DE602004027602D1 - Strahlungs-wärme-quelle - Google Patents

Strahlungs-wärme-quelle

Info

Publication number
DE602004027602D1
DE602004027602D1 DE602004027602T DE602004027602T DE602004027602D1 DE 602004027602 D1 DE602004027602 D1 DE 602004027602D1 DE 602004027602 T DE602004027602 T DE 602004027602T DE 602004027602 T DE602004027602 T DE 602004027602T DE 602004027602 D1 DE602004027602 D1 DE 602004027602D1
Authority
DE
Germany
Prior art keywords
heat source
radiation heat
radiation
source
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004027602T
Other languages
English (en)
Inventor
Christopher Garmer
Feliks Kleyner
Ilya Ayzman
Igor Goldman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
Original Assignee
Axcelis Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Publication of DE602004027602D1 publication Critical patent/DE602004027602D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Resistance Heating (AREA)
  • Control Of Resistance Heating (AREA)
DE602004027602T 2003-02-10 2004-02-10 Strahlungs-wärme-quelle Expired - Lifetime DE602004027602D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/361,658 US6947665B2 (en) 2003-02-10 2003-02-10 Radiant heating source with reflective cavity spanning at least two heating elements
PCT/US2004/004160 WO2004073050A1 (en) 2003-02-10 2004-02-10 Radiant heating source

Publications (1)

Publication Number Publication Date
DE602004027602D1 true DE602004027602D1 (de) 2010-07-22

Family

ID=32824277

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004027602T Expired - Lifetime DE602004027602D1 (de) 2003-02-10 2004-02-10 Strahlungs-wärme-quelle

Country Status (8)

Country Link
US (1) US6947665B2 (de)
EP (1) EP1593146B1 (de)
JP (1) JP4953123B2 (de)
KR (1) KR101052126B1 (de)
CN (1) CN100401464C (de)
DE (1) DE602004027602D1 (de)
TW (1) TWI325044B (de)
WO (1) WO2004073050A1 (de)

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CA2765417C (en) * 2004-02-05 2016-12-20 Worldbest Corporation Radiator apparatus
KR100621777B1 (ko) * 2005-05-04 2006-09-15 삼성전자주식회사 기판 열처리 장치
JP2008182180A (ja) * 2006-12-26 2008-08-07 Epicrew Inc 加熱装置及び半導体製造装置
JP5104405B2 (ja) * 2008-03-03 2012-12-19 株式会社デンソー 半導体製造装置
US8294068B2 (en) 2008-09-10 2012-10-23 Applied Materials, Inc. Rapid thermal processing lamphead with improved cooling
US7932665B2 (en) * 2008-12-02 2011-04-26 Osram Sylvania Inc. Dual filament lamp for rapid temperature processing
US9027623B2 (en) * 2009-09-22 2015-05-12 Flexible Steel Lacing Company Welding apparatus for conveyor belts and method
JP6038503B2 (ja) * 2011-07-01 2016-12-07 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
KR101911722B1 (ko) * 2012-01-10 2018-10-25 에스케이실트론 주식회사 반도체 제조장치용 정렬 장치
US9277595B2 (en) 2012-02-24 2016-03-01 Applied Materials, Inc. Heating lamp having base to facilitate reduced air flow about the heating lamp
WO2014106114A1 (en) 2012-12-28 2014-07-03 Flexible Steel Lacing Company Welding apparatus for conveyor belts and method
US10405375B2 (en) 2013-03-11 2019-09-03 Applied Materials, Inc. Lamphead PCB with flexible standoffs
US9613835B2 (en) * 2013-03-15 2017-04-04 Applied Materials, Inc. Heating lamp assembly
US10410890B2 (en) * 2013-06-21 2019-09-10 Applied Materials, Inc. Light pipe window structure for thermal chamber applications and processes
DE112014004071T5 (de) * 2013-09-05 2016-06-09 Applied Materials, Inc. Lampenquerschnitt für reduzierte Wendelerwärmung
KR102228941B1 (ko) * 2013-11-22 2021-03-17 어플라이드 머티어리얼스, 인코포레이티드 접근이 용이한 램프헤드
CN106133888B (zh) 2013-12-19 2019-10-01 应用材料公司 用于可替换的灯的适配器
US10381248B2 (en) 2015-06-22 2019-08-13 Lam Research Corporation Auto-correction of electrostatic chuck temperature non-uniformity
US10763142B2 (en) 2015-06-22 2020-09-01 Lam Research Corporation System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
US10386821B2 (en) 2015-06-22 2019-08-20 Lam Research Corporation Systems and methods for calibrating scalar field contribution values for a limited number of sensors including a temperature value of an electrostatic chuck and estimating temperature distribution profiles based on calibrated values
US10932323B2 (en) 2015-08-03 2021-02-23 Alta Devices, Inc. Reflector and susceptor assembly for chemical vapor deposition reactor
DE102015115628A1 (de) * 2015-09-16 2017-03-16 Rainer Förster Infrarotheizung
US20180363139A1 (en) * 2017-06-20 2018-12-20 Asm Ip Holding B.V. Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
WO2022261988A1 (zh) * 2021-06-18 2022-12-22 深圳汝原科技有限公司 辐射源组件和干燥设备
KR102514718B1 (ko) * 2021-09-09 2023-03-27 백승원 하이브리드 가열시스템을 갖는 열처리용 전기로
CN116216301B (zh) * 2023-05-06 2023-07-04 成都德力斯实业有限公司 一种放射性无菌注射剂生产线

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE383360C (de) * 1923-10-12 Wiskot Licht Ges M B H Strahlungsheizkoerper mit Hohlspiegelreflektor
US1231750A (en) * 1915-09-09 1917-07-03 American Electrical Heater Co Luminous electric heater.
US3761678A (en) * 1971-05-03 1973-09-25 Aerojet General Co High density spherical modules
JPS59169125A (ja) * 1983-03-16 1984-09-25 Ushio Inc 半導体ウエハ−の加熱方法
US4716658A (en) * 1986-12-11 1988-01-05 Amjo Infra Red Dryers, Inc. Heat lamp assembly
US4891499A (en) * 1988-09-09 1990-01-02 Texas Instruments Incorporated Method and apparatus for real-time wafer temperature uniformity control and slip-free heating in lamp heated single-wafer rapid thermal processing systems
DE4001280A1 (de) * 1990-01-18 1991-07-25 Meyer Kobbe Clemens Vorrichtung zur oberflaechenbehandlung von werkstuecken mittels lichtstrahlen
US5155336A (en) 1990-01-19 1992-10-13 Applied Materials, Inc. Rapid thermal heating apparatus and method
US5446825A (en) * 1991-04-24 1995-08-29 Texas Instruments Incorporated High performance multi-zone illuminator module for semiconductor wafer processing
US5418885A (en) * 1992-12-29 1995-05-23 North Carolina State University Three-zone rapid thermal processing system utilizing wafer edge heating means
US5345534A (en) * 1993-03-29 1994-09-06 Texas Instruments Incorporated Semiconductor wafer heater with infrared lamp module with light blocking means
US5740314A (en) 1995-08-25 1998-04-14 Edison Welding Institute IR heating lamp array with reflectors modified by removal of segments thereof
JPH09237763A (ja) * 1996-02-28 1997-09-09 Tokyo Electron Ltd 枚葉式の熱処理装置
TW315493B (en) * 1996-02-28 1997-09-11 Tokyo Electron Co Ltd Heating apparatus and heat treatment apparatus
JP3996663B2 (ja) * 1996-02-28 2007-10-24 東京エレクトロン株式会社 ランプ加熱型熱処理装置
US6023555A (en) * 1998-08-17 2000-02-08 Eaton Corporation Radiant heating apparatus and method
US6210484B1 (en) * 1998-09-09 2001-04-03 Steag Rtp Systems, Inc. Heating device containing a multi-lamp cone for heating semiconductor wafers
US6122440A (en) * 1999-01-27 2000-09-19 Regents Of The University Of Minnesota Optical heating device for rapid thermal processing (RTP) system
US6259072B1 (en) 1999-11-09 2001-07-10 Axcelis Technologies, Inc. Zone controlled radiant heating system utilizing focused reflector
JP3659863B2 (ja) * 2000-04-06 2005-06-15 大日本スクリーン製造株式会社 熱処理装置
JP4058231B2 (ja) * 2000-11-13 2008-03-05 株式会社東芝 半導体装置の製造方法
CN1373497A (zh) * 2001-02-28 2002-10-09 世罗技术株式会社 带卤素灯的辐射加热器
AUPR548801A0 (en) * 2001-06-06 2001-06-28 Alver Pty. Ltd. Room conditioning

Also Published As

Publication number Publication date
EP1593146B1 (de) 2010-06-09
US20040156625A1 (en) 2004-08-12
KR101052126B1 (ko) 2011-07-26
US6947665B2 (en) 2005-09-20
EP1593146A1 (de) 2005-11-09
TW200504323A (en) 2005-02-01
JP2006518552A (ja) 2006-08-10
KR20050094482A (ko) 2005-09-27
JP4953123B2 (ja) 2012-06-13
WO2004073050A1 (en) 2004-08-26
TWI325044B (en) 2010-05-21
CN100401464C (zh) 2008-07-09
CN1771582A (zh) 2006-05-10

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