1 (de) | 2010-07-15 |
US7875230B2 (en) | 2011-01-25 |
WO2002056373A1 (en) | 2002-07-18 |
AUPR245201A0 (en) | 2001-02-01 |
EP1356515A1 (en) | 2003-10-29 |
US20040219245A1 (en) | 2004-11-04 |
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