DE602006017208D1 - Siebdruckplatte und siebdrucker - Google Patents

Siebdruckplatte und siebdrucker

Info

Publication number
DE602006017208D1
DE602006017208D1 DE602006017208T DE602006017208T DE602006017208D1 DE 602006017208 D1 DE602006017208 D1 DE 602006017208D1 DE 602006017208 T DE602006017208 T DE 602006017208T DE 602006017208 T DE602006017208 T DE 602006017208T DE 602006017208 D1 DE602006017208 D1 DE 602006017208D1
Authority
DE
Germany
Prior art keywords
screen
print
printer
screen printer
screen print
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006017208T
Other languages
English (en)
Inventor
Satoyuki Ojima
Naoki Ishikawa
Hiroyuki Ohtsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd, Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE602006017208D1 publication Critical patent/DE602006017208D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00Printing plates or foils; Materials therefor
    • B41N1/24Stencils; Stencil materials; Carriers therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/34Screens, Frames; Holders therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/34Screens, Frames; Holders therefor
    • B41F15/36Screens, Frames; Holders therefor flat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00Printing plates or foils; Materials therefor
    • B41N1/24Stencils; Stencil materials; Carriers therefor
    • B41N1/248Mechanical details, e.g. fixation holes, reinforcement or guiding means; Perforation lines; Ink holding means; Visually or otherwise detectable marking means; Stencil units
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225Screens or stencils; Holders therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41PINDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00Screen printing machines
    • B41P2215/10Screen printing machines characterised by their constructional features
    • B41P2215/12Screens
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0545Pattern for applying drops or paste; Applying a pattern made of drops or paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Printing Methods (AREA)
  • Screen Printers (AREA)
DE602006017208T 2005-06-17 2006-05-02 Siebdruckplatte und siebdrucker Active DE602006017208D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005178096A JP4917278B2 (ja) 2005-06-17 2005-06-17 スクリーン印刷版およびスクリーン印刷装置
PCT/JP2006/309149 WO2006134734A1 (ja) 2005-06-17 2006-05-02 スクリーン印刷版およびスクリーン印刷装置

Publications (1)

Publication Number Publication Date
DE602006017208D1 true DE602006017208D1 (de) 2010-11-11

Family

ID=37532101

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006017208T Active DE602006017208D1 (de) 2005-06-17 2006-05-02 Siebdruckplatte und siebdrucker

Country Status (11)

Country Link
US (1) US8141484B2 (de)
EP (1) EP1892116B1 (de)
JP (1) JP4917278B2 (de)
KR (1) KR101224853B1 (de)
CN (1) CN101198477B (de)
AU (1) AU2006257127B2 (de)
DE (1) DE602006017208D1 (de)
ES (1) ES2351091T3 (de)
RU (1) RU2007146055A (de)
TW (1) TW200702181A (de)
WO (1) WO2006134734A1 (de)

Families Citing this family (44)

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JP5151242B2 (ja) * 2007-05-11 2013-02-27 凸版印刷株式会社 光透過性電磁波シールド部材の製造方法
DE202008012829U1 (de) * 2008-09-26 2008-12-04 Nb Technologies Gmbh Siebdruckform
WO2011033278A1 (en) * 2009-09-21 2011-03-24 Dtg International Gmbh Printing screens and method of fabricating the same
KR101607883B1 (ko) 2010-12-31 2016-03-31 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 특정 모양의 연마 입자 및 그러한 입자의 형성 방법
CN102848764A (zh) * 2011-06-29 2013-01-02 群康科技(深圳)有限公司 印版及使用该印版的电路板印刷方法与制造的印刷电路板
CN108262695A (zh) 2011-06-30 2018-07-10 圣戈本陶瓷及塑料股份有限公司 包括氮化硅磨粒的磨料制品
EP2726248B1 (de) 2011-06-30 2019-06-19 Saint-Gobain Ceramics & Plastics, Inc. Flüssigphasengesinterte abrasive siliciumcarbidpartikel
CN103826802B (zh) 2011-09-26 2018-06-12 圣戈本陶瓷及塑料股份有限公司 包括磨料颗粒材料的磨料制品,使用磨料颗粒材料的涂布磨料及其形成方法
JP5847331B2 (ja) 2011-12-30 2016-01-20 サン−ゴバン セラミックス アンド プラスティクス,インコーポレイティド 成形研磨粒子の形成
PL2797716T3 (pl) 2011-12-30 2021-07-05 Saint-Gobain Ceramics & Plastics, Inc. Kompozytowe ukształtowane cząstki ścierne i sposób ich formowania
KR20170018102A (ko) 2011-12-30 2017-02-15 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마입자 및 이의 형성방법
US8840696B2 (en) 2012-01-10 2014-09-23 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particles having particular shapes and methods of forming such particles
RU2602581C2 (ru) 2012-01-10 2016-11-20 Сэнт - Гобэйн Керамикс Энд Пластик,Инк. Абразивные частицы, имеющие сложные формы, и способы их формования
EP2830829B1 (de) 2012-03-30 2018-01-10 Saint-Gobain Abrasives, Inc. Schleifmittel mit fibrillierten fasern
CN104540639B (zh) 2012-05-23 2019-01-29 圣戈本陶瓷及塑料股份有限公司 成形磨粒及其形成方法
EP2866977B8 (de) 2012-06-29 2023-01-18 Saint-Gobain Ceramics & Plastics, Inc. Schleifpartikel mit besonderen formen und verfahren zur formung solcher partikel
MX2015004594A (es) 2012-10-15 2015-07-23 Saint Gobain Abrasives Inc Particulas abrasivas que tienen formas particulares y metodos para formar tales particulas.
US9074119B2 (en) 2012-12-31 2015-07-07 Saint-Gobain Ceramics & Plastics, Inc. Particulate materials and methods of forming same
EP4364891A2 (de) 2013-03-29 2024-05-08 Saint-Gobain Abrasives, Inc. Schleifpartikel mit besonderen formen und verfahren zur formung solcher partikel
TW201502263A (zh) 2013-06-28 2015-01-16 Saint Gobain Ceramics 包含成形研磨粒子之研磨物品
WO2015048768A1 (en) 2013-09-30 2015-04-02 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particles and methods of forming same
CN104582300A (zh) * 2013-10-18 2015-04-29 重庆方正高密电子有限公司 一种线路板防焊底片和线路板制造方法
CN106029301B (zh) 2013-12-31 2018-09-18 圣戈班磨料磨具有限公司 包括成形磨粒的研磨制品
US9771507B2 (en) 2014-01-31 2017-09-26 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle including dopant material and method of forming same
BR112016023880A2 (pt) 2014-04-14 2017-08-15 Saint Gobain Ceramics artigo abrasivo incluindo partículas abrasivas moldadas
US10557067B2 (en) 2014-04-14 2020-02-11 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
US9902045B2 (en) 2014-05-30 2018-02-27 Saint-Gobain Abrasives, Inc. Method of using an abrasive article including shaped abrasive particles
US10137528B2 (en) * 2014-12-15 2018-11-27 Autodie Llc Blank etching fixture
US9914864B2 (en) 2014-12-23 2018-03-13 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particles and method of forming same
US9707529B2 (en) 2014-12-23 2017-07-18 Saint-Gobain Ceramics & Plastics, Inc. Composite shaped abrasive particles and method of forming same
US9676981B2 (en) 2014-12-24 2017-06-13 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle fractions and method of forming same
TWI634200B (zh) 2015-03-31 2018-09-01 聖高拜磨料有限公司 固定磨料物品及其形成方法
US10196551B2 (en) 2015-03-31 2019-02-05 Saint-Gobain Abrasives, Inc. Fixed abrasive articles and methods of forming same
CN115781499A (zh) 2015-06-11 2023-03-14 圣戈本陶瓷及塑料股份有限公司 包括经成形研磨颗粒的研磨制品
TWI554838B (zh) * 2015-07-21 2016-10-21 茂迪股份有限公司 具有良好漿料印刷性之網版
DE112016002917T5 (de) 2015-07-22 2018-03-15 Shin-Etsu Chemical Co., Ltd. Siebdruckvorrichtung, Siebdruckverfahren und Elektrodenbildungsverfahren für eine Solarbatterie
KR102313436B1 (ko) 2016-05-10 2021-10-19 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 연마 입자들 및 그 형성 방법
ES2922927T3 (es) 2016-05-10 2022-09-21 Saint Gobain Ceramics & Plastics Inc Procedimientos de formación de partículas abrasivas
US11230653B2 (en) 2016-09-29 2022-01-25 Saint-Gobain Abrasives, Inc. Fixed abrasive articles and methods of forming same
US10563105B2 (en) 2017-01-31 2020-02-18 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
US10759024B2 (en) 2017-01-31 2020-09-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
CN110719946B (zh) 2017-06-21 2022-07-15 圣戈本陶瓷及塑料股份有限公司 颗粒材料及其形成方法
CN114867582A (zh) 2019-12-27 2022-08-05 圣戈本陶瓷及塑料股份有限公司 磨料制品及其形成方法
CN111845038A (zh) * 2020-07-30 2020-10-30 仓和精密制造(苏州)有限公司 增加疏水疏油性的印刷网版及其制作方法

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JPH05270161A (ja) 1991-07-08 1993-10-19 Dainippon Screen Mfg Co Ltd スクリーン印刷版
JP3656684B2 (ja) * 1996-11-21 2005-06-08 リコーマイクロエレクトロニクス株式会社 粒子入ペースト用印刷マスク及びその製造装置
JPH10329444A (ja) 1997-05-29 1998-12-15 Sumitomo Metal Mining Co Ltd スクリーン印刷用マスク
JP3072832B2 (ja) 1997-06-04 2000-08-07 キヤノン株式会社 光電変換体
JP3279239B2 (ja) * 1997-11-20 2002-04-30 株式会社村田製作所 厚膜形成用ペーストの印刷方法
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JP2002373995A (ja) * 2001-06-15 2002-12-26 Honda Motor Co Ltd 太陽電池の製造方法
JP2004195858A (ja) * 2002-12-19 2004-07-15 Sharp Corp スクリーンマスク、それを用いた厚膜印刷基板の製造方法および厚膜印刷基板
JP4322082B2 (ja) 2003-10-02 2009-08-26 シャープ株式会社 太陽電池の製造方法

Also Published As

Publication number Publication date
US8141484B2 (en) 2012-03-27
EP1892116B1 (de) 2010-09-29
ES2351091T3 (es) 2011-01-31
KR101224853B1 (ko) 2013-01-22
EP1892116A1 (de) 2008-02-27
EP1892116A4 (de) 2009-07-08
CN101198477B (zh) 2010-09-22
AU2006257127B2 (en) 2011-04-28
AU2006257127A1 (en) 2006-12-21
RU2007146055A (ru) 2009-07-27
JP4917278B2 (ja) 2012-04-18
WO2006134734A1 (ja) 2006-12-21
KR20080026543A (ko) 2008-03-25
CN101198477A (zh) 2008-06-11
JP2006347077A (ja) 2006-12-28
TWI348971B (de) 2011-09-21
TW200702181A (en) 2007-01-16
US20080196608A1 (en) 2008-08-21

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