DE60215291T2 - Halbleiter Speicheranordnung - Google Patents
Halbleiter Speicheranordnung Download PDFInfo
- Publication number
- DE60215291T2 DE60215291T2 DE60215291T DE60215291T DE60215291T2 DE 60215291 T2 DE60215291 T2 DE 60215291T2 DE 60215291 T DE60215291 T DE 60215291T DE 60215291 T DE60215291 T DE 60215291T DE 60215291 T2 DE60215291 T2 DE 60215291T2
- Authority
- DE
- Germany
- Prior art keywords
- block
- circuit
- address
- defective
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 230000002950 deficient Effects 0.000 claims description 102
- 238000001514 detection method Methods 0.000 claims description 50
- 230000007547 defect Effects 0.000 claims description 42
- 102100021568 B-cell scaffold protein with ankyrin repeats Human genes 0.000 claims 1
- 101000971155 Homo sapiens B-cell scaffold protein with ankyrin repeats Proteins 0.000 claims 1
- 210000004027 cell Anatomy 0.000 description 109
- 238000011084 recovery Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- IFLVGRRVGPXYON-UHFFFAOYSA-N adci Chemical compound C12=CC=CC=C2C2(C(=O)N)C3=CC=CC=C3CC1N2 IFLVGRRVGPXYON-UHFFFAOYSA-N 0.000 description 3
- 230000003321 amplification Effects 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 238000010257 thawing Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 102100022103 Histone-lysine N-methyltransferase 2A Human genes 0.000 description 1
- 108050002855 Histone-lysine N-methyltransferase 2A Proteins 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000013872 defecation Effects 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002784 hot electron Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 210000000352 storage cell Anatomy 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/80—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
- G11C29/81—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout using a hierarchical redundancy scheme
Landscapes
- For Increasing The Reliability Of Semiconductor Memories (AREA)
- Tests Of Electronic Circuits (AREA)
- Read Only Memory (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001381412A JP2003187591A (ja) | 2001-12-14 | 2001-12-14 | 半導体記憶装置 |
| JP2001381412 | 2001-12-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60215291D1 DE60215291D1 (de) | 2006-11-23 |
| DE60215291T2 true DE60215291T2 (de) | 2007-05-10 |
Family
ID=19187333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60215291T Expired - Lifetime DE60215291T2 (de) | 2001-12-14 | 2002-12-13 | Halbleiter Speicheranordnung |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6707733B2 (enExample) |
| EP (1) | EP1320105B1 (enExample) |
| JP (1) | JP2003187591A (enExample) |
| KR (1) | KR100470371B1 (enExample) |
| CN (1) | CN1267997C (enExample) |
| DE (1) | DE60215291T2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4235122B2 (ja) * | 2004-02-06 | 2009-03-11 | シャープ株式会社 | 半導体記憶装置及び半導体記憶装置のテスト方法 |
| US7085180B2 (en) * | 2004-02-12 | 2006-08-01 | International Business Machines Corporation | Method and structure for enabling a redundancy allocation during a multi-bank operation |
| JP4722123B2 (ja) * | 2005-02-23 | 2011-07-13 | スパンション エルエルシー | 記憶装置の冗長設定方法、および記憶装置 |
| US7447066B2 (en) * | 2005-11-08 | 2008-11-04 | Sandisk Corporation | Memory with retargetable memory cell redundancy |
| JP5131348B2 (ja) * | 2008-03-19 | 2013-01-30 | 富士通セミコンダクター株式会社 | 半導体メモリ、システム、半導体メモリの動作方法および半導体メモリの製造方法 |
| KR101600280B1 (ko) | 2014-05-28 | 2016-03-21 | 주식회사 피델릭스 | 사용중에 발생되는 결함을 효율적으로 리페어할 수 있는 플래시 메모리 장치 및 그의 리페어 방법 |
| US20160012916A1 (en) * | 2014-07-10 | 2016-01-14 | Kabushiki Kaisha Toshiba | Semiconductor memory device and memory system |
| US9741421B1 (en) * | 2016-04-05 | 2017-08-22 | Micron Technology, Inc. | Refresh circuitry |
| JP7171286B2 (ja) * | 2018-07-20 | 2022-11-15 | ラピスセミコンダクタ株式会社 | 半導体メモリ装置 |
| JP7112904B2 (ja) * | 2018-07-20 | 2022-08-04 | ラピスセミコンダクタ株式会社 | 半導体メモリのテスト方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3019869B2 (ja) * | 1990-10-16 | 2000-03-13 | 富士通株式会社 | 半導体メモリ |
| JP2001052495A (ja) * | 1999-06-03 | 2001-02-23 | Toshiba Corp | 半導体メモリ |
| JP2002015593A (ja) * | 2000-06-27 | 2002-01-18 | Toshiba Corp | 半導体記憶装置 |
| US6552939B1 (en) * | 2001-10-15 | 2003-04-22 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device having disturb test circuit |
-
2001
- 2001-12-14 JP JP2001381412A patent/JP2003187591A/ja active Pending
-
2002
- 2002-12-13 CN CNB021560714A patent/CN1267997C/zh not_active Expired - Fee Related
- 2002-12-13 KR KR10-2002-0079761A patent/KR100470371B1/ko not_active Expired - Fee Related
- 2002-12-13 EP EP02028008A patent/EP1320105B1/en not_active Expired - Lifetime
- 2002-12-13 DE DE60215291T patent/DE60215291T2/de not_active Expired - Lifetime
- 2002-12-13 US US10/318,020 patent/US6707733B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1438707A (zh) | 2003-08-27 |
| KR20030051317A (ko) | 2003-06-25 |
| DE60215291D1 (de) | 2006-11-23 |
| JP2003187591A (ja) | 2003-07-04 |
| EP1320105B1 (en) | 2006-10-11 |
| EP1320105A2 (en) | 2003-06-18 |
| US20030117867A1 (en) | 2003-06-26 |
| EP1320105A3 (en) | 2005-03-09 |
| CN1267997C (zh) | 2006-08-02 |
| KR100470371B1 (ko) | 2005-02-11 |
| US6707733B2 (en) | 2004-03-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |