DE602007001356D1 - Positive Resistzusammensetzung und Verfahren zur Strukturformung damit - Google Patents

Positive Resistzusammensetzung und Verfahren zur Strukturformung damit

Info

Publication number
DE602007001356D1
DE602007001356D1 DE602007001356T DE602007001356T DE602007001356D1 DE 602007001356 D1 DE602007001356 D1 DE 602007001356D1 DE 602007001356 T DE602007001356 T DE 602007001356T DE 602007001356 T DE602007001356 T DE 602007001356T DE 602007001356 D1 DE602007001356 D1 DE 602007001356D1
Authority
DE
Germany
Prior art keywords
group
resist composition
positive resist
atom
structural molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007001356T
Other languages
English (en)
Inventor
Kazuyoshi Mizutani
Kaoru Iwato
Kunihiko Kodama
Masaomi Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of DE602007001356D1 publication Critical patent/DE602007001356D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/108—Polyolefin or halogen containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester
DE602007001356T 2006-03-14 2007-03-13 Positive Resistzusammensetzung und Verfahren zur Strukturformung damit Active DE602007001356D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006069383 2006-03-14

Publications (1)

Publication Number Publication Date
DE602007001356D1 true DE602007001356D1 (de) 2009-08-06

Family

ID=38162250

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007001356T Active DE602007001356D1 (de) 2006-03-14 2007-03-13 Positive Resistzusammensetzung und Verfahren zur Strukturformung damit

Country Status (6)

Country Link
US (1) US7887988B2 (de)
EP (1) EP1835341B1 (de)
KR (1) KR101464215B1 (de)
AT (1) ATE434776T1 (de)
DE (1) DE602007001356D1 (de)
TW (1) TWI400571B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1906247A1 (de) * 2006-09-29 2008-04-02 FUJIFILM Corporation Resistzusammensetzung und Verfahren zur Strukturformung damit
US8110339B2 (en) * 2007-09-06 2012-02-07 Massachusetts Institute Of Technology Multi-tone resist compositions
KR100959841B1 (ko) * 2008-04-14 2010-05-27 금호석유화학 주식회사 화학증폭형 포토레지스트용 공중합체 및 이를 포함하는포토레지스트 조성물
JP5136792B2 (ja) * 2008-11-21 2013-02-06 信越化学工業株式会社 ポジ型レジスト材料及びパターン形成方法
TWI503334B (zh) * 2009-02-19 2015-10-11 Jsr Corp 聚合物及敏輻射線性組成物、及單體
JP5407941B2 (ja) * 2009-03-09 2014-02-05 信越化学工業株式会社 ポジ型レジスト材料並びにこれを用いたパターン形成方法
JP5463963B2 (ja) * 2009-03-09 2014-04-09 信越化学工業株式会社 ポジ型レジスト材料並びにこれを用いたパターン形成方法
JP5565293B2 (ja) 2010-01-08 2014-08-06 信越化学工業株式会社 ポジ型レジスト材料並びにこれを用いたパターン形成方法
JP2011219363A (ja) * 2010-04-02 2011-11-04 Idemitsu Kosan Co Ltd ホモアダマンタン誘導体、その製造方法及びフォトレジスト用感光性材料
JP5740168B2 (ja) * 2010-07-01 2015-06-24 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、並びに、それを用いたレジスト膜、及び、パターン形成方法
JP5434983B2 (ja) 2011-07-27 2014-03-05 信越化学工業株式会社 ポジ型レジスト材料並びにこれを用いたパターン形成方法
JP5655756B2 (ja) 2011-10-03 2015-01-21 信越化学工業株式会社 ポジ型レジスト材料並びにこれを用いたパターン形成方法
JP5655755B2 (ja) 2011-10-03 2015-01-21 信越化学工業株式会社 ポジ型レジスト材料並びにこれを用いたパターン形成方法
JP6585471B2 (ja) * 2014-11-11 2019-10-02 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3287057B2 (ja) * 1993-03-30 2002-05-27 日本ゼオン株式会社 レジスト組成物
US5561194A (en) 1995-03-29 1996-10-01 International Business Machines Corporation Photoresist composition including polyalkylmethacrylate co-polymer of polyhydroxystyrene
JPH09110790A (ja) * 1995-10-16 1997-04-28 Mitsubishi Rayon Co Ltd 新規な（メタ）アクリル酸エステル
US6291130B1 (en) * 1998-07-27 2001-09-18 Fuji Photo Film Co., Ltd. Positive photosensitive composition
JP4424632B2 (ja) 1999-07-13 2010-03-03 三菱レイヨン株式会社 化学増幅型レジスト組成物およびレジストパターン形成方法
US6492086B1 (en) 1999-10-08 2002-12-10 Shipley Company, L.L.C. Phenolic/alicyclic copolymers and photoresists
JP2001166478A (ja) 1999-12-03 2001-06-22 Jsr Corp 感放射線性樹脂組成物
JP2001166474A (ja) 1999-12-03 2001-06-22 Jsr Corp 感放射線性樹脂組成物
JP3989149B2 (ja) * 1999-12-16 2007-10-10 富士フイルム株式会社 電子線またはｘ線用化学増幅系ネガ型レジスト組成物
US6312870B1 (en) 2000-07-19 2001-11-06 Arch Specialty Chemicals, Inc. t-butyl cinnamate polymers and their use in photoresist compositions
KR100734249B1 (ko) * 2000-09-07 2007-07-02 삼성전자주식회사 축합환의 방향족 환을 포함하는 보호기를 가지는 감광성폴리머 및 이를 포함하는 레지스트 조성물
EP1204001B1 (de) * 2000-11-01 2013-09-11 Shin-Etsu Chemical Co., Ltd. Resistzusammensetzung und Mustererzeugungsverfahren
TWI251124B (en) * 2000-12-05 2006-03-11 Nippon Catalytic Chem Ind Photosensitive resin composition, its use, lactone-ring-containing polymer, and production process thereof
JP4595275B2 (ja) 2001-09-28 2010-12-08 住友化学株式会社 化学増幅型ポジ型レジスト組成物
JP4012424B2 (ja) 2002-04-01 2007-11-21 信越化学工業株式会社 ポジ型レジスト材料及びこれを用いたパターン形成方法
JP4662049B2 (ja) * 2005-11-21 2011-03-30 信越化学工業株式会社 ポジ型レジスト材料並びにこれを用いたパターン形成方法

Also Published As

Publication number Publication date
US7887988B2 (en) 2011-02-15
ATE434776T1 (de) 2009-07-15
US20070218407A1 (en) 2007-09-20
EP1835341A1 (de) 2007-09-19
KR101464215B1 (ko) 2014-11-21
TW200801811A (en) 2008-01-01
TWI400571B (zh) 2013-07-01
KR20070093892A (ko) 2007-09-19
EP1835341B1 (de) 2009-06-24

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