DE602005002162D1 - Kolloidale Metalllösung und Tintenstrahldruckfarbe hieraus - Google Patents

Kolloidale Metalllösung und Tintenstrahldruckfarbe hieraus

Info

Publication number
DE602005002162D1
DE602005002162D1 DE602005002162T DE602005002162T DE602005002162D1 DE 602005002162 D1 DE602005002162 D1 DE 602005002162D1 DE 602005002162 T DE602005002162 T DE 602005002162T DE 602005002162 T DE602005002162 T DE 602005002162T DE 602005002162 D1 DE602005002162 D1 DE 602005002162D1
Authority
DE
Germany
Prior art keywords
inkjet ink
metal solution
colloidal metal
ink therefrom
therefrom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005002162T
Other languages
English (en)
Other versions
DE602005002162T2 (de
Inventor
Issei Okada
Kohei Shimoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004056572A external-priority patent/JP3952027B2/ja
Priority claimed from JP2004056571A external-priority patent/JP3933138B2/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of DE602005002162D1 publication Critical patent/DE602005002162D1/de
Application granted granted Critical
Publication of DE602005002162T2 publication Critical patent/DE602005002162T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/322—Pigment inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
DE602005002162T 2004-03-01 2005-02-28 Kolloidale Metalllösung und Tintenstrahldruckfarbe hieraus Active DE602005002162T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004056572A JP3952027B2 (ja) 2004-03-01 2004-03-01 金属コロイド溶液
JP2004056571A JP3933138B2 (ja) 2004-03-01 2004-03-01 インクジェット用金属インク
JP2004056571 2004-03-01
JP2004056572 2004-03-01

Publications (2)

Publication Number Publication Date
DE602005002162D1 true DE602005002162D1 (de) 2007-10-11
DE602005002162T2 DE602005002162T2 (de) 2008-05-29

Family

ID=34752189

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005002162T Active DE602005002162T2 (de) 2004-03-01 2005-02-28 Kolloidale Metalllösung und Tintenstrahldruckfarbe hieraus

Country Status (5)

Country Link
US (2) US7445731B2 (de)
EP (1) EP1571186B1 (de)
KR (1) KR101215119B1 (de)
DE (1) DE602005002162T2 (de)
TW (1) TWI318173B (de)

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US7141617B2 (en) * 2003-06-17 2006-11-28 The Board Of Trustees Of The University Of Illinois Directed assembly of three-dimensional structures with micron-scale features
CN101128550B (zh) * 2005-01-10 2013-01-02 耶路撒冷希伯来大学伊萨姆研发公司 金属纳米颗粒的水基分散液
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Also Published As

Publication number Publication date
US20080308001A1 (en) 2008-12-18
KR101215119B1 (ko) 2012-12-24
US20050189520A1 (en) 2005-09-01
US7445731B2 (en) 2008-11-04
EP1571186A1 (de) 2005-09-07
KR20060043182A (ko) 2006-05-15
EP1571186B1 (de) 2007-08-29
DE602005002162T2 (de) 2008-05-29
US7608203B2 (en) 2009-10-27
TW200604016A (en) 2006-02-01
TWI318173B (en) 2009-12-11

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: SHIMODA, KOHEI, OSAKA-SHI, OSAKA, JP

Inventor name: OKADA, ISSEI, OSAKA-SHI, OSAKA, JP

8364 No opposition during term of opposition