JP4259866B2 - 熱可塑性材料から成るシートから微小構造体を成形するための装置 - Google Patents
熱可塑性材料から成るシートから微小構造体を成形するための装置 Download PDFInfo
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- JP4259866B2 JP4259866B2 JP2002556942A JP2002556942A JP4259866B2 JP 4259866 B2 JP4259866 B2 JP 4259866B2 JP 2002556942 A JP2002556942 A JP 2002556942A JP 2002556942 A JP2002556942 A JP 2002556942A JP 4259866 B2 JP4259866 B2 JP 4259866B2
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- 238000000465 moulding Methods 0.000 title claims abstract description 11
- 239000012815 thermoplastic material Substances 0.000 title claims description 7
- 239000000463 material Substances 0.000 claims abstract description 35
- 235000012431 wafers Nutrition 0.000 claims description 148
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 22
- 239000004065 semiconductor Substances 0.000 abstract description 20
- 229920001169 thermoplastic Polymers 0.000 abstract description 4
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 37
- 229910052710 silicon Inorganic materials 0.000 description 37
- 239000010703 silicon Substances 0.000 description 37
- 238000005530 etching Methods 0.000 description 34
- 230000001681 protective effect Effects 0.000 description 21
- 238000004806 packaging method and process Methods 0.000 description 8
- 238000001459 lithography Methods 0.000 description 7
- 238000002955 isolation Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000000708 deep reactive-ion etching Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000001015 X-ray lithography Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- POIUWJQBRNEFGX-XAMSXPGMSA-N cathelicidin Chemical compound C([C@@H](C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CO)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H]([C@@H](C)CC)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1[C@@H](CCC1)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CO)C(O)=O)NC(=O)[C@H](CC=1C=CC=CC=1)NC(=O)[C@H](CC(O)=O)NC(=O)CNC(=O)[C@H](CC(C)C)NC(=O)[C@@H](N)CC(C)C)C1=CC=CC=C1 POIUWJQBRNEFGX-XAMSXPGMSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004438 eyesight Effects 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/50—Removing moulded articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/50—Removing moulded articles
- B29C2043/503—Removing moulded articles using ejector pins, rods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0022—Multi-cavity moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/25—Solid
- B29K2105/253—Preform
- B29K2105/256—Sheets, plates, blanks or films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2883/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
- B29L2031/3055—Cars
- B29L2031/3061—Number plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/56—Stoppers or lids for bottles, jars, or the like, e.g. closures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Micromachines (AREA)
- Power Steering Mechanism (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Closures For Containers (AREA)
Description
フォーミングキャップ
図10〜図16は、中空の保護キャップを形成して、この保護キャップをウエハ、好ましくは半導体ウエハに適用する第1のシステムを概略的に示している。
122,124 ピン
102,104 成形ウエハ
108 下面
106 凹部
134 シート
110 上面
114 材料部分
126,128 孔
112 溝
Claims (2)
- 熱可塑性材料から成るシートから微小構造体を成形するための装置であって、
それぞれが加工面および背面を有する2つの成形ウエハを備え、
前記加工面は、1または複数の微細加工された凹部を有し、
前記凹部は、前記加工面同士が対向して配置される時に、熱可塑性材料から成る前記シートを受ける前記成形ウエハ間に少なくとも1つのキャビティを形成し、
前記成形ウエハは、前記加工面同士が対向して配置されて前記キャビティが形成される時に、前記成形ウエハが前記それぞれの加工面の部分上で互いに接触するように形成されており、
前記成形ウエハは、前記熱可塑性材料を加熱するために放射線を透過する材料から成る、装置。 - 平面視で、
一方の前記成形ウエハは、各キャビティのために前記加工面に形成された少なくとも1つの第1の凹部を有し、
他方の前記成形ウエハは、各キャビティのために前記加工面に形成された少なくとも1つの第1の溝を有し、
前記2つの成形ウエハの使用時、
前記少なくとも1つの第1の凹部は、前記キャビティの中央部を形成し、
前記少なくとも1つの第1の溝は、前記中央部の両端から延びる前記キャビティの周壁部を形成する、請求項1に記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPR2455A AUPR245501A0 (en) | 2001-01-10 | 2001-01-10 | An apparatus (WSM08) |
PCT/AU2002/000015 WO2002056374A1 (en) | 2001-01-10 | 2002-01-08 | Molds for wafer scale molding of protective caps |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004523382A JP2004523382A (ja) | 2004-08-05 |
JP4259866B2 true JP4259866B2 (ja) | 2009-04-30 |
Family
ID=3826490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002556942A Expired - Fee Related JP4259866B2 (ja) | 2001-01-10 | 2002-01-08 | 熱可塑性材料から成るシートから微小構造体を成形するための装置 |
Country Status (7)
Country | Link |
---|---|
US (3) | US6991207B2 (ja) |
EP (1) | EP1360719B1 (ja) |
JP (1) | JP4259866B2 (ja) |
AT (1) | ATE473849T1 (ja) |
AU (1) | AUPR245501A0 (ja) |
DE (1) | DE60237001D1 (ja) |
WO (1) | WO2002056374A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AUPR245201A0 (en) * | 2001-01-10 | 2001-02-01 | Silverbrook Research Pty Ltd | An apparatus and method (WSM05) |
AUPR245501A0 (en) * | 2001-01-10 | 2001-02-01 | Silverbrook Research Pty Ltd | An apparatus (WSM08) |
KR100537892B1 (ko) * | 2003-08-26 | 2005-12-21 | 삼성전자주식회사 | 칩 스택 패키지와 그 제조 방법 |
KR100843213B1 (ko) * | 2006-12-05 | 2008-07-02 | 삼성전자주식회사 | 메모리 칩과 프로세서 칩이 스크라이브 영역에 배열된관통전극을 통해 연결된 다중 입출력 반도체 칩 패키지 및그 제조방법 |
US20130193172A1 (en) * | 2012-01-27 | 2013-08-01 | Michael J. Damkot | Mold and method of using the same in the manufacture of holsters |
US9677950B2 (en) | 2013-03-14 | 2017-06-13 | Robert Bosch Gmbh | Portable device with temperature sensing |
Family Cites Families (25)
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US3636147A (en) * | 1969-01-14 | 1972-01-18 | Rowland Products Inc | Method for making sheet material for visual pattern effects |
IT1128752B (it) | 1980-01-18 | 1986-06-04 | Olivetti & Co Spa | Calcolatrice elettronica tascabile |
US4436439A (en) | 1980-08-27 | 1984-03-13 | Epson Corporation | Small printer |
GB8413330D0 (en) * | 1984-05-24 | 1984-06-27 | Mbm Technology Ltd | Mounting semi-conductor chips |
US5118271A (en) * | 1991-02-22 | 1992-06-02 | Motorola, Inc. | Apparatus for encapsulating a semiconductor device |
US5815396A (en) * | 1991-08-12 | 1998-09-29 | Hitachi, Ltd. | Vacuum processing device and film forming device and method using same |
JP2531472B2 (ja) | 1992-08-07 | 1996-09-04 | 株式会社ニコン | プラスチック成形用鋳型の製造方法 |
DE4307869C2 (de) * | 1993-03-12 | 1996-04-04 | Microparts Gmbh | Mikrostrukturkörper und Verfahren zu deren Herstellung |
JPH06263164A (ja) * | 1993-03-12 | 1994-09-20 | Urawa Polymer Kk | キャリアテープおよびその製造方法 |
JPH06347475A (ja) * | 1993-06-08 | 1994-12-22 | Murata Mfg Co Ltd | 加速度センサおよびその製造方法 |
JPH07219689A (ja) | 1994-01-31 | 1995-08-18 | Hitachi Ltd | プリンタおよびこれを用いるシステム |
JPH07323428A (ja) | 1994-06-01 | 1995-12-12 | Nippon Zeon Co Ltd | 光学シート製造用スタンパーおよびそれを用いた光学シートの製造方法 |
JP3613838B2 (ja) * | 1995-05-18 | 2005-01-26 | 株式会社デンソー | 半導体装置の製造方法 |
JP3496347B2 (ja) * | 1995-07-13 | 2004-02-09 | 株式会社デンソー | 半導体装置及びその製造方法 |
US5798557A (en) * | 1996-08-29 | 1998-08-25 | Harris Corporation | Lid wafer bond packaging and micromachining |
JPH11138911A (ja) | 1997-11-07 | 1999-05-25 | F & F:Kk | 印刷装置 |
US6376344B1 (en) * | 1999-10-20 | 2002-04-23 | Texas Instruments Incorporated | Semiconductor device with fully self-aligned local interconnects, and method for fabricating the device |
JP3499755B2 (ja) | 1998-09-11 | 2004-02-23 | 日本電信電話株式会社 | 記録媒体およびその作製方法 |
AUPP701998A0 (en) | 1998-11-09 | 1998-12-03 | Silverbrook Research Pty Ltd | Image creation method and apparatus (ART74) |
AU3508600A (en) * | 1999-02-26 | 2000-09-14 | Orchid Biosciences, Inc. | Microstructures for use in biological assays and reactions |
JP4151164B2 (ja) | 1999-03-19 | 2008-09-17 | 株式会社デンソー | 半導体装置の製造方法 |
US6406545B2 (en) * | 1999-07-27 | 2002-06-18 | Kabushiki Kaisha Toshiba | Semiconductor workpiece processing apparatus and method |
AUPR245501A0 (en) * | 2001-01-10 | 2001-02-01 | Silverbrook Research Pty Ltd | An apparatus (WSM08) |
AUPR245001A0 (en) * | 2001-01-10 | 2001-02-01 | Silverbrook Research Pty Ltd | A method (WSM03) |
JP2002368028A (ja) * | 2001-06-13 | 2002-12-20 | Nec Corp | 半導体パッケージ及びその製造方法 |
-
2001
- 2001-01-10 AU AUPR2455A patent/AUPR245501A0/en not_active Abandoned
-
2002
- 2002-01-08 WO PCT/AU2002/000015 patent/WO2002056374A1/en active IP Right Grant
- 2002-01-08 AT AT02729359T patent/ATE473849T1/de not_active IP Right Cessation
- 2002-01-08 US US10/466,072 patent/US6991207B2/en not_active Expired - Lifetime
- 2002-01-08 DE DE60237001T patent/DE60237001D1/de not_active Expired - Lifetime
- 2002-01-08 EP EP02729359A patent/EP1360719B1/en not_active Expired - Lifetime
- 2002-01-08 JP JP2002556942A patent/JP4259866B2/ja not_active Expired - Fee Related
- 2002-01-09 US US10/040,456 patent/US6766998B2/en not_active Expired - Lifetime
-
2004
- 2004-07-26 US US10/898,214 patent/US7618575B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2004523382A (ja) | 2004-08-05 |
US6766998B2 (en) | 2004-07-27 |
WO2002056374A1 (en) | 2002-07-18 |
DE60237001D1 (de) | 2010-08-26 |
AUPR245501A0 (en) | 2001-02-01 |
US20020090413A1 (en) | 2002-07-11 |
US20040262812A1 (en) | 2004-12-30 |
ATE473849T1 (de) | 2010-07-15 |
EP1360719B1 (en) | 2010-07-14 |
US20040052886A1 (en) | 2004-03-18 |
US6991207B2 (en) | 2006-01-31 |
EP1360719A4 (en) | 2006-05-17 |
EP1360719A1 (en) | 2003-11-12 |
US7618575B2 (en) | 2009-11-17 |
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