DE60231232D1 - Anisotrop elektroleitfaehiger klebefilm, verfahren zu seiner herstellung und halbleitervorrichtungen - Google Patents

Anisotrop elektroleitfaehiger klebefilm, verfahren zu seiner herstellung und halbleitervorrichtungen

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Publication number
DE60231232D1
DE60231232D1 DE60231232T DE60231232T DE60231232D1 DE 60231232 D1 DE60231232 D1 DE 60231232D1 DE 60231232 T DE60231232 T DE 60231232T DE 60231232 T DE60231232 T DE 60231232T DE 60231232 D1 DE60231232 D1 DE 60231232D1
Authority
DE
Germany
Prior art keywords
adhesive film
electroconductive
elastomer
electroproof
anisotrop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60231232T
Other languages
English (en)
Inventor
A Kobayashi
K Nakayoshi
R Shima
Y Ushio
K Mine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of DE60231232D1 publication Critical patent/DE60231232D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
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    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01045—Rhodium [Rh]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01—Chemical elements
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    • H01L2924/01061—Promethium [Pm]
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    • H01L2924/01—Chemical elements
    • H01L2924/0107—Ytterbium [Yb]
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    • H01L2924/01079—Gold [Au]
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
DE60231232T 2001-11-28 2002-11-21 Anisotrop elektroleitfaehiger klebefilm, verfahren zu seiner herstellung und halbleitervorrichtungen Expired - Lifetime DE60231232D1 (de)

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PCT/JP2002/012212 WO2003046098A1 (en) 2001-11-28 2002-11-21 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices

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US8802214B2 (en) * 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
US20070131912A1 (en) * 2005-07-08 2007-06-14 Simone Davide L Electrically conductive adhesives
US7293995B2 (en) * 2005-11-08 2007-11-13 Che-Yu Li & Company, Llc Electrical contact and connector system
FR2908955A1 (fr) * 2006-11-17 2008-05-23 Novatec Sa Element ou interface d'interconnexion electrique et son procede de realisation
WO2010106703A1 (ja) 2009-03-19 2010-09-23 富士通株式会社 半導体装置とその製造方法、電子装置、及び電子部品
FR2972595B1 (fr) * 2011-03-10 2014-03-14 Commissariat Energie Atomique Procede d'interconnexion par retournement d'un composant electronique
KR101271470B1 (ko) * 2011-08-08 2013-06-05 도레이첨단소재 주식회사 전자종이 디스플레이 소자용 유전 점착필름
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
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US8987606B2 (en) 2011-12-13 2015-03-24 Empire Technology Development Llc Elastomer adhesions
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WO2003046098A1 (en) 2003-06-05
US7056129B2 (en) 2006-06-06
US20050118845A1 (en) 2005-06-02
ATE423182T1 (de) 2009-03-15
KR20040070190A (ko) 2004-08-06
JP2005510618A (ja) 2005-04-21
AU2002347631A1 (en) 2003-06-10
KR100913686B1 (ko) 2009-08-24
TW200300589A (en) 2003-06-01
JP4494785B2 (ja) 2010-06-30
EP1448745B1 (de) 2009-02-18
TWI265580B (en) 2006-11-01

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