DE602005015908D1 - Akustischer Dünnschicht-Volumenwellenresonator des Luftspalttyps und dessen Herstellungsverfahren - Google Patents
Akustischer Dünnschicht-Volumenwellenresonator des Luftspalttyps und dessen HerstellungsverfahrenInfo
- Publication number
- DE602005015908D1 DE602005015908D1 DE200560015908 DE602005015908T DE602005015908D1 DE 602005015908 D1 DE602005015908 D1 DE 602005015908D1 DE 200560015908 DE200560015908 DE 200560015908 DE 602005015908 T DE602005015908 T DE 602005015908T DE 602005015908 D1 DE602005015908 D1 DE 602005015908D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- air gap
- wave resonator
- gap type
- film bulk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/021—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the air-gap type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20040034969A KR100631216B1 (ko) | 2004-05-17 | 2004-05-17 | 에어갭형 박막벌크음향공진기 및 그 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005015908D1 true DE602005015908D1 (de) | 2009-09-24 |
Family
ID=35308871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200560015908 Expired - Fee Related DE602005015908D1 (de) | 2004-05-17 | 2005-05-17 | Akustischer Dünnschicht-Volumenwellenresonator des Luftspalttyps und dessen Herstellungsverfahren |
Country Status (5)
Country | Link |
---|---|
US (1) | US7253705B2 (de) |
EP (1) | EP1598933B1 (de) |
JP (1) | JP2005333642A (de) |
KR (1) | KR100631216B1 (de) |
DE (1) | DE602005015908D1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100566152C (zh) * | 2002-09-12 | 2009-12-02 | Nxp股份有限公司 | 具有抑制体声波滤波器中通带波纹的装置的体声波谐振器 |
KR100615711B1 (ko) * | 2005-01-25 | 2006-08-25 | 삼성전자주식회사 | 필름 벌크 어쿠스틱 공진기를 이용한 대역 필터 및 그제조방법. |
JP2006217281A (ja) * | 2005-02-03 | 2006-08-17 | Toshiba Corp | 薄膜バルク音響装置の製造方法 |
US7562429B2 (en) * | 2005-06-20 | 2009-07-21 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Suspended device and method of making |
JP2007036829A (ja) * | 2005-07-28 | 2007-02-08 | Toshiba Corp | 薄膜圧電共振器、フィルタ及び薄膜圧電共振器の製造方法 |
US7732241B2 (en) * | 2005-11-30 | 2010-06-08 | Semiconductor Energy Labortory Co., Ltd. | Microstructure and manufacturing method thereof and microelectromechanical system |
JP4870541B2 (ja) * | 2006-12-15 | 2012-02-08 | 太陽誘電株式会社 | 圧電薄膜共振器およびフィルタ |
JP5220503B2 (ja) | 2008-07-23 | 2013-06-26 | 太陽誘電株式会社 | 弾性波デバイス |
US8354332B2 (en) * | 2008-11-26 | 2013-01-15 | Georgia Tech Research Corporation | Methods of forming micro-electromichanical resonators having boron-doped resonator bodies containing eutectic alloys |
JP5754129B2 (ja) | 2010-03-11 | 2015-07-29 | セイコーエプソン株式会社 | 圧電素子、圧電センサー、電子機器、および圧電素子の製造方法 |
US10658998B2 (en) | 2013-07-31 | 2020-05-19 | Oepic Semiconductors, Inc. | Piezoelectric film transfer for acoustic resonators and filters |
CN104202010B (zh) * | 2014-08-28 | 2017-05-03 | 中国工程物理研究院电子工程研究所 | 一种镂空空腔型薄膜体声波谐振器及其制作方法 |
CN106877836B (zh) * | 2015-12-14 | 2020-12-18 | 中芯国际集成电路制造(上海)有限公司 | 一种薄膜体声波谐振器及其制造方法和电子装置 |
JP7290941B2 (ja) * | 2018-12-27 | 2023-06-14 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
CN112039460B (zh) * | 2019-07-19 | 2022-05-10 | 中芯集成电路(宁波)有限公司 | 薄膜体声波谐振器及其制作方法 |
CN112039481B (zh) * | 2019-08-09 | 2024-03-19 | 中芯集成电路(宁波)有限公司 | 体声波谐振器及其制造方法 |
CN111010135A (zh) * | 2019-10-26 | 2020-04-14 | 诺思(天津)微系统有限责任公司 | 体声波谐振器、滤波器及电子设备 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3939939B2 (ja) * | 2001-07-17 | 2007-07-04 | 富士通株式会社 | 圧電薄膜共振素子の製造方法 |
JP4074493B2 (ja) | 2001-08-31 | 2008-04-09 | 日本碍子株式会社 | セラミック素子 |
JP3875240B2 (ja) * | 2004-03-31 | 2007-01-31 | 株式会社東芝 | 電子部品の製造方法 |
KR100622955B1 (ko) | 2004-04-06 | 2006-09-18 | 삼성전자주식회사 | 박막 벌크 음향 공진기 및 그 제조방법 |
KR100635268B1 (ko) * | 2004-05-17 | 2006-10-19 | 삼성전자주식회사 | 인덕터가 내장된 필터, 듀플렉서 및 그 제조방법 |
-
2004
- 2004-05-17 KR KR20040034969A patent/KR100631216B1/ko active IP Right Grant
-
2005
- 2005-05-17 EP EP20050253013 patent/EP1598933B1/de active Active
- 2005-05-17 DE DE200560015908 patent/DE602005015908D1/de not_active Expired - Fee Related
- 2005-05-17 JP JP2005143925A patent/JP2005333642A/ja active Pending
- 2005-05-17 US US11/130,157 patent/US7253705B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR100631216B1 (ko) | 2006-10-04 |
JP2005333642A (ja) | 2005-12-02 |
US20050253670A1 (en) | 2005-11-17 |
EP1598933B1 (de) | 2009-08-12 |
US7253705B2 (en) | 2007-08-07 |
KR20050109870A (ko) | 2005-11-22 |
EP1598933A1 (de) | 2005-11-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |