DE602007006442D1 - Harzzusammensetzung - Google Patents

Harzzusammensetzung

Info

Publication number
DE602007006442D1
DE602007006442D1 DE602007006442T DE602007006442T DE602007006442D1 DE 602007006442 D1 DE602007006442 D1 DE 602007006442D1 DE 602007006442 T DE602007006442 T DE 602007006442T DE 602007006442 T DE602007006442 T DE 602007006442T DE 602007006442 D1 DE602007006442 D1 DE 602007006442D1
Authority
DE
Germany
Prior art keywords
mass
alkyl group
carbon atoms
hydrogen
atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007006442T
Other languages
English (en)
Inventor
Hiroshi Uchida
Hirofumi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of DE602007006442D1 publication Critical patent/DE602007006442D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/47—Levelling agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C08L71/03—Polyepihalohydrins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
DE602007006442T 2006-03-17 2007-03-16 Harzzusammensetzung Active DE602007006442D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006074635 2006-03-17
PCT/JP2007/056131 WO2007108550A1 (en) 2006-03-17 2007-03-16 Resin composition

Publications (1)

Publication Number Publication Date
DE602007006442D1 true DE602007006442D1 (de) 2010-06-24

Family

ID=38169405

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007006442T Active DE602007006442D1 (de) 2006-03-17 2007-03-16 Harzzusammensetzung

Country Status (8)

Country Link
US (1) US20090054577A1 (de)
EP (1) EP1996658B1 (de)
KR (1) KR101347637B1 (de)
CN (1) CN101405355B (de)
AT (1) ATE467664T1 (de)
DE (1) DE602007006442D1 (de)
TW (1) TWI429712B (de)
WO (1) WO2007108550A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101687980B (zh) * 2007-07-18 2013-03-27 昭和电工株式会社 热固性树脂组合物
EP2270102A1 (de) * 2008-03-21 2011-01-05 Showa Denko K.K. Harzzusammensetzung und gehärteter film davon
US8319339B2 (en) * 2009-07-10 2012-11-27 Stmicroelectronics (Tours) Sas Surface-mounted silicon chip
CN101693418B (zh) * 2009-10-19 2012-07-25 杭州电子科技大学 一种玻璃纤维网与糊状树脂复合增强薄膜的制备方法
WO2013016594A2 (en) * 2011-07-26 2013-01-31 Virginia Commonwealth University Abhesive coatings
US20180352659A1 (en) * 2015-12-11 2018-12-06 Dic Corporation Thermosetting material used for reinforcing flexible printed circuit board, reinforced flexible printed circuit board, method for producing the reinforced flexible printed circuit board, and electronic device
JP2019529596A (ja) 2016-07-28 2019-10-17 スリーエム イノベイティブ プロパティズ カンパニー セグメント化シリコーンポリアミドブロックコポリマー及びそれを含む物品
JP6837126B6 (ja) 2016-07-28 2021-03-31 スリーエム イノベイティブ プロパティズ カンパニー セグメント化シリコーンポリアミドブロックコポリマー及びそれを含む物品
US10353083B2 (en) * 2017-09-12 2019-07-16 Palo Alto Research Center Incorporated Monolithic digital x-ray detector stack with energy resolution
CN114207033B (zh) * 2019-08-01 2024-04-02 株式会社钟化 热固性树脂组合物、热固性树脂膜、热固化膜、层叠体、以及印刷电路板及其制造方法
CN111638213A (zh) * 2020-07-14 2020-09-08 山东京博石油化工有限公司 一种乙醇胺脱硫液中热稳盐含量的检测方法
EP4225828A1 (de) * 2020-10-05 2023-08-16 PMC Ouvrie Neue antischaummittel
CN112210193A (zh) * 2020-11-26 2021-01-12 武汉市三选科技有限公司 一种高光泽度环氧塑封料芯片保护薄膜及其制备方法
CN113861668B (zh) * 2021-11-17 2023-02-28 尼伦化学(上海)有限公司 一种高折光指数、高耐磨tpu粒子及制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3842966A1 (de) * 1988-12-21 1990-06-28 Bayer Ag Transparente laminate
US5266455A (en) * 1990-05-23 1993-11-30 Eastman Kodak Company Photographic elements containing protective overcoat compositions
US5179147A (en) 1990-05-23 1993-01-12 Eastman Kodak Company Protective overcoat compositions and photographic elements containing same
US5674951A (en) * 1994-05-20 1997-10-07 Gencorp Inc. Abrasion-resistant and low friction coating compositions
US5824461A (en) * 1997-09-17 1998-10-20 Eastman Kodak Company Fluoropolyether containing aqueous coating compositions for an imaging element
CA2322815C (en) * 1998-03-05 2007-03-13 Omnova Solutions Inc. Easily cleanable polymer laminates
JP2001059071A (ja) 1999-08-23 2001-03-06 Mitsui Mining & Smelting Co Ltd ソルダーレジスト塗布液
US6660828B2 (en) * 2001-05-14 2003-12-09 Omnova Solutions Inc. Fluorinated short carbon atom side chain and polar group containing polymer, and flow, or leveling, or wetting agents thereof
JP2003212954A (ja) * 2002-01-21 2003-07-30 Showa Denko Kk リン含有ウレタン（メタ）アクリレート化合物および感光性組成物
JP2003327913A (ja) 2002-05-09 2003-11-19 Hitachi Chem Co Ltd 樹脂ペースト及びその製造方法
JP2004124015A (ja) 2002-10-07 2004-04-22 Hitachi Chem Co Ltd 樹脂組成物及びそれを含む被膜形成材料
US20060286382A1 (en) * 2005-06-16 2006-12-21 Rohm And Haas Electronic Materials Llc Articles

Also Published As

Publication number Publication date
WO2007108550A1 (en) 2007-09-27
EP1996658A1 (de) 2008-12-03
US20090054577A1 (en) 2009-02-26
KR20080108228A (ko) 2008-12-12
EP1996658B1 (de) 2010-05-12
ATE467664T1 (de) 2010-05-15
TWI429712B (zh) 2014-03-11
TW200804510A (en) 2008-01-16
KR101347637B1 (ko) 2014-01-06
CN101405355A (zh) 2009-04-08
CN101405355B (zh) 2012-12-05

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