DE602007009810D1 - Verbindung elektronischer anordnungen mit erhöhten leitungen - Google Patents
Verbindung elektronischer anordnungen mit erhöhten leitungenInfo
- Publication number
- DE602007009810D1 DE602007009810D1 DE200760009810 DE602007009810T DE602007009810D1 DE 602007009810 D1 DE602007009810 D1 DE 602007009810D1 DE 200760009810 DE200760009810 DE 200760009810 DE 602007009810 T DE602007009810 T DE 602007009810T DE 602007009810 D1 DE602007009810 D1 DE 602007009810D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- leads
- cables
- increased
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 abstract 6
- 238000000034 method Methods 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Weting (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Measuring Leads Or Probes (AREA)
- Communication Cables (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000478A ITMI20060478A1 (it) | 2006-03-16 | 2006-03-16 | Sistema per contattare dispositivim elettronici e relativo metodo di produzione basato su filo conduttore annegato in materiale isolante |
PCT/EP2007/052497 WO2007104799A1 (en) | 2006-03-16 | 2007-03-16 | Interconnection of electronic devices with raised leads |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602007009810D1 true DE602007009810D1 (de) | 2010-11-25 |
Family
ID=36939154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200760009810 Active DE602007009810D1 (de) | 2006-03-16 | 2007-03-16 | Verbindung elektronischer anordnungen mit erhöhten leitungen |
Country Status (10)
Country | Link |
---|---|
US (1) | US7892954B2 (de) |
EP (1) | EP2002471B1 (de) |
JP (1) | JP5043870B2 (de) |
CN (1) | CN101405852B (de) |
AT (1) | ATE484846T1 (de) |
DE (1) | DE602007009810D1 (de) |
ES (1) | ES2359919T3 (de) |
IT (1) | ITMI20060478A1 (de) |
PL (1) | PL2002471T3 (de) |
WO (1) | WO2007104799A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1395336B1 (it) | 2009-01-20 | 2012-09-14 | Rise Technology S R L | Dispositivo di contatto elastico per componenti elettronici a colonne collassanti |
DE102009008152A1 (de) * | 2009-02-09 | 2010-08-19 | Nb Technologies Gmbh | Siliziumsolarzelle |
US8278748B2 (en) * | 2010-02-17 | 2012-10-02 | Maxim Integrated Products, Inc. | Wafer-level packaged device having self-assembled resilient leads |
ITMI20100407A1 (it) | 2010-03-12 | 2011-09-13 | Rise Technology S R L | Cella foto-voltaica con regioni di semiconduttore poroso per ancorare terminali di contatto |
US8940616B2 (en) | 2012-07-27 | 2015-01-27 | Globalfoundries Singapore Pte. Ltd. | Bonding method using porosified surfaces for making stacked structures |
US8679902B1 (en) | 2012-09-27 | 2014-03-25 | International Business Machines Corporation | Stacked nanowire field effect transistor |
US9126452B2 (en) * | 2013-07-29 | 2015-09-08 | Xerox Corporation | Ultra-fine textured digital lithographic imaging plate and method of manufacture |
EP3286801B1 (de) * | 2015-04-20 | 2022-12-28 | InterDigital Madison Patent Holdings, SAS | Zugentlastender antennenverdrahtungsstecker bei einer elektronischen vorrichtung |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2119567C2 (de) * | 1970-05-05 | 1983-07-14 | International Computers Ltd., London | Elektrische Verbindungsvorrichtung und Verfahren zu ihrer Herstellung |
US4937653A (en) | 1988-07-21 | 1990-06-26 | American Telephone And Telegraph Company | Semiconductor integrated circuit chip-to-chip interconnection scheme |
US5518964A (en) * | 1994-07-07 | 1996-05-21 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation and bonding |
US5989936A (en) * | 1994-07-07 | 1999-11-23 | Tessera, Inc. | Microelectronic assembly fabrication with terminal formation from a conductive layer |
US5763941A (en) * | 1995-10-24 | 1998-06-09 | Tessera, Inc. | Connection component with releasable leads |
AU7491598A (en) * | 1997-05-15 | 1998-12-08 | Formfactor, Inc. | Lithographically defined microelectronic contact structures |
JP2000077477A (ja) * | 1998-09-02 | 2000-03-14 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法並びにこれに用いる金属基板 |
US6405429B1 (en) * | 1999-08-26 | 2002-06-18 | Honeywell Inc. | Microbeam assembly and associated method for integrated circuit interconnection to substrates |
US6461892B2 (en) * | 2000-01-26 | 2002-10-08 | Tessera, Inc. | Methods of making a connection component using a removable layer |
JP2001291850A (ja) * | 2000-04-10 | 2001-10-19 | Hitachi Cable Ltd | 結晶シリコン薄膜の製造方法 |
US6589819B2 (en) * | 2000-09-29 | 2003-07-08 | Tessera, Inc. | Microelectronic packages having an array of resilient leads and methods therefor |
US6632733B2 (en) * | 2001-03-14 | 2003-10-14 | Tessera, Inc. | Components and methods with nested leads |
-
2006
- 2006-03-16 IT IT000478A patent/ITMI20060478A1/it unknown
-
2007
- 2007-03-16 ES ES07726978T patent/ES2359919T3/es active Active
- 2007-03-16 AT AT07726978T patent/ATE484846T1/de not_active IP Right Cessation
- 2007-03-16 CN CN2007800089282A patent/CN101405852B/zh not_active Expired - Fee Related
- 2007-03-16 US US12/293,273 patent/US7892954B2/en active Active
- 2007-03-16 PL PL07726978T patent/PL2002471T3/pl unknown
- 2007-03-16 DE DE200760009810 patent/DE602007009810D1/de active Active
- 2007-03-16 EP EP20070726978 patent/EP2002471B1/de active Active
- 2007-03-16 JP JP2008558829A patent/JP5043870B2/ja not_active Expired - Fee Related
- 2007-03-16 WO PCT/EP2007/052497 patent/WO2007104799A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
PL2002471T3 (pl) | 2011-05-31 |
ATE484846T1 (de) | 2010-10-15 |
EP2002471A1 (de) | 2008-12-17 |
CN101405852B (zh) | 2011-04-13 |
EP2002471B1 (de) | 2010-10-13 |
ES2359919T3 (es) | 2011-05-30 |
JP5043870B2 (ja) | 2012-10-10 |
ITMI20060478A1 (it) | 2007-09-17 |
CN101405852A (zh) | 2009-04-08 |
US7892954B2 (en) | 2011-02-22 |
US20090309098A1 (en) | 2009-12-17 |
WO2007104799A1 (en) | 2007-09-20 |
JP2009530800A (ja) | 2009-08-27 |
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