Classifications

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  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
  • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01L21/4814—Conductive parts
  • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
  • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
  • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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  • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
  • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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  • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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  • H01L2924/30—Technical effects
  • H01L2924/38—Effects and problems related to the device integration
  • H01L2924/381—Pitch distance
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  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
  • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

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• 1998
  • 1998-05-14 WO PCT/US1998/009999 patent/WO1998052224A1/en not_active Application Discontinuation
  • 1998-05-14 JP JP54959498A patent/JP3378259B2/en not_active Expired - Fee Related
  • 1998-05-14 KR KR1019997010532A patent/KR100577132B1/en not_active IP Right Cessation
  • 1998-05-14 AU AU74915/98A patent/AU7491598A/en not_active Abandoned
  • 1998-05-14 KR KR1020047003178A patent/KR100577131B1/en not_active IP Right Cessation
  • 1998-05-14 EP EP98922344A patent/EP0985231A1/en not_active Withdrawn
• 2001
  • 2001-12-12 JP JP2001378598A patent/JP2002231718A/en not_active Withdrawn
• 2002
  • 2002-05-27 JP JP2002152167A patent/JP2003031289A/en active Pending

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