DE60229205D1 - Methode zur Herstellung eines Datenträgers zur kontaktlosen Datenübertragung - Google Patents
Methode zur Herstellung eines Datenträgers zur kontaktlosen DatenübertragungInfo
- Publication number
- DE60229205D1 DE60229205D1 DE60229205T DE60229205T DE60229205D1 DE 60229205 D1 DE60229205 D1 DE 60229205D1 DE 60229205 T DE60229205 T DE 60229205T DE 60229205 T DE60229205 T DE 60229205T DE 60229205 D1 DE60229205 D1 DE 60229205D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- data transmission
- contactless
- data carrier
- data
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005540 biological transmission Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/06—Insulation of windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48265—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being a discrete passive component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/17—Nitrogen containing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Aerials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001399278 | 2001-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60229205D1 true DE60229205D1 (de) | 2008-11-20 |
Family
ID=19189456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60229205T Expired - Lifetime DE60229205D1 (de) | 2001-12-28 | 2002-12-27 | Methode zur Herstellung eines Datenträgers zur kontaktlosen Datenübertragung |
Country Status (4)
Country | Link |
---|---|
US (2) | US6774470B2 (de) |
EP (1) | EP1324261B1 (de) |
CN (2) | CN1295645C (de) |
DE (1) | DE60229205D1 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2824939B1 (fr) * | 2001-05-16 | 2003-10-10 | A S K | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede |
US7768405B2 (en) * | 2003-12-12 | 2010-08-03 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device and manufacturing method thereof |
US7130234B2 (en) * | 2003-12-12 | 2006-10-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US7405665B2 (en) * | 2003-12-19 | 2008-07-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, RFID tag and label-like object |
US7508305B2 (en) * | 2003-12-26 | 2009-03-24 | Semiconductor Energy Laboratory Co., Ltd. | Packing material, tag, certificate, paper money, and securities |
EP1733334B1 (de) | 2004-04-09 | 2011-05-25 | Semiconductor Energy Laboratory Co., Ltd. | Produktmanagementsystem |
JP2005327104A (ja) * | 2004-05-14 | 2005-11-24 | Oki Electric Ind Co Ltd | 非接触データキャリア、質問器、非接触データキャリアシステム、非接触データキャリアのデータ取得方法、及び、非接触データキャリアのデータ取得用プログラム |
DE102004034768B4 (de) * | 2004-07-19 | 2007-11-15 | Infineon Technologies Ag | Identifikations-Datenträger |
US20060109120A1 (en) * | 2004-11-19 | 2006-05-25 | Jeremy Burr | RFID tag in a substrate |
US7312622B2 (en) * | 2004-12-15 | 2007-12-25 | Impinj, Inc. | Wafer level testing for RFID tags |
US7380190B2 (en) * | 2004-12-15 | 2008-05-27 | Impinj, Inc. | RFID tag with bist circuits |
US7307528B2 (en) * | 2004-12-15 | 2007-12-11 | Impinj, Inc. | RFID tag design with circuitry for wafer level testing |
US7528724B2 (en) * | 2005-02-28 | 2009-05-05 | Impinj, Inc. | On die RFID tag antenna |
US7400255B2 (en) | 2005-02-28 | 2008-07-15 | Impinj, Inc. | Wireless functional testing of RFID tag |
CN100592484C (zh) * | 2005-05-24 | 2010-02-24 | 富士通株式会社 | Ic标签的安装结构及安装用ic芯片 |
US8030138B1 (en) * | 2006-07-10 | 2011-10-04 | National Semiconductor Corporation | Methods and systems of packaging integrated circuits |
DE102007050102A1 (de) * | 2007-10-16 | 2009-04-23 | Smartrac Ip B.V. | Verfahren zur Herstellung eines Übertragungsmoduls sowie Übertragungsmodul |
US20090114345A1 (en) * | 2007-11-07 | 2009-05-07 | Sumitomo Metal Mining Co., Ltd. | Method for manufacturing a substrate for mounting a semiconductor element |
JP5556072B2 (ja) * | 2009-01-07 | 2014-07-23 | ソニー株式会社 | 半導体装置、その製造方法、ミリ波誘電体内伝送装置 |
WO2010089921A1 (ja) | 2009-02-07 | 2010-08-12 | 株式会社 村田製作所 | 平板状コイル付きモジュールの製造方法及び平板状コイル付きモジュール |
JP5333353B2 (ja) * | 2010-06-14 | 2013-11-06 | 住友金属鉱山株式会社 | 半導体素子搭載用基板及びその製造方法 |
EP2718875A1 (de) * | 2011-06-08 | 2014-04-16 | Linxens Holding | Verfahren zur herstellung eines kartenverbinders |
KR101208241B1 (ko) * | 2011-07-12 | 2012-12-04 | 삼성전기주식회사 | 반도체 패키지 |
KR101623953B1 (ko) * | 2012-06-26 | 2016-05-24 | 도요세이칸 그룹 홀딩스 가부시키가이샤 | Rf태그 |
CN104290387B (zh) * | 2013-07-16 | 2016-02-24 | 昆山雅森电子材料科技有限公司 | 天线板专用彩色化油墨保护膜及其制作方法 |
US9431363B1 (en) * | 2014-11-25 | 2016-08-30 | Automated Assembly Corporation | Wire bonded IC components to round wire |
JP6652273B2 (ja) * | 2015-03-13 | 2020-02-19 | 住友電工プリントサーキット株式会社 | 平面コイル素子及び平面コイル素子の製造方法 |
JP6356354B2 (ja) * | 2015-07-22 | 2018-07-11 | アルプス電気株式会社 | 高周波モジュール |
US9595501B1 (en) | 2015-10-30 | 2017-03-14 | Automated Assembly Corporation | Wire bonded electronic devices to round wire |
DE102016118802B4 (de) | 2016-01-29 | 2022-12-08 | Taiwan Semiconductor Manufacturing Co. Ltd. | Drahtloses Ladepaket mit in Spulenmitte integriertem Chip und Herstellungsverfahren dafür |
US9761522B2 (en) * | 2016-01-29 | 2017-09-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wireless charging package with chip integrated in coil center |
JP6609202B2 (ja) * | 2016-03-08 | 2019-11-20 | 株式会社フジクラ | 光電変換装置 |
US10530175B2 (en) * | 2016-08-09 | 2020-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Hexagonal semiconductor package structure |
US10381325B1 (en) | 2017-08-04 | 2019-08-13 | Automated Assembly Corporation | Guide posts for wire bonding |
US10171133B1 (en) | 2018-02-20 | 2019-01-01 | Automated Assembly Corporation | Transponder arrangement |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5336931A (en) * | 1993-09-03 | 1994-08-09 | Motorola, Inc. | Anchoring method for flow formed integrated circuit covers |
EP0786357A4 (de) * | 1994-09-22 | 2000-04-05 | Rohm Co Ltd | Kontaktlose chipkarte und verfahren zur herstellung derselben |
FR2743649B1 (fr) * | 1996-01-17 | 1998-04-03 | Gemplus Card Int | Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication |
DE19701167A1 (de) * | 1997-01-15 | 1998-07-23 | Siemens Ag | Chipkarte |
FR2761527B1 (fr) * | 1997-03-25 | 1999-06-04 | Gemplus Card Int | Procede de fabrication de carte sans contact avec connexion d'antenne par fils soudes |
JPH10337982A (ja) | 1997-06-06 | 1998-12-22 | Denso Corp | 非接触式icカード |
JPH1134553A (ja) * | 1997-07-18 | 1999-02-09 | Rohm Co Ltd | Icモジュール、およびその製造方法、ならびにこれを備えたicカード |
JP3936840B2 (ja) | 1997-12-22 | 2007-06-27 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
DE19840220A1 (de) | 1998-09-03 | 2000-04-20 | Fraunhofer Ges Forschung | Transpondermodul und Verfahren zur Herstellung desselben |
US6373447B1 (en) * | 1998-12-28 | 2002-04-16 | Kawasaki Steel Corporation | On-chip antenna, and systems utilizing same |
JP2001188891A (ja) * | 2000-01-05 | 2001-07-10 | Shinko Electric Ind Co Ltd | 非接触型icカード |
JP3778773B2 (ja) | 2000-05-09 | 2006-05-24 | 三洋電機株式会社 | 板状体および半導体装置の製造方法 |
US6634564B2 (en) * | 2000-10-24 | 2003-10-21 | Dai Nippon Printing Co., Ltd. | Contact/noncontact type data carrier module |
JP2002337268A (ja) * | 2001-05-21 | 2002-11-27 | Nitto Denko Corp | 金属箔積層板及びその製造方法 |
-
2002
- 2002-12-24 US US10/327,657 patent/US6774470B2/en not_active Expired - Fee Related
- 2002-12-27 DE DE60229205T patent/DE60229205D1/de not_active Expired - Lifetime
- 2002-12-27 EP EP20020029038 patent/EP1324261B1/de not_active Expired - Lifetime
- 2002-12-28 CN CNB021456003A patent/CN1295645C/zh not_active Expired - Fee Related
- 2002-12-28 CN CN2006100959451A patent/CN1881241B/zh not_active Expired - Fee Related
-
2004
- 2004-06-01 US US10/856,991 patent/US7018844B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7018844B2 (en) | 2006-03-28 |
US6774470B2 (en) | 2004-08-10 |
CN1295645C (zh) | 2007-01-17 |
CN1881241B (zh) | 2011-06-08 |
CN1432966A (zh) | 2003-07-30 |
EP1324261A1 (de) | 2003-07-02 |
US20030122233A1 (en) | 2003-07-03 |
EP1324261B1 (de) | 2008-10-08 |
US20040219714A1 (en) | 2004-11-04 |
CN1881241A (zh) | 2006-12-20 |
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