DE602006004074D1 - Verfahren zur formung eines entfernbaren randerweiterungselements - Google Patents

Verfahren zur formung eines entfernbaren randerweiterungselements

Info

Publication number
DE602006004074D1
DE602006004074D1 DE602006004074T DE602006004074T DE602006004074D1 DE 602006004074 D1 DE602006004074 D1 DE 602006004074D1 DE 602006004074 T DE602006004074 T DE 602006004074T DE 602006004074 T DE602006004074 T DE 602006004074T DE 602006004074 D1 DE602006004074 D1 DE 602006004074D1
Authority
DE
Germany
Prior art keywords
microelectronic substrate
front surface
edge
article
peripheral edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006004074T
Other languages
English (en)
Inventor
Charles Koburger Iii
Steven Holmes
David Horak
Kurt Kimmel
Karen Petrillo
Christopher Robinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE602006004074D1 publication Critical patent/DE602006004074D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
DE602006004074T 2005-09-22 2006-09-05 Verfahren zur formung eines entfernbaren randerweiterungselements Active DE602006004074D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/162,765 US8202460B2 (en) 2005-09-22 2005-09-22 Microelectronic substrate having removable edge extension element
PCT/EP2006/066034 WO2007039381A1 (en) 2005-09-22 2006-09-05 Microelectronic substrate having removable edge extension element

Publications (1)

Publication Number Publication Date
DE602006004074D1 true DE602006004074D1 (de) 2009-01-15

Family

ID=37309272

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006004074T Active DE602006004074D1 (de) 2005-09-22 2006-09-05 Verfahren zur formung eines entfernbaren randerweiterungselements

Country Status (9)

Country Link
US (2) US8202460B2 (de)
EP (1) EP1927031B1 (de)
JP (1) JP4629777B2 (de)
KR (1) KR101013050B1 (de)
CN (1) CN101263431B (de)
AT (1) ATE416399T1 (de)
DE (1) DE602006004074D1 (de)
TW (1) TW200713417A (de)
WO (1) WO2007039381A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017113016A1 (en) 2015-12-31 2017-07-06 Cfs Concrete Forming Systems Inc. Structure-lining apparatus with adjustable width and tool for same
CA3056152C (en) 2017-04-03 2023-07-25 Cfs Concrete Forming Systems Inc. Longspan stay-in-place liners
AU2018386751A1 (en) 2017-12-22 2020-08-06 Cfs Concrete Forming Systems Inc. Snap-together standoffs for restoring, repairing, reinforcing, protecting, insulating and/or cladding structures
CA3128405A1 (en) 2019-02-08 2020-08-13 Cfs Concrete Forming Systems Inc. Retainers for restoring, repairing, reinforcing, protecting, insulating and/or cladding structures

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7904113A (nl) * 1979-05-25 1980-11-27 Philips Nv Optisch uitleesbare informatieschijf, werkwijze voor de vervaardiging ervan alsmede een inrichting voor het uitvoeren van deze werkwijze.
JPH01163027A (ja) * 1987-12-21 1989-06-27 Matsushita Electric Ind Co Ltd 光学素子の成形方法およびその装置
JPH01164034A (ja) 1987-12-21 1989-06-28 Nec Corp ウェハース周辺部膜厚均一化機構
JPH04284629A (ja) 1991-03-13 1992-10-09 Kyushu Electron Metal Co Ltd 半導体基板の製造方法
JP2753930B2 (ja) * 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
US5300175A (en) * 1993-01-04 1994-04-05 Motorola, Inc. Method for mounting a wafer to a submount
SG92685A1 (en) 1999-03-10 2002-11-19 Towa Corp Method of coating semiconductor wafer with resin and mold used therefor
JP4011781B2 (ja) 1999-03-10 2007-11-21 Ｔｏｗａ株式会社 半導体ウェーハの樹脂被覆方法
JP4253393B2 (ja) 1999-03-10 2009-04-08 Ｔｏｗａ株式会社 半導体ウェーハの樹脂被覆方法及び金型
JP2001093867A (ja) 1999-09-21 2001-04-06 Rodel Nitta Kk ウエハ外周部の保護部材及びウエハの研磨方法
WO2002091078A1 (en) * 2001-05-07 2002-11-14 Massachusetts Institute Of Technology Methods and apparatus employing an index matching medium
DE10210899A1 (de) * 2002-03-08 2003-09-18 Zeiss Carl Smt Ag Refraktives Projektionsobjektiv für Immersions-Lithographie
JP4159029B2 (ja) * 2002-09-11 2008-10-01 コバレントマテリアル株式会社 セラミックス製プレート
US6788477B2 (en) * 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
EP1429188B1 (de) 2002-11-12 2013-06-19 ASML Netherlands B.V. Lithographischer Projektionsapparat
SG121819A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7713841B2 (en) * 2003-09-19 2010-05-11 Micron Technology, Inc. Methods for thinning semiconductor substrates that employ support structures formed on the substrates
JP4572539B2 (ja) 2004-01-19 2010-11-04 株式会社ニコン 露光装置及び露光方法、デバイス製造方法
US7501226B2 (en) * 2004-06-23 2009-03-10 Taiwan Semiconductor Manufacturing Co., Ltd. Immersion lithography system with wafer sealing mechanisms
JP4284629B2 (ja) 2004-07-01 2009-06-24 収 伊藤 コーナーキャンバス巻取り軸とコーナーオーニング装置

Also Published As

Publication number Publication date
CN101263431A (zh) 2008-09-10
EP1927031A1 (de) 2008-06-04
CN101263431B (zh) 2010-05-26
KR20080058336A (ko) 2008-06-25
JP2009509349A (ja) 2009-03-05
TW200713417A (en) 2007-04-01
US20120241913A1 (en) 2012-09-27
ATE416399T1 (de) 2008-12-15
JP4629777B2 (ja) 2011-02-09
KR101013050B1 (ko) 2011-02-14
EP1927031B1 (de) 2008-12-03
WO2007039381A1 (en) 2007-04-12
US8202460B2 (en) 2012-06-19
US8946866B2 (en) 2015-02-03
US20070063392A1 (en) 2007-03-22

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Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition