DE602006012825D1 - Phasenwechsel-Speichervorrichtung - Google Patents
Phasenwechsel-SpeichervorrichtungInfo
- Publication number
- DE602006012825D1 DE602006012825D1 DE602006012825T DE602006012825T DE602006012825D1 DE 602006012825 D1 DE602006012825 D1 DE 602006012825D1 DE 602006012825 T DE602006012825 T DE 602006012825T DE 602006012825 T DE602006012825 T DE 602006012825T DE 602006012825 D1 DE602006012825 D1 DE 602006012825D1
- Authority
- DE
- Germany
- Prior art keywords
- memory device
- phase change
- change memory
- phase
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5678—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using amorphous/crystalline phase transition storage elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/004—Reading or sensing circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/02—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
- H10B63/24—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes of the Ovonic threshold switching type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
- H10N70/8413—Electrodes adapted for resistive heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8825—Selenides, e.g. GeSe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/004—Reading or sensing circuits or methods
- G11C2013/0054—Read is performed on a reference element, e.g. cell, and the reference sensed value is used to compare the sensed value of the selected cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/79—Array wherein the access device being a transistor
Landscapes
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06425531A EP1883113B1 (en) | 2006-07-27 | 2006-07-27 | Phase change memory device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE602006012825D1 true DE602006012825D1 (de) | 2010-04-22 |
Family
ID=37667678
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE602006012825T Active DE602006012825D1 (de) | 2006-07-27 | 2006-07-27 | Phasenwechsel-Speichervorrichtung |
| DE112007001750T Withdrawn DE112007001750T5 (de) | 2006-07-27 | 2007-07-26 | Phasenwechselspeicherbauelement |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112007001750T Withdrawn DE112007001750T5 (de) | 2006-07-27 | 2007-07-26 | Phasenwechselspeicherbauelement |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US8553453B2 (enExample) |
| EP (1) | EP1883113B1 (enExample) |
| JP (1) | JP5172836B2 (enExample) |
| KR (1) | KR101390456B1 (enExample) |
| CN (1) | CN101443914B (enExample) |
| DE (2) | DE602006012825D1 (enExample) |
| WO (1) | WO2008012342A1 (enExample) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE602006012825D1 (de) | 2006-07-27 | 2010-04-22 | St Microelectronics Srl | Phasenwechsel-Speichervorrichtung |
| US7936593B2 (en) * | 2008-04-08 | 2011-05-03 | Ovonyx, Inc. | Reducing drift in chalcogenide devices |
| US8228719B2 (en) * | 2008-06-06 | 2012-07-24 | Ovonyx, Inc. | Thin film input/output |
| US7936590B2 (en) * | 2008-12-08 | 2011-05-03 | Qualcomm Incorporated | Digitally-controllable delay for sense amplifier |
| WO2010076834A1 (en) | 2008-12-31 | 2010-07-08 | Ferdinando Bedeschi | Reliable set operation for phase-change memory cell |
| US8374022B2 (en) * | 2009-12-21 | 2013-02-12 | Intel Corporation | Programming phase change memories using ovonic threshold switches |
| US8847186B2 (en) * | 2009-12-31 | 2014-09-30 | Micron Technology, Inc. | Self-selecting PCM device not requiring a dedicated selector transistor |
| US8194441B2 (en) * | 2010-09-23 | 2012-06-05 | Micron Technology, Inc. | Phase change memory state determination using threshold edge detection |
| US8649212B2 (en) * | 2010-09-24 | 2014-02-11 | Intel Corporation | Method, apparatus and system to determine access information for a phase change memory |
| US8467237B2 (en) * | 2010-10-15 | 2013-06-18 | Micron Technology, Inc. | Read distribution management for phase change memory |
| US8909849B2 (en) * | 2010-11-15 | 2014-12-09 | Intel Corporation | Pipeline architecture for scalable performance on memory |
| US8486743B2 (en) | 2011-03-23 | 2013-07-16 | Micron Technology, Inc. | Methods of forming memory cells |
| KR101699713B1 (ko) | 2011-09-14 | 2017-01-26 | 인텔 코포레이션 | 저항 변화 메모리 소자용 전극 |
| KR20130033018A (ko) * | 2011-09-26 | 2013-04-03 | 에스케이하이닉스 주식회사 | 디스터번스를 줄일 수 있는 반도체 집적 회로 시스템 및 그 구동방법 |
| US8994489B2 (en) | 2011-10-19 | 2015-03-31 | Micron Technology, Inc. | Fuses, and methods of forming and using fuses |
| US8723155B2 (en) | 2011-11-17 | 2014-05-13 | Micron Technology, Inc. | Memory cells and integrated devices |
| US8546231B2 (en) | 2011-11-17 | 2013-10-01 | Micron Technology, Inc. | Memory arrays and methods of forming memory cells |
| US9252188B2 (en) | 2011-11-17 | 2016-02-02 | Micron Technology, Inc. | Methods of forming memory cells |
| US8680499B2 (en) | 2012-01-23 | 2014-03-25 | Micron Technology, Inc. | Memory cells |
| US9136467B2 (en) | 2012-04-30 | 2015-09-15 | Micron Technology, Inc. | Phase change memory cells and methods of forming phase change memory cells |
| US8765555B2 (en) | 2012-04-30 | 2014-07-01 | Micron Technology, Inc. | Phase change memory cells and methods of forming phase change memory cells |
| US20140063930A1 (en) * | 2012-08-28 | 2014-03-06 | Being Advanced Memory Corporation | Processors and Systems with Drift-Tolerant Phase-Change Memory Data Storage |
| US9281061B2 (en) * | 2012-09-19 | 2016-03-08 | Micron Technology, Inc. | Methods and apparatuses having a voltage generator with an adjustable voltage drop for representing a voltage drop of a memory cell and/or a current mirror circuit and replica circuit |
| US8861736B2 (en) * | 2012-11-19 | 2014-10-14 | International Business Machines Corporation | Reliable physical unclonable function for device authentication |
| US8988926B2 (en) | 2013-01-11 | 2015-03-24 | Micron Technology, Inc. | Method, system and device for phase change memory with shunt |
| US9553262B2 (en) | 2013-02-07 | 2017-01-24 | Micron Technology, Inc. | Arrays of memory cells and methods of forming an array of memory cells |
| JP6151650B2 (ja) * | 2014-01-17 | 2017-06-21 | ソニーセミコンダクタソリューションズ株式会社 | 記憶装置 |
| US9881971B2 (en) | 2014-04-01 | 2018-01-30 | Micron Technology, Inc. | Memory arrays |
| US9362494B2 (en) | 2014-06-02 | 2016-06-07 | Micron Technology, Inc. | Array of cross point memory cells and methods of forming an array of cross point memory cells |
| US9343506B2 (en) | 2014-06-04 | 2016-05-17 | Micron Technology, Inc. | Memory arrays with polygonal memory cells having specific sidewall orientations |
| US9911491B2 (en) * | 2014-07-31 | 2018-03-06 | Hewlett Packard Enterprise Development Lp | Determining a resistance state of a cell in a crossbar memory array |
| FR3029342B1 (fr) * | 2014-12-01 | 2018-01-12 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Circuit de lecture pour memoire resistive |
| US9543004B1 (en) | 2015-06-17 | 2017-01-10 | Intel Corporation | Provision of holding current in non-volatile random access memory |
| JP6538497B2 (ja) * | 2015-09-11 | 2019-07-03 | 株式会社東芝 | 半導体集積回路 |
| US9478286B1 (en) * | 2015-12-26 | 2016-10-25 | Intel Corporation | Transient current-protected threshold switching devices systems and methods |
| US10192616B2 (en) * | 2016-06-28 | 2019-01-29 | Western Digital Technologies, Inc. | Ovonic threshold switch (OTS) driver/selector uses unselect bias to pre-charge memory chip circuit and reduces unacceptable false selects |
| KR102673120B1 (ko) * | 2016-12-05 | 2024-06-05 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
| KR102619682B1 (ko) * | 2016-12-13 | 2023-12-28 | 삼성전자주식회사 | 메모리 장치 및 그 동작 방법 |
| US10395733B2 (en) | 2017-12-21 | 2019-08-27 | Macronix International Co., Ltd. | Forming structure and method for integrated circuit memory |
| US11082241B2 (en) * | 2018-03-30 | 2021-08-03 | Intel Corporation | Physically unclonable function with feed-forward addressing and variable latency output |
| US10424372B1 (en) * | 2018-04-19 | 2019-09-24 | Micron Technology, Inc. | Apparatuses and methods for sensing memory cells |
| KR20210021462A (ko) * | 2018-06-22 | 2021-02-26 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 기억 제어 장치, 기억 장치 및 기억 제어 방법 |
| US11769046B2 (en) * | 2019-03-14 | 2023-09-26 | International Business Machines Corporation | Symmetric phase-change memory devices |
| US10903422B2 (en) | 2019-04-11 | 2021-01-26 | International Business Machines Corporation | Vertically oriented memory structure |
| FR3096827A1 (fr) * | 2019-05-28 | 2020-12-04 | Stmicroelectronics (Crolles 2) Sas | Mémoire à changement de phase |
| KR102632690B1 (ko) | 2019-06-13 | 2024-02-01 | 삼성전자주식회사 | 비휘발성 메모리 장치 및 그 프로그램 방법 |
| US11004508B2 (en) | 2019-08-30 | 2021-05-11 | Sandisk Technologies Llc | One selector one resistor RAM threshold voltage drift and offset voltage compensation methods |
| KR102805359B1 (ko) * | 2019-11-14 | 2025-05-12 | 삼성전자주식회사 | 비트라인 전압을 제어하는 저항성 메모리 장치 |
| US11139025B2 (en) | 2020-01-22 | 2021-10-05 | International Business Machines Corporation | Multi-level cell threshold voltage operation of one-selector-one-resistor structure included in a crossbar array |
| US11164628B2 (en) * | 2020-02-21 | 2021-11-02 | International Business Machines Corporation | Compensating PCM drift for neuromorphic applications |
| US11087854B1 (en) * | 2020-03-05 | 2021-08-10 | Intel Corporation | High current fast read scheme for crosspoint memory |
| US11665983B2 (en) * | 2020-12-11 | 2023-05-30 | International Business Machines Corporation | Phase change memory cell with ovonic threshold switch |
| CN112699628B (zh) * | 2020-12-29 | 2022-04-12 | 华中科技大学 | 一种三维相变存储器的ots+pcm单元模拟系统 |
| US11527287B1 (en) * | 2021-05-27 | 2022-12-13 | Micron Technology, Inc. | Drift aware read operations |
| US11990182B2 (en) * | 2021-06-24 | 2024-05-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Operation methods for ovonic threshold selector, memory device and memory array |
| CN114171098B (zh) * | 2021-11-22 | 2025-10-21 | 长江存储科技有限责任公司 | 一种异常字线的测试方法、装置、存储器及存储器系统 |
| US20240407178A1 (en) * | 2023-06-05 | 2024-12-05 | International Business Machines Corporation | Phase change memory cell with crystalline structure aligned to seed layer |
| CN119360920B (zh) * | 2024-09-24 | 2025-11-07 | 新存科技(武汉)有限责任公司 | 存储器的操作方法以及存储器和存储系统 |
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| US3271591A (en) | 1963-09-20 | 1966-09-06 | Energy Conversion Devices Inc | Symmetrical current controlling device |
| US3573757A (en) | 1968-11-04 | 1971-04-06 | Energy Conversion Devices Inc | Memory matrix having serially connected threshold and memory switch devices at each cross-over point |
| CA1322258C (en) | 1988-01-19 | 1993-09-14 | Thomas S. Buzak | Apparatus for and methods of addressing data storage elements |
| US5825046A (en) | 1996-10-28 | 1998-10-20 | Energy Conversion Devices, Inc. | Composite memory material comprising a mixture of phase-change memory material and dielectric material |
| US5912839A (en) | 1998-06-23 | 1999-06-15 | Energy Conversion Devices, Inc. | Universal memory element and method of programming same |
| US6490203B1 (en) | 2001-05-24 | 2002-12-03 | Edn Silicon Devices, Inc. | Sensing scheme of flash EEPROM |
| US6590807B2 (en) * | 2001-08-02 | 2003-07-08 | Intel Corporation | Method for reading a structural phase-change memory |
| DE60137788D1 (de) | 2001-12-27 | 2009-04-09 | St Microelectronics Srl | Architektur einer nichtflüchtigen Phasenwechsel -Speichermatrix |
| US7116593B2 (en) * | 2002-02-01 | 2006-10-03 | Hitachi, Ltd. | Storage device |
| JP4049604B2 (ja) * | 2002-04-03 | 2008-02-20 | 株式会社ルネサステクノロジ | 薄膜磁性体記憶装置 |
| JP2004062922A (ja) * | 2002-07-25 | 2004-02-26 | Renesas Technology Corp | 不揮発性半導体記憶装置 |
| JP4113423B2 (ja) * | 2002-12-04 | 2008-07-09 | シャープ株式会社 | 半導体記憶装置及びリファレンスセルの補正方法 |
| DE60323202D1 (de) * | 2003-02-21 | 2008-10-09 | St Microelectronics Srl | Phasenwechselspeicheranordnung |
| US6965521B2 (en) * | 2003-07-31 | 2005-11-15 | Bae Systems, Information And Electronics Systems Integration, Inc. | Read/write circuit for accessing chalcogenide non-volatile memory cells |
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| JP4192060B2 (ja) * | 2003-09-12 | 2008-12-03 | シャープ株式会社 | 不揮発性半導体記憶装置 |
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| DE602005025323D1 (de) | 2005-06-03 | 2011-01-27 | St Microelectronics Srl | Verfahren zum Programmieren von Phasenübergangsspeicherzellen mit mehrfachen Speicherniveaus mithilfe eines Perkolationsalgorithmus |
| US20060279979A1 (en) * | 2005-06-13 | 2006-12-14 | Tyler Lowrey | Method of reading phase-change memory elements |
| US7656710B1 (en) * | 2005-07-14 | 2010-02-02 | Sau Ching Wong | Adaptive operations for nonvolatile memories |
| EP1843356A1 (en) * | 2006-04-03 | 2007-10-10 | STMicroelectronics S.r.l. | Method and system for refreshing a memory device during reading thereof |
| US7286429B1 (en) * | 2006-04-24 | 2007-10-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | High speed sensing amplifier for an MRAM cell |
| DE602006012825D1 (de) | 2006-07-27 | 2010-04-22 | St Microelectronics Srl | Phasenwechsel-Speichervorrichtung |
| JP5060191B2 (ja) * | 2007-07-18 | 2012-10-31 | 株式会社東芝 | 抵抗変化メモリ装置のデータ書き込み方法 |
| US7688634B2 (en) * | 2007-08-06 | 2010-03-30 | Qimonda Ag | Method of operating an integrated circuit having at least one memory cell |
-
2006
- 2006-07-27 DE DE602006012825T patent/DE602006012825D1/de active Active
- 2006-07-27 EP EP06425531A patent/EP1883113B1/en active Active
-
2007
- 2007-07-26 WO PCT/EP2007/057706 patent/WO2008012342A1/en not_active Ceased
- 2007-07-26 DE DE112007001750T patent/DE112007001750T5/de not_active Withdrawn
- 2007-07-26 US US12/442,392 patent/US8553453B2/en active Active
- 2007-07-26 JP JP2009521273A patent/JP5172836B2/ja active Active
- 2007-07-26 KR KR1020097003416A patent/KR101390456B1/ko active Active
- 2007-07-26 CN CN2007800171516A patent/CN101443914B/zh active Active
-
2013
- 2013-10-07 US US14/047,605 patent/US9064565B2/en active Active
-
2015
- 2015-06-22 US US14/746,483 patent/US9779805B2/en active Active
-
2017
- 2017-08-25 US US15/686,308 patent/US10482954B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP1883113A1 (en) | 2008-01-30 |
| CN101443914B (zh) | 2011-08-17 |
| WO2008012342A1 (en) | 2008-01-31 |
| US20100165719A1 (en) | 2010-07-01 |
| US20150287458A1 (en) | 2015-10-08 |
| US9064565B2 (en) | 2015-06-23 |
| US8553453B2 (en) | 2013-10-08 |
| KR101390456B1 (ko) | 2014-04-29 |
| CN101443914A (zh) | 2009-05-27 |
| EP1883113B1 (en) | 2010-03-10 |
| KR20090042925A (ko) | 2009-05-04 |
| JP2009545095A (ja) | 2009-12-17 |
| DE112007001750T5 (de) | 2009-08-20 |
| US20140036583A1 (en) | 2014-02-06 |
| US20170352414A1 (en) | 2017-12-07 |
| US9779805B2 (en) | 2017-10-03 |
| JP5172836B2 (ja) | 2013-03-27 |
| US10482954B2 (en) | 2019-11-19 |
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