DE60231784D1 - Überbrückungs-Chipbauteil und Montierungsanordnung dafür - Google Patents

Überbrückungs-Chipbauteil und Montierungsanordnung dafür

Info

Publication number
DE60231784D1
DE60231784D1 DE60231784T DE60231784T DE60231784D1 DE 60231784 D1 DE60231784 D1 DE 60231784D1 DE 60231784 T DE60231784 T DE 60231784T DE 60231784 T DE60231784 T DE 60231784T DE 60231784 D1 DE60231784 D1 DE 60231784D1
Authority
DE
Germany
Prior art keywords
chip component
mounting arrangement
arrangement therefor
bypass chip
bypass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60231784T
Other languages
English (en)
Inventor
Shuji Saito
Satoru Matsuzaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Application granted granted Critical
Publication of DE60231784D1 publication Critical patent/DE60231784D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/08—Short-circuiting members for bridging contacts in a counterpart
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
DE60231784T 2001-12-27 2002-12-06 Überbrückungs-Chipbauteil und Montierungsanordnung dafür Expired - Lifetime DE60231784D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001398515 2001-12-27

Publications (1)

Publication Number Publication Date
DE60231784D1 true DE60231784D1 (de) 2009-05-14

Family

ID=19189355

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60231784T Expired - Lifetime DE60231784D1 (de) 2001-12-27 2002-12-06 Überbrückungs-Chipbauteil und Montierungsanordnung dafür

Country Status (5)

Country Link
US (2) US6949819B2 (de)
EP (1) EP1324646B1 (de)
CN (1) CN1274187C (de)
DE (1) DE60231784D1 (de)
TW (1) TW569493B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2145515A2 (de) * 2007-04-05 2010-01-20 Kia Kuang Tan Leiterplatte mit einem thermisch hocheffizienten metallkern mit selektiver elektrischer und thermischer schaltkreiskonnektivität
DE102007040871A1 (de) * 2007-08-29 2009-03-12 Osram Gesellschaft mit beschränkter Haftung Verbindungselement
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
JP5352019B1 (ja) * 2012-11-14 2013-11-27 太陽誘電株式会社 多層回路基板及び高周波回路モジュール
DE102015121044B4 (de) 2015-12-03 2020-02-06 Infineon Technologies Ag Anschlussblock mit zwei Arten von Durchkontaktierungen und elektronische Vorrichtung, einen Anschlussblock umfassend
US11469486B2 (en) * 2019-11-29 2022-10-11 Knowles Cazenovia, Inc. Surface mount radio frequency crossover device
US11461609B1 (en) * 2022-03-25 2022-10-04 Tactotek Oy Multilayer structure and method of manufacturing such

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594873B2 (ja) * 1978-09-26 1984-02-01 松下電器産業株式会社 印刷配線板
JPH0371572A (ja) * 1989-08-10 1991-03-27 Oki Electric Ind Co Ltd ジャンパー導体付チップ部品
JPH03110768A (ja) * 1989-09-25 1991-05-10 Fujitsu Ltd 配線パターン接続用チップ
JP3051511B2 (ja) 1991-08-27 2000-06-12 キヤノン株式会社 インクジェット記録装置
DE69422968T2 (de) * 1993-12-22 2000-06-29 Murata Manufacturing Co Montageanordnung für elektronisches Bauteil
JPH07335995A (ja) * 1994-06-13 1995-12-22 Murata Mfg Co Ltd 電子部品及びその製造方法
US5907265A (en) * 1996-09-13 1999-05-25 Matsushita Electric Industrial Co., Ltd. High-frequency circuit board trace crossing and electronic component therefor
DE19918746A1 (de) * 1999-04-24 2000-10-26 Diehl Ako Stiftung Gmbh & Co Lötbrücke
DE19959598A1 (de) * 1999-12-10 2001-06-13 Rolls Royce Deutschland Verfahren zum Herstellen einer Schaufel einer Strömungsmaschine
JP2002141248A (ja) * 2000-11-02 2002-05-17 Murata Mfg Co Ltd セラミック電子部品およびその製造方法

Also Published As

Publication number Publication date
EP1324646A3 (de) 2004-11-03
EP1324646B1 (de) 2009-04-01
US20040256716A1 (en) 2004-12-23
US20030123237A1 (en) 2003-07-03
US7098531B2 (en) 2006-08-29
TW569493B (en) 2004-01-01
US6949819B2 (en) 2005-09-27
CN1430462A (zh) 2003-07-16
EP1324646A2 (de) 2003-07-02
CN1274187C (zh) 2006-09-06
TW200301591A (en) 2003-07-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition