DE602005021812D1 - Positiv lichtempfindliche isolierende harzzusammensetzung und ausgehärtetes produkt davon - Google Patents
Positiv lichtempfindliche isolierende harzzusammensetzung und ausgehärtetes produkt davonInfo
- Publication number
- DE602005021812D1 DE602005021812D1 DE602005021812T DE602005021812T DE602005021812D1 DE 602005021812 D1 DE602005021812 D1 DE 602005021812D1 DE 602005021812 T DE602005021812 T DE 602005021812T DE 602005021812 T DE602005021812 T DE 602005021812T DE 602005021812 D1 DE602005021812 D1 DE 602005021812D1
- Authority
- DE
- Germany
- Prior art keywords
- group
- compound
- cured product
- resin composition
- insulating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/12—Hydrolysis
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/12—Monomers containing a branched unsaturated aliphatic radical or a ring substituted by an alkyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
- C08F212/22—Oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
- C08F212/22—Oxygen
- C08F212/24—Phenols or alcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/38—Block or graft polymers prepared by polycondensation of aldehydes or ketones onto macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
- C09D125/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/281—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
- C08K5/28—Azides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Emergency Medicine (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- General Chemical & Material Sciences (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Formation Of Insulating Films (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004316655 | 2004-10-29 | ||
JP2004316656 | 2004-10-29 | ||
PCT/JP2005/019865 WO2006046687A1 (ja) | 2004-10-29 | 2005-10-28 | ポジ型感光性絶縁樹脂組成物およびその硬化物 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005021812D1 true DE602005021812D1 (de) | 2010-07-22 |
Family
ID=36227926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005021812T Active DE602005021812D1 (de) | 2004-10-29 | 2005-10-28 | Positiv lichtempfindliche isolierende harzzusammensetzung und ausgehärtetes produkt davon |
Country Status (8)
Country | Link |
---|---|
US (1) | US20080097032A1 (de) |
EP (1) | EP1806618B1 (de) |
KR (1) | KR101254349B1 (de) |
AT (1) | ATE470887T1 (de) |
DE (1) | DE602005021812D1 (de) |
IL (1) | IL182838A0 (de) |
TW (1) | TWI390350B (de) |
WO (1) | WO2006046687A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7316844B2 (en) | 2004-01-16 | 2008-01-08 | Brewer Science Inc. | Spin-on protective coatings for wet-etch processing of microelectronic substrates |
US7695890B2 (en) | 2005-09-09 | 2010-04-13 | Brewer Science Inc. | Negative photoresist for silicon KOH etch without silicon nitride |
KR20090055025A (ko) * | 2006-08-29 | 2009-06-01 | 제이에스알 가부시끼가이샤 | 감광성 절연 수지 조성물 및 그의 경화물 |
JP5195428B2 (ja) * | 2006-08-29 | 2013-05-08 | Jsr株式会社 | ネガ型感光性絶縁樹脂組成物及びその硬化物並びにそれを備える回路基板 |
US7709178B2 (en) * | 2007-04-17 | 2010-05-04 | Brewer Science Inc. | Alkaline-resistant negative photoresist for silicon wet-etch without silicon nitride |
EP2674815B1 (de) * | 2007-05-17 | 2016-08-24 | Nissan Chemical Industries, Ltd. | Lichtempfindliches harz und verfahren zum herstellen einer mikrolinse |
US8192642B2 (en) | 2007-09-13 | 2012-06-05 | Brewer Science Inc. | Spin-on protective coatings for wet-etch processing of microelectronic substrates |
JP5585065B2 (ja) * | 2009-01-30 | 2014-09-10 | Jsr株式会社 | 感光性絶縁樹脂組成物及びその硬化物並びに絶縁膜の製造方法 |
JP5451570B2 (ja) * | 2009-10-16 | 2014-03-26 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機el表示装置、及び、液晶表示装置 |
EP2530524B1 (de) * | 2010-01-26 | 2019-05-29 | Nissan Chemical Corporation | Positive resistzusammensetzung sowie verfahren zur herstellung von mikrolinsen |
EP2618216B1 (de) * | 2010-09-16 | 2019-05-29 | Hitachi Chemical Co., Ltd. | Positive lichtempfindliche harzzusammensetzung, verfahren zur herstellung einer lackstruktur und elektronische komponente |
JP5240380B1 (ja) * | 2011-07-05 | 2013-07-17 | Jsr株式会社 | 樹脂組成物、重合体、硬化膜および電子部品 |
EP2916169B1 (de) * | 2012-10-31 | 2020-01-01 | Hitachi Chemical Company, Ltd. | Lichtempfindliche harzzusammensetzung, verfahren zur herstellung eines strukturierten gehärteten films, halbleiterelement und elektronische vorrichtung |
JP5673784B2 (ja) | 2013-02-21 | 2015-02-18 | Jsr株式会社 | 感光性組成物、硬化膜およびその製造方法ならびに電子部品 |
TWI524141B (zh) * | 2014-06-27 | 2016-03-01 | 奇美實業股份有限公司 | 感光性樹脂組成物、保護膜及具有保護膜之元件 |
JP6688811B2 (ja) * | 2015-12-25 | 2020-04-28 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜の生産方法、パターン形成方法、及び、電子デバイスの製造方法 |
TWI722135B (zh) * | 2016-04-13 | 2021-03-21 | 日商迪愛生股份有限公司 | 酚醛清漆型樹脂及抗蝕劑材料 |
CN110333647B (zh) * | 2019-07-03 | 2023-04-14 | 波米科技有限公司 | 一种正型感光性树脂组合物 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07306309A (ja) * | 1994-05-11 | 1995-11-21 | Sumitomo Chem Co Ltd | カラーフィルター要素用組成物、マイクロレンズアレイ用組成物、カラーフィルター要素、マイクロレンズアレイ及びこれらの要素又はアレイを有するカラーフィルターの製造方法 |
JP3587325B2 (ja) * | 1996-03-08 | 2004-11-10 | 富士写真フイルム株式会社 | ポジ型感光性組成物 |
US5945517A (en) * | 1996-07-24 | 1999-08-31 | Tokyo Ohka Kogyo Co., Ltd. | Chemical-sensitization photoresist composition |
JP3546913B2 (ja) * | 1997-06-26 | 2004-07-28 | 信越化学工業株式会社 | 化学増幅ポジ型レジスト材料 |
US6365321B1 (en) * | 1999-04-13 | 2002-04-02 | International Business Machines Corporation | Blends of hydroxystyrene polymers for use in chemically amplified positive resist formulations |
US6864036B2 (en) * | 1999-08-20 | 2005-03-08 | Tokyo Ohka Kogyo Co., Ltd. | Negative-working photoresist composition |
US6749987B2 (en) * | 2000-10-20 | 2004-06-15 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition |
JP4029556B2 (ja) * | 2000-11-01 | 2008-01-09 | Jsr株式会社 | 感光性絶縁樹脂組成物およびその硬化物 |
JP4310968B2 (ja) * | 2001-06-22 | 2009-08-12 | 東レ株式会社 | ポジ型感光性樹脂組成物を用いて得られるレンズおよび光導波路 |
US7312014B2 (en) * | 2001-06-22 | 2007-12-25 | Wako Pure Chemical Industries Ltd. | Resist compositions |
JP3812655B2 (ja) * | 2002-01-28 | 2006-08-23 | Jsr株式会社 | ポジ型感光性絶縁樹脂組成物およびその硬化物 |
EP1469346B1 (de) * | 2002-01-23 | 2015-08-05 | JSR Corporation | Positive lichtempfindliche isolierende harzzusammensetzung und daraus erhaltenes ausgehärtetes objekt |
KR100913879B1 (ko) * | 2002-01-28 | 2009-08-26 | 제이에스알 가부시끼가이샤 | 감광성 유전체 형성용 조성물, 및 그것을 이용한 전사필름, 유전체 및 전자 부품 |
JP4296792B2 (ja) * | 2003-02-05 | 2009-07-15 | Jsr株式会社 | ポジ型感光性樹脂組成物およびその硬化物 |
TWI235890B (en) * | 2003-03-31 | 2005-07-11 | Chi Mei Corp | photosensitive resin composition for color filter |
-
2005
- 2005-10-28 US US11/718,303 patent/US20080097032A1/en not_active Abandoned
- 2005-10-28 EP EP05799121A patent/EP1806618B1/de not_active Not-in-force
- 2005-10-28 TW TW094137904A patent/TWI390350B/zh active
- 2005-10-28 DE DE602005021812T patent/DE602005021812D1/de active Active
- 2005-10-28 WO PCT/JP2005/019865 patent/WO2006046687A1/ja not_active Application Discontinuation
- 2005-10-28 KR KR1020077011951A patent/KR101254349B1/ko active IP Right Grant
- 2005-10-28 AT AT05799121T patent/ATE470887T1/de not_active IP Right Cessation
-
2007
- 2007-04-26 IL IL182838A patent/IL182838A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
ATE470887T1 (de) | 2010-06-15 |
TW200625010A (en) | 2006-07-16 |
IL182838A0 (en) | 2007-08-19 |
TWI390350B (zh) | 2013-03-21 |
KR20070073941A (ko) | 2007-07-10 |
US20080097032A1 (en) | 2008-04-24 |
EP1806618A4 (de) | 2007-12-26 |
WO2006046687A1 (ja) | 2006-05-04 |
EP1806618A1 (de) | 2007-07-11 |
EP1806618B1 (de) | 2010-06-09 |
KR101254349B1 (ko) | 2013-04-12 |
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