DE60216427D1 - Vorrichtung und Verfahren zur Ausrichtung der Fläche eines aktiven Halterrings mit der Fläche einer Halbleiterscheibe während dem chemisch-mechanischen Polieren - Google Patents

Vorrichtung und Verfahren zur Ausrichtung der Fläche eines aktiven Halterrings mit der Fläche einer Halbleiterscheibe während dem chemisch-mechanischen Polieren

Info

Publication number
DE60216427D1
DE60216427D1 DE60216427T DE60216427T DE60216427D1 DE 60216427 D1 DE60216427 D1 DE 60216427D1 DE 60216427 T DE60216427 T DE 60216427T DE 60216427 T DE60216427 T DE 60216427T DE 60216427 D1 DE60216427 D1 DE 60216427D1
Authority
DE
Germany
Prior art keywords
aligning
semiconductor wafer
mechanical polishing
chemical mechanical
wafer during
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60216427T
Other languages
English (en)
Other versions
DE60216427T2 (de
Inventor
Miguel A Saldana
Vincent Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE60216427D1 publication Critical patent/DE60216427D1/de
Publication of DE60216427T2 publication Critical patent/DE60216427T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60216427T 2001-03-29 2002-03-28 Vorrichtung und Verfahren zur Ausrichtung der Fläche eines aktiven Halterrings mit der Fläche einer Halbleiterscheibe während dem chemisch-mechanischen Polieren Expired - Fee Related DE60216427T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/823,169 US6709322B2 (en) 2001-03-29 2001-03-29 Apparatus for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing
US823169 2001-03-29
PCT/US2002/010153 WO2002078900A2 (en) 2001-03-29 2002-03-28 Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing

Publications (2)

Publication Number Publication Date
DE60216427D1 true DE60216427D1 (de) 2007-01-11
DE60216427T2 DE60216427T2 (de) 2007-09-27

Family

ID=25237990

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60216427T Expired - Fee Related DE60216427T2 (de) 2001-03-29 2002-03-28 Vorrichtung und Verfahren zur Ausrichtung der Fläche eines aktiven Halterrings mit der Fläche einer Halbleiterscheibe während dem chemisch-mechanischen Polieren

Country Status (9)

Country Link
US (2) US6709322B2 (de)
EP (2) EP1710047A3 (de)
JP (1) JP2005510855A (de)
KR (1) KR100869135B1 (de)
CN (1) CN100406199C (de)
AU (1) AU2002254492A1 (de)
DE (1) DE60216427T2 (de)
TW (1) TW559924B (de)
WO (1) WO2002078900A2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6709322B2 (en) * 2001-03-29 2004-03-23 Lam Research Corporation Apparatus for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing
US7033252B2 (en) * 2004-03-05 2006-04-25 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
US7296339B1 (en) 2004-09-08 2007-11-20 Western Digital (Fremont), Llc Method for manufacturing a perpendicular magnetic recording head
US7040955B1 (en) * 2005-01-28 2006-05-09 Strasbaugh Chemical-mechanical planarization tool force calibration method and system
US7552523B1 (en) 2005-07-01 2009-06-30 Western Digital (Fremont), Llc Method for manufacturing a perpendicular magnetic recording transducer
US8333008B1 (en) 2005-07-29 2012-12-18 Western Digital (Fremont), Llc Method for manufacturing a perpendicular magnetic recording transducer
US20070049184A1 (en) * 2005-08-24 2007-03-01 International Business Machines Corporation Retaining ring structure for enhanced removal rate during fixed abrasive chemical mechanical polishing
US7508627B1 (en) 2006-03-03 2009-03-24 Western Digital (Fremont), Llc Method and system for providing perpendicular magnetic recording transducers
US20070251832A1 (en) * 2006-04-27 2007-11-01 Applied Materials, Inc. Method and apparatus for electrochemical mechanical polishing of cu with higher liner velocity for better surface finish and higher removal rate during clearance
US8141235B1 (en) 2006-06-09 2012-03-27 Western Digital (Fremont), Llc Method for manufacturing a perpendicular magnetic recording transducers
US8015692B1 (en) 2007-11-07 2011-09-13 Western Digital (Fremont), Llc Method for providing a perpendicular magnetic recording (PMR) head
JP5199691B2 (ja) 2008-02-13 2013-05-15 株式会社荏原製作所 研磨装置
US7997388B2 (en) * 2008-04-15 2011-08-16 Icx Tactical Platforms Corp. Detection platforms
CN101530982B (zh) * 2009-04-13 2011-03-16 西安理工大学 一种改变晶片取向的研磨夹具
US9099118B1 (en) 2009-05-26 2015-08-04 Western Digital (Fremont), Llc Dual damascene process for producing a PMR write pole
US8486285B2 (en) 2009-08-20 2013-07-16 Western Digital (Fremont), Llc Damascene write poles produced via full film plating
TWI639485B (zh) * 2012-01-31 2018-11-01 日商荏原製作所股份有限公司 Substrate holding device, polishing device, and polishing method
CN103586772B (zh) * 2012-08-16 2016-01-06 鸿富锦精密工业（深圳）有限公司 压力检测装置
US9429977B2 (en) * 2012-10-05 2016-08-30 Alstom Technology Ltd Relief spring stop bolt assembly for shallow bowl mills
JP6592355B2 (ja) * 2015-01-30 2019-10-16 株式会社荏原製作所 連結機構および基板研磨装置
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
CN106041512B (zh) * 2016-05-16 2018-06-19 中船航海科技有限责任公司 一种用于方位分罗经装配的同心度校准装置及校准方法
KR102668400B1 (ko) * 2017-01-05 2024-05-24 주식회사 케이씨텍 화학 기계적 연마장치
KR102708236B1 (ko) * 2018-11-28 2024-09-23 주식회사 케이씨텍 화학 기계적 연마 장치용 캐리어 헤드의 리테이너 링 및 이를 구비한 캐리어 헤드
US10903050B2 (en) 2018-12-10 2021-01-26 Lam Research Corporation Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity
CN110181355B (zh) * 2019-06-27 2021-08-17 西安奕斯伟硅片技术有限公司 一种研磨装置、研磨方法及晶圆
CN110411344B (zh) * 2019-08-06 2021-07-20 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种校准方法、校准装置、校准系统及电子设备
US11623321B2 (en) * 2020-10-14 2023-04-11 Applied Materials, Inc. Polishing head retaining ring tilting moment control
CN114178982B (zh) * 2021-12-13 2022-10-28 盐城家安乐自动化科技有限公司 一种卡簧自动打磨设备

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US3505766A (en) * 1964-12-09 1970-04-14 Speedfam Corp Lapping machine truing ring
US3518798A (en) * 1967-08-10 1970-07-07 Speedfam Corp Polishing machine
US3665648A (en) * 1969-12-18 1972-05-30 Yugen Kaisha Yamanaka Seisakus Grinding apparatus
US3631634A (en) * 1970-01-26 1972-01-04 John L Weber Polishing machine
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
JPH08320301A (ja) 1995-03-22 1996-12-03 Horiba Ltd 複数の溶存物質の濃度分布測定装置
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5643061A (en) * 1995-07-20 1997-07-01 Integrated Process Equipment Corporation Pneumatic polishing head for CMP apparatus
US5951373A (en) * 1995-10-27 1999-09-14 Applied Materials, Inc. Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning
JP3106418B2 (ja) * 1996-07-30 2000-11-06 株式会社東京精密 研磨装置
JPH10156712A (ja) 1996-11-29 1998-06-16 Oki Electric Ind Co Ltd ウエハ研磨装置
US6116990A (en) 1997-07-25 2000-09-12 Applied Materials, Inc. Adjustable low profile gimbal system for chemical mechanical polishing
JPH11145978A (ja) 1997-11-12 1999-05-28 Oki Electric Ind Co Ltd 多重化制御装置
JP3006568B2 (ja) * 1997-12-04 2000-02-07 日本電気株式会社 ウエハ研磨装置および研磨方法
EP0992322A4 (de) * 1998-04-06 2006-09-27 Ebara Corp Schleifvorrichtung
TW467792B (en) * 1999-03-11 2001-12-11 Ebara Corp Polishing apparatus including attitude controller for turntable and/or wafer carrier
JP2000334655A (ja) * 1999-05-26 2000-12-05 Matsushita Electric Ind Co Ltd Ｃｍｐ加工装置
US7481695B2 (en) * 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6443815B1 (en) * 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
US6709322B2 (en) * 2001-03-29 2004-03-23 Lam Research Corporation Apparatus for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing

Also Published As

Publication number Publication date
EP1710047A2 (de) 2006-10-11
CN1500029A (zh) 2004-05-26
EP1710047A3 (de) 2006-10-18
US20040102138A1 (en) 2004-05-27
JP2005510855A (ja) 2005-04-21
TW559924B (en) 2003-11-01
AU2002254492A1 (en) 2002-10-15
US20020151254A1 (en) 2002-10-17
CN100406199C (zh) 2008-07-30
US6843707B2 (en) 2005-01-18
WO2002078900A3 (en) 2003-04-10
KR100869135B1 (ko) 2008-11-18
WO2002078900A2 (en) 2002-10-10
KR20030085571A (ko) 2003-11-05
EP1372907A2 (de) 2004-01-02
DE60216427T2 (de) 2007-09-27
US6709322B2 (en) 2004-03-23
EP1372907B1 (de) 2006-11-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee