ATE412714T1 - Verfahren zum ätzen einer metall- oder metalllegierung oberfläche - Google Patents

Verfahren zum ätzen einer metall- oder metalllegierung oberfläche

Info

Publication number
ATE412714T1
ATE412714T1 AT04734857T AT04734857T ATE412714T1 AT E412714 T1 ATE412714 T1 AT E412714T1 AT 04734857 T AT04734857 T AT 04734857T AT 04734857 T AT04734857 T AT 04734857T AT E412714 T1 ATE412714 T1 AT E412714T1
Authority
AT
Austria
Prior art keywords
parts
metal
etch
alloy
ink
Prior art date
Application number
AT04734857T
Other languages
German (de)
English (en)
Inventor
Alan John Hopper
Mark Robert James
Simon Robert Crum
Original Assignee
Fujifilm Imaging Colorants Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0312925A external-priority patent/GB0312925D0/en
Priority claimed from GB0323870A external-priority patent/GB0323870D0/en
Application filed by Fujifilm Imaging Colorants Ltd filed Critical Fujifilm Imaging Colorants Ltd
Application granted granted Critical
Publication of ATE412714T1 publication Critical patent/ATE412714T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • ing And Chemical Polishing (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AT04734857T 2003-05-30 2004-05-26 Verfahren zum ätzen einer metall- oder metalllegierung oberfläche ATE412714T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0312925A GB0312925D0 (en) 2003-05-30 2003-05-30 Process
GB0323870A GB0323870D0 (en) 2003-10-11 2003-10-11 Process

Publications (1)

Publication Number Publication Date
ATE412714T1 true ATE412714T1 (de) 2008-11-15

Family

ID=33492262

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04734857T ATE412714T1 (de) 2003-05-30 2004-05-26 Verfahren zum ätzen einer metall- oder metalllegierung oberfläche

Country Status (6)

Country Link
US (1) US20070122723A1 (https=)
EP (1) EP1633823B1 (https=)
JP (1) JP4633727B2 (https=)
AT (1) ATE412714T1 (https=)
DE (1) DE602004017457D1 (https=)
WO (1) WO2004106437A1 (https=)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0512971D0 (en) * 2005-06-25 2005-08-03 Avecia Inkjet Ltd Process
JP4855028B2 (ja) * 2005-09-27 2012-01-18 富士フイルム株式会社 インクジェット記録用インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
JP4896502B2 (ja) * 2005-11-22 2012-03-14 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
JP5011952B2 (ja) * 2005-11-30 2012-08-29 東レ株式会社 金属蒸着層のパターン形成方法、および回路基板の製造方法
EP1803784B3 (en) 2005-12-28 2018-02-14 Fujifilm Corporation Inkjet recording composition, inkjet recording method, method for producing planographic printing plate, and planographic printing plate
JP5430051B2 (ja) 2005-12-28 2014-02-26 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
GB0613583D0 (en) * 2006-07-05 2006-08-16 Sericol Ltd A printing ink
GB0615650D0 (en) 2006-08-07 2006-09-13 Sun Chemical Bv An etching or plating process and resist ink
GB0719464D0 (en) * 2007-10-04 2007-11-14 Sun Chemical Bv An ink jet and a method of ink jet printing
JP5254632B2 (ja) † 2008-02-07 2013-08-07 富士フイルム株式会社 インク組成物、インクジェット記録方法、印刷物、及び、成形印刷物
GB0805495D0 (en) * 2008-03-26 2008-04-30 Sun Chemical Bv An ink jet-printable composition and a masking process
KR101215459B1 (ko) * 2008-03-27 2012-12-26 도쿄 프린팅 잉크 엠에프지. 캄파니 리미티드 에칭 레지스트용 잉크젯 잉크 조성물
ATE516693T1 (de) 2008-11-04 2011-07-15 Rohm & Haas Elect Mat Verbesserte schmelzzusammensetzungen
TWI575411B (zh) 2011-07-08 2017-03-21 黑拉耶烏斯貴金屬公司 製造層狀體之方法及可從彼獲得之層狀體
CN102303461A (zh) * 2011-07-11 2012-01-04 广州南鸥卫浴用品有限公司 一种金属表面图案印刷工艺
BR112014016337A8 (pt) 2012-01-31 2017-07-04 Agfa Gevaert impressão com tinta a jato de tinta curável por radiação e resistente ao ataque químico
US9751350B2 (en) * 2013-03-15 2017-09-05 Thomas J. McKnight System and method for scoring and applying a pigment solution to a substrate
US9453139B2 (en) 2013-08-20 2016-09-27 Rohm And Haas Electronic Materials Llc Hot melt compositions with improved etch resistance
JP6186229B2 (ja) * 2013-09-27 2017-08-23 セーレン株式会社 紫外線硬化型インクジェットインク、記録方法、記録物、および成型物
EP2915856B1 (en) * 2014-03-03 2019-10-16 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
EP3000853B1 (en) 2014-09-29 2020-04-08 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
KR101798715B1 (ko) 2015-08-14 2017-11-17 주식회사 포스코 잉크젯 프린트 강판용 잉크 조성물, 이를 이용한 잉크젯 프린트 강판 및 잉크젯 프린트 강판의 제조 방법
EP3210946B1 (en) * 2016-02-29 2020-07-08 Agfa-Gevaert Method of manufacturing an etched glass article
EP3210945B1 (en) * 2016-02-29 2019-04-10 Agfa-Gevaert Method of manufacturing an etched glass article
EP3210947A1 (en) * 2016-02-29 2017-08-30 Agfa-Gevaert Method of manufacturing an etched glass article
EP3296368B1 (en) 2016-09-14 2020-11-11 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing printed circuit boards
KR102456361B1 (ko) * 2017-09-11 2022-10-19 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 유전체 필름 형성 조성물
EP3533844B1 (en) 2018-03-02 2022-09-28 Agfa-Gevaert Nv Inkjet inks for manufacturing printed circuit boards
JP7025570B2 (ja) 2018-03-02 2022-02-24 アグフア－ゲヴエルト，ナームローゼ・フエンノートシヤツプ プリント回路基板を製造するためのインキジェットインキ
EP3774360B1 (en) * 2018-03-27 2024-01-10 Sun Chemical Corporation Uv-curable compositions comprising cleavage type photoinitiators
WO2020104302A1 (en) 2018-11-20 2020-05-28 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
KR20210084544A (ko) 2018-11-26 2021-07-07 아그파-게바에르트 엔.브이. 신규 광개시제
EP3656824A1 (en) 2018-11-26 2020-05-27 Agfa-Gevaert Nv Radiation curable inkjet for manufacturing printed circuit boards
EP3686252A1 (en) 2019-01-24 2020-07-29 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
EP3757174B1 (en) 2019-06-28 2022-04-20 Agfa-Gevaert Nv Radiation curable inkjet ink for alkaline etching or plating applications
EP3757175A1 (en) 2019-06-28 2020-12-30 Agfa-Gevaert Nv Radiation curable inkjet ink for alkaline etching or plating applications
CN120149170A (zh) * 2025-02-28 2025-06-13 宁波港波电子有限公司 一种高密度双面异型带材的引线框的制作方法

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Publication number Priority date Publication date Assignee Title
US4270985A (en) * 1978-07-21 1981-06-02 Dynachem Corporation Screen printing of photopolymerizable inks
US4416974A (en) * 1979-12-05 1983-11-22 Hercules Incorporated Radiation curable ceramic pigment composition
JPS5849711A (ja) * 1981-09-18 1983-03-24 Matsushita Electric Works Ltd 紫外線硬化樹脂組成物
JPS61197605A (ja) * 1985-02-13 1986-09-01 Osaka Yuki Kagaku Kogyo Kk アルカリ溶解型光硬化性組成物
JP2854749B2 (ja) * 1992-01-10 1999-02-03 太陽インキ製造株式会社 紫外線・熱併用硬化性ソルダーレジストインキ組成物
JPH05338187A (ja) * 1992-06-11 1993-12-21 Olympus Optical Co Ltd レジストパターン形成方法
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
JPH06237063A (ja) * 1993-02-12 1994-08-23 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
JPH07170054A (ja) * 1993-12-14 1995-07-04 Canon Inc 紫外線硬化性組成物、これを用いたパターン形成方法及び配線基板の製造方法
GB9403682D0 (en) * 1994-02-25 1994-04-13 Univ Edinburgh Direct printing of etch masks under computer control
GB0221891D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Process
GB0221892D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Process
KR100733920B1 (ko) * 2004-09-17 2007-07-02 주식회사 엘지화학 에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법
ATE516693T1 (de) * 2008-11-04 2011-07-15 Rohm & Haas Elect Mat Verbesserte schmelzzusammensetzungen

Also Published As

Publication number Publication date
EP1633823B1 (en) 2008-10-29
US20070122723A1 (en) 2007-05-31
WO2004106437A1 (en) 2004-12-09
EP1633823A1 (en) 2006-03-15
DE602004017457D1 (de) 2008-12-11
JP2007507610A (ja) 2007-03-29
JP4633727B2 (ja) 2011-02-16

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties