DE602008002655D1 - Herstellungsverfahren für eine starr-flexible Leiterplatte, Brett das für ein solches Verfahren benutzt wird, und damit verbundenen Leiterplatte und elektrischer Gegenstand - Google Patents
Herstellungsverfahren für eine starr-flexible Leiterplatte, Brett das für ein solches Verfahren benutzt wird, und damit verbundenen Leiterplatte und elektrischer GegenstandInfo
- Publication number
- DE602008002655D1 DE602008002655D1 DE602008002655T DE602008002655T DE602008002655D1 DE 602008002655 D1 DE602008002655 D1 DE 602008002655D1 DE 602008002655 T DE602008002655 T DE 602008002655T DE 602008002655 T DE602008002655 T DE 602008002655T DE 602008002655 D1 DE602008002655 D1 DE 602008002655D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- substrate
- rigid
- flexible
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0705604A FR2919781A1 (fr) | 2007-07-31 | 2007-07-31 | Procede de fabrication d'un circuit imprime semi-flexible, plaque utilisee pour un tel procede, circuit imprime et dispositif electronique associes |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602008002655D1 true DE602008002655D1 (de) | 2010-11-04 |
Family
ID=39166402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602008002655T Active DE602008002655D1 (de) | 2007-07-31 | 2008-07-31 | Herstellungsverfahren für eine starr-flexible Leiterplatte, Brett das für ein solches Verfahren benutzt wird, und damit verbundenen Leiterplatte und elektrischer Gegenstand |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2020833B1 (de) |
AT (1) | ATE482609T1 (de) |
DE (1) | DE602008002655D1 (de) |
FR (1) | FR2919781A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200053887A1 (en) | 2018-08-09 | 2020-02-13 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Mechanically Robust Component Carrier With Rigid and Flexible Portions |
JP7025376B2 (ja) * | 2019-06-17 | 2022-02-24 | 矢崎総業株式会社 | バスバモジュール |
CN112654153B (zh) * | 2020-11-12 | 2023-07-25 | 惠州市金百泽电路科技有限公司 | 一种测控设备高精度光波标尺pcb的加工方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2914336A1 (de) * | 1979-04-09 | 1980-11-06 | Telefonbau & Normalzeit Gmbh | Verfahren zur herstellung starr- flexibler leiterplatten |
DE2946726C2 (de) * | 1979-11-20 | 1982-05-19 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung |
DE3318717C1 (de) * | 1983-05-21 | 1984-05-30 | Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig & Co KG, 8510 Fürth | Verfahren zum Herstellen von Leiterplatten mit starren und flexiblen Bereichen |
DE3417223C2 (de) * | 1984-05-10 | 1986-04-10 | Hans 6052 Mühlheim Keller | Verfahren und Vorrichtung zum paßgenauen Lochen von Filmen bei der Herstellung einer gedruckten Schaltung auf einer gebohrten Rohplatte |
DE3434672C2 (de) * | 1984-09-21 | 1986-09-11 | Fa. Carl Freudenberg, 6940 Weinheim | Verfahren zur Herstellung von flexiblen Leiterplatten für hohe Biegebeanspruchung |
CH667359A5 (de) * | 1985-03-27 | 1988-09-30 | Ppc Electronic Ag | Verfahren zur herstellung einer starre und flexible partien aufweisenden leiterplatte fuer gedruckte elektrische schaltungen. |
DE4003344C1 (de) * | 1990-02-05 | 1991-06-13 | Fa. Carl Freudenberg, 6940 Weinheim, De | |
DE4206746C1 (en) * | 1992-03-04 | 1993-06-24 | Degussa Ag, 6000 Frankfurt, De | Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away |
DE4208610C1 (en) * | 1992-03-18 | 1993-05-19 | Fa. Carl Freudenberg, 6940 Weinheim, De | Rigid-flexible PCB with flexible circuit foil mfg. - having flexible PCB in flexible region with fracture lines in rigid outer layers along rigid-flexible transition allowing rigid part to be removed along fracture lines after processing |
US5499444A (en) * | 1994-08-02 | 1996-03-19 | Coesen, Inc. | Method of manufacturing a rigid flex printed circuit board |
JP3427011B2 (ja) * | 1999-07-19 | 2003-07-14 | 日本メクトロン株式会社 | 可撓性多層回路基板の製造法 |
US7371970B2 (en) * | 2002-12-06 | 2008-05-13 | Flammer Jeffrey D | Rigid-flex circuit board system |
FR2871336B1 (fr) | 2004-06-02 | 2007-01-19 | Bree Ind Soc Par Actions Simpl | Circuit imprime flex-rigide par collage |
FR2871334B1 (fr) | 2004-06-03 | 2008-03-28 | Bree Beauce Realisations Et Et | Circuit imprime semi-flexible |
US20060231198A1 (en) * | 2005-03-15 | 2006-10-19 | Vasoya Kalu K | Manufacturing process: how to construct constraining core material into printed wiring board |
US7234230B1 (en) * | 2005-12-27 | 2007-06-26 | Gold Circuit Electronics Ltd. | Composite circuit board and method for manufacturing the same |
-
2007
- 2007-07-31 FR FR0705604A patent/FR2919781A1/fr not_active Withdrawn
-
2008
- 2008-07-31 AT AT08290744T patent/ATE482609T1/de not_active IP Right Cessation
- 2008-07-31 DE DE602008002655T patent/DE602008002655D1/de active Active
- 2008-07-31 EP EP08290744A patent/EP2020833B1/de not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
ATE482609T1 (de) | 2010-10-15 |
FR2919781A1 (fr) | 2009-02-06 |
EP2020833A1 (de) | 2009-02-04 |
EP2020833B1 (de) | 2010-09-22 |
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