DE602004017457D1 - Verfahren zum ätzen einer metall- oder metalllegierung oberfläche - Google Patents

Verfahren zum ätzen einer metall- oder metalllegierung oberfläche

Info

Publication number
DE602004017457D1
DE602004017457D1 DE602004017457T DE602004017457T DE602004017457D1 DE 602004017457 D1 DE602004017457 D1 DE 602004017457D1 DE 602004017457 T DE602004017457 T DE 602004017457T DE 602004017457 T DE602004017457 T DE 602004017457T DE 602004017457 D1 DE602004017457 D1 DE 602004017457D1
Authority
DE
Germany
Prior art keywords
parts
metal
etch
alloy
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004017457T
Other languages
German (de)
English (en)
Inventor
Alan John Hopper
Mark Robert James
Simon Robert Crum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Imaging Colorants Ltd
Original Assignee
Fujifilm Imaging Colorants Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0312925A external-priority patent/GB0312925D0/en
Priority claimed from GB0323870A external-priority patent/GB0323870D0/en
Application filed by Fujifilm Imaging Colorants Ltd filed Critical Fujifilm Imaging Colorants Ltd
Publication of DE602004017457D1 publication Critical patent/DE602004017457D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • ing And Chemical Polishing (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacture And Refinement Of Metals (AREA)
DE602004017457T 2003-05-30 2004-05-26 Verfahren zum ätzen einer metall- oder metalllegierung oberfläche Expired - Lifetime DE602004017457D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0312925A GB0312925D0 (en) 2003-05-30 2003-05-30 Process
GB0323870A GB0323870D0 (en) 2003-10-11 2003-10-11 Process
PCT/GB2004/002241 WO2004106437A1 (en) 2003-05-30 2004-05-26 Process

Publications (1)

Publication Number Publication Date
DE602004017457D1 true DE602004017457D1 (de) 2008-12-11

Family

ID=33492262

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004017457T Expired - Lifetime DE602004017457D1 (de) 2003-05-30 2004-05-26 Verfahren zum ätzen einer metall- oder metalllegierung oberfläche

Country Status (6)

Country Link
US (1) US20070122723A1 (https=)
EP (1) EP1633823B1 (https=)
JP (1) JP4633727B2 (https=)
AT (1) ATE412714T1 (https=)
DE (1) DE602004017457D1 (https=)
WO (1) WO2004106437A1 (https=)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0512971D0 (en) * 2005-06-25 2005-08-03 Avecia Inkjet Ltd Process
JP4855028B2 (ja) * 2005-09-27 2012-01-18 富士フイルム株式会社 インクジェット記録用インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
JP4896502B2 (ja) * 2005-11-22 2012-03-14 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
JP5011952B2 (ja) * 2005-11-30 2012-08-29 東レ株式会社 金属蒸着層のパターン形成方法、および回路基板の製造方法
EP2383314B3 (en) * 2005-12-28 2018-02-14 Fujifilm Corporation Ink composition, inkjet recording method, printed material, method for producing planographic printing plate, and planographic printing plate
JP5430051B2 (ja) 2005-12-28 2014-02-26 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
GB0613583D0 (en) * 2006-07-05 2006-08-16 Sericol Ltd A printing ink
GB0615650D0 (en) 2006-08-07 2006-09-13 Sun Chemical Bv An etching or plating process and resist ink
GB0719464D0 (en) * 2007-10-04 2007-11-14 Sun Chemical Bv An ink jet and a method of ink jet printing
JP5254632B2 (ja) † 2008-02-07 2013-08-07 富士フイルム株式会社 インク組成物、インクジェット記録方法、印刷物、及び、成形印刷物
GB0805495D0 (en) * 2008-03-26 2008-04-30 Sun Chemical Bv An ink jet-printable composition and a masking process
US8425790B2 (en) * 2008-03-27 2013-04-23 Nisshin Steel Co., Ltd. Ink-jet ink composition for etching resist
EP2182786B1 (en) * 2008-11-04 2011-07-13 Rohm and Haas Electronic Materials LLC Improved hot melt compositions
WO2013007362A1 (en) 2011-07-08 2013-01-17 Heraeus Precious Metals Gmbh & Co. Kg Process for the production of a layered body and layered bodies obtainable therefrom
CN102303461A (zh) * 2011-07-11 2012-01-04 广州南鸥卫浴用品有限公司 一种金属表面图案印刷工艺
WO2013113572A1 (en) 2012-01-31 2013-08-08 Agfa-Gevaert Radiation curable etch resistant inkjet ink printing
US9751350B2 (en) * 2013-03-15 2017-09-05 Thomas J. McKnight System and method for scoring and applying a pigment solution to a substrate
US9453139B2 (en) 2013-08-20 2016-09-27 Rohm And Haas Electronic Materials Llc Hot melt compositions with improved etch resistance
JP6186229B2 (ja) * 2013-09-27 2017-08-23 セーレン株式会社 紫外線硬化型インクジェットインク、記録方法、記録物、および成型物
EP2915856B1 (en) 2014-03-03 2019-10-16 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
EP3000853B1 (en) * 2014-09-29 2020-04-08 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
KR101798715B1 (ko) * 2015-08-14 2017-11-17 주식회사 포스코 잉크젯 프린트 강판용 잉크 조성물, 이를 이용한 잉크젯 프린트 강판 및 잉크젯 프린트 강판의 제조 방법
EP3210946B1 (en) * 2016-02-29 2020-07-08 Agfa-Gevaert Method of manufacturing an etched glass article
EP3210945B1 (en) * 2016-02-29 2019-04-10 Agfa-Gevaert Method of manufacturing an etched glass article
EP3210947A1 (en) 2016-02-29 2017-08-30 Agfa-Gevaert Method of manufacturing an etched glass article
EP3296368B1 (en) 2016-09-14 2020-11-11 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing printed circuit boards
EP3478777B1 (en) * 2017-09-11 2020-11-18 FUJIFILM Electronic Materials U.S.A., Inc. Dielectric film forming composition
EP3533844B1 (en) 2018-03-02 2022-09-28 Agfa-Gevaert Nv Inkjet inks for manufacturing printed circuit boards
CN112135883A (zh) 2018-03-02 2020-12-25 爱克发-格法特公司 用于制造印刷电路板的喷墨油墨
WO2019190585A1 (en) * 2018-03-27 2019-10-03 Sun Chemical Corporation Uv-curable compositions comprising cleavage type photoinitiators
US20220010156A1 (en) 2018-11-20 2022-01-13 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
WO2020109148A1 (en) 2018-11-26 2020-06-04 Agfa-Gevaert Nv Novel photoinitiators
EP3656824A1 (en) 2018-11-26 2020-05-27 Agfa-Gevaert Nv Radiation curable inkjet for manufacturing printed circuit boards
EP3686252A1 (en) 2019-01-24 2020-07-29 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
EP3757175A1 (en) 2019-06-28 2020-12-30 Agfa-Gevaert Nv Radiation curable inkjet ink for alkaline etching or plating applications
EP3757174B1 (en) 2019-06-28 2022-04-20 Agfa-Gevaert Nv Radiation curable inkjet ink for alkaline etching or plating applications
CN120149170A (zh) * 2025-02-28 2025-06-13 宁波港波电子有限公司 一种高密度双面异型带材的引线框的制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270985A (en) * 1978-07-21 1981-06-02 Dynachem Corporation Screen printing of photopolymerizable inks
US4416974A (en) * 1979-12-05 1983-11-22 Hercules Incorporated Radiation curable ceramic pigment composition
JPS5849711A (ja) * 1981-09-18 1983-03-24 Matsushita Electric Works Ltd 紫外線硬化樹脂組成物
JPS61197605A (ja) * 1985-02-13 1986-09-01 Osaka Yuki Kagaku Kogyo Kk アルカリ溶解型光硬化性組成物
JP2854749B2 (ja) * 1992-01-10 1999-02-03 太陽インキ製造株式会社 紫外線・熱併用硬化性ソルダーレジストインキ組成物
JPH05338187A (ja) * 1992-06-11 1993-12-21 Olympus Optical Co Ltd レジストパターン形成方法
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
JPH06237063A (ja) * 1993-02-12 1994-08-23 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
JPH07170054A (ja) * 1993-12-14 1995-07-04 Canon Inc 紫外線硬化性組成物、これを用いたパターン形成方法及び配線基板の製造方法
GB9403682D0 (en) * 1994-02-25 1994-04-13 Univ Edinburgh Direct printing of etch masks under computer control
GB0221892D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Process
GB0221891D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Process
KR100733920B1 (ko) * 2004-09-17 2007-07-02 주식회사 엘지화학 에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법
EP2182786B1 (en) * 2008-11-04 2011-07-13 Rohm and Haas Electronic Materials LLC Improved hot melt compositions

Also Published As

Publication number Publication date
EP1633823B1 (en) 2008-10-29
US20070122723A1 (en) 2007-05-31
JP2007507610A (ja) 2007-03-29
JP4633727B2 (ja) 2011-02-16
ATE412714T1 (de) 2008-11-15
WO2004106437A1 (en) 2004-12-09
EP1633823A1 (en) 2006-03-15

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Legal Events

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