DE602004017457D1 - Verfahren zum ätzen einer metall- oder metalllegierung oberfläche - Google Patents

Verfahren zum ätzen einer metall- oder metalllegierung oberfläche

Info

Publication number
DE602004017457D1
DE602004017457D1 DE602004017457T DE602004017457T DE602004017457D1 DE 602004017457 D1 DE602004017457 D1 DE 602004017457D1 DE 602004017457 T DE602004017457 T DE 602004017457T DE 602004017457 T DE602004017457 T DE 602004017457T DE 602004017457 D1 DE602004017457 D1 DE 602004017457D1
Authority
DE
Germany
Prior art keywords
parts
metal
etch
alloy
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004017457T
Other languages
English (en)
Inventor
Alan John Hopper
Mark Robert James
Simon Robert Crum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Imaging Colorants Ltd
Original Assignee
Fujifilm Imaging Colorants Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0312925A external-priority patent/GB0312925D0/en
Priority claimed from GB0323870A external-priority patent/GB0323870D0/en
Application filed by Fujifilm Imaging Colorants Ltd filed Critical Fujifilm Imaging Colorants Ltd
Publication of DE602004017457D1 publication Critical patent/DE602004017457D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • ing And Chemical Polishing (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE602004017457T 2003-05-30 2004-05-26 Verfahren zum ätzen einer metall- oder metalllegierung oberfläche Expired - Lifetime DE602004017457D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0312925A GB0312925D0 (en) 2003-05-30 2003-05-30 Process
GB0323870A GB0323870D0 (en) 2003-10-11 2003-10-11 Process
PCT/GB2004/002241 WO2004106437A1 (en) 2003-05-30 2004-05-26 Process

Publications (1)

Publication Number Publication Date
DE602004017457D1 true DE602004017457D1 (de) 2008-12-11

Family

ID=33492262

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004017457T Expired - Lifetime DE602004017457D1 (de) 2003-05-30 2004-05-26 Verfahren zum ätzen einer metall- oder metalllegierung oberfläche

Country Status (6)

Country Link
US (1) US20070122723A1 (de)
EP (1) EP1633823B1 (de)
JP (1) JP4633727B2 (de)
AT (1) ATE412714T1 (de)
DE (1) DE602004017457D1 (de)
WO (1) WO2004106437A1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0512971D0 (en) * 2005-06-25 2005-08-03 Avecia Inkjet Ltd Process
JP4855028B2 (ja) * 2005-09-27 2012-01-18 富士フイルム株式会社 インクジェット記録用インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
JP4896502B2 (ja) * 2005-11-22 2012-03-14 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
JP5011952B2 (ja) * 2005-11-30 2012-08-29 東レ株式会社 金属蒸着層のパターン形成方法、および回路基板の製造方法
JP5430051B2 (ja) 2005-12-28 2014-02-26 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
US7794918B2 (en) 2005-12-28 2010-09-14 Fujifilm Corporation Ink composition, inkjet recording method, printed material, method for producing planographic printing plate, and planographic printing plate
GB0613583D0 (en) * 2006-07-05 2006-08-16 Sericol Ltd A printing ink
GB0615650D0 (en) 2006-08-07 2006-09-13 Sun Chemical Bv An etching or plating process and resist ink
GB0719464D0 (en) * 2007-10-04 2007-11-14 Sun Chemical Bv An ink jet and a method of ink jet printing
JP5254632B2 (ja) † 2008-02-07 2013-08-07 富士フイルム株式会社 インク組成物、インクジェット記録方法、印刷物、及び、成形印刷物
GB0805495D0 (en) * 2008-03-26 2008-04-30 Sun Chemical Bv An ink jet-printable composition and a masking process
US8425790B2 (en) * 2008-03-27 2013-04-23 Nisshin Steel Co., Ltd. Ink-jet ink composition for etching resist
ATE516693T1 (de) 2008-11-04 2011-07-15 Rohm & Haas Elect Mat Verbesserte schmelzzusammensetzungen
WO2013007362A1 (en) 2011-07-08 2013-01-17 Heraeus Precious Metals Gmbh & Co. Kg Process for the production of a layered body and layered bodies obtainable therefrom
CN102303461A (zh) * 2011-07-11 2012-01-04 广州南鸥卫浴用品有限公司 一种金属表面图案印刷工艺
KR102026992B1 (ko) * 2012-01-31 2019-09-30 아그파-게바에르트 엔.브이. 방사선 경화성 내에칭성 잉크젯 잉크 프린팅
US9751350B2 (en) * 2013-03-15 2017-09-05 Thomas J. McKnight System and method for scoring and applying a pigment solution to a substrate
US9453139B2 (en) 2013-08-20 2016-09-27 Rohm And Haas Electronic Materials Llc Hot melt compositions with improved etch resistance
JP6186229B2 (ja) * 2013-09-27 2017-08-23 セーレン株式会社 紫外線硬化型インクジェットインク、記録方法、記録物、および成型物
EP2915856B1 (de) * 2014-03-03 2019-10-16 Agfa-Gevaert Ätzfeste Tintenstrahltinten zur Herstellung von leitfähigen Strukturen
EP3000853B1 (de) 2014-09-29 2020-04-08 Agfa-Gevaert Ätzfeste Tintenstrahltinten zur Herstellung von leitfähigen Strukturen
KR101798715B1 (ko) 2015-08-14 2017-11-17 주식회사 포스코 잉크젯 프린트 강판용 잉크 조성물, 이를 이용한 잉크젯 프린트 강판 및 잉크젯 프린트 강판의 제조 방법
EP3210947A1 (de) * 2016-02-29 2017-08-30 Agfa-Gevaert Verfahren zur herstellung eines geätzten glasartikels
EP3210945B1 (de) 2016-02-29 2019-04-10 Agfa-Gevaert Verfahren zur herstellung eines ätzglasartikels
EP3210946B1 (de) * 2016-02-29 2020-07-08 Agfa-Gevaert Verfahren zur herstellung eines ätzglasartikels
EP3296368B1 (de) 2016-09-14 2020-11-11 Agfa-Gevaert Ätzresistente tintenstrahltinten zur herstellung von leiterplatten
CN109789644B (zh) * 2017-09-11 2023-01-31 富士胶片电子材料美国有限公司 形成介电膜的组合物
EP3533844B1 (de) 2018-03-02 2022-09-28 Agfa-Gevaert Nv Tintenstrahltinten zur herstellung von leiterplatten
KR20200116151A (ko) 2018-03-02 2020-10-08 아그파-게바에르트 엔.브이. 인쇄 회로 기판을 제조하기 위한 잉크젯 잉크
EP3774360B1 (de) * 2018-03-27 2024-01-10 Sun Chemical Corporation Uv-härtbare zusammensetzungen mit spaltungsfotoinitiatoren
WO2020104302A1 (en) 2018-11-20 2020-05-28 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
US20210403738A1 (en) 2018-11-26 2021-12-30 Agfa-Gevaert Nv Novel photoinitiators
EP3656824A1 (de) 2018-11-26 2020-05-27 Agfa-Gevaert Nv Strahlungshärtbare strahltinte zur herstellung von leiterplatten
EP3686252A1 (de) 2019-01-24 2020-07-29 Agfa-Gevaert Nv Strahlungshärtbare tintenstrahltinte zur herstellung von leiterplatten
EP3757174B1 (de) 2019-06-28 2022-04-20 Agfa-Gevaert Nv Strahlungshärtbare tintenstrahltinte für alkalische ätz- oder plattierungsanwendungen
EP3757175A1 (de) 2019-06-28 2020-12-30 Agfa-Gevaert Nv Strahlungshärtbare tintenstrahltinte für alkalische ätz- oder plattierungsanwendungen

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270985A (en) * 1978-07-21 1981-06-02 Dynachem Corporation Screen printing of photopolymerizable inks
US4416974A (en) * 1979-12-05 1983-11-22 Hercules Incorporated Radiation curable ceramic pigment composition
JPS5849711A (ja) * 1981-09-18 1983-03-24 Matsushita Electric Works Ltd 紫外線硬化樹脂組成物
JPS61197605A (ja) * 1985-02-13 1986-09-01 Osaka Yuki Kagaku Kogyo Kk アルカリ溶解型光硬化性組成物
JP2854749B2 (ja) * 1992-01-10 1999-02-03 太陽インキ製造株式会社 紫外線・熱併用硬化性ソルダーレジストインキ組成物
JPH05338187A (ja) * 1992-06-11 1993-12-21 Olympus Optical Co Ltd レジストパターン形成方法
US5270368A (en) * 1992-07-15 1993-12-14 Videojet Systems International, Inc. Etch-resistant jet ink and process
JPH06237063A (ja) * 1993-02-12 1994-08-23 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
JPH07170054A (ja) * 1993-12-14 1995-07-04 Canon Inc 紫外線硬化性組成物、これを用いたパターン形成方法及び配線基板の製造方法
GB9403682D0 (en) * 1994-02-25 1994-04-13 Univ Edinburgh Direct printing of etch masks under computer control
GB0221891D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Process
GB0221892D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Process
KR100733920B1 (ko) * 2004-09-17 2007-07-02 주식회사 엘지화학 에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법
ATE516693T1 (de) * 2008-11-04 2011-07-15 Rohm & Haas Elect Mat Verbesserte schmelzzusammensetzungen

Also Published As

Publication number Publication date
EP1633823A1 (de) 2006-03-15
US20070122723A1 (en) 2007-05-31
ATE412714T1 (de) 2008-11-15
JP4633727B2 (ja) 2011-02-16
JP2007507610A (ja) 2007-03-29
EP1633823B1 (de) 2008-10-29
WO2004106437A1 (en) 2004-12-09

Similar Documents

Publication Publication Date Title
DE602004017457D1 (de) Verfahren zum ätzen einer metall- oder metalllegierung oberfläche
JP6603710B2 (ja) 導電パターン製造用エッチ抵抗性インクジェットインク
ATE335796T1 (de) Verfahren und tinte zur herstellung elektronischer bauteile
TWI318231B (en) Ink jet printing process and solder mask ink composition
JP2007507610A5 (de)
CN101415502B (zh) 在铜表面上制造图案的方法
SE7505838L (sv) Skyddsoverdrag och anordning derav.
KR102254841B1 (ko) 인쇄 회로 기판을 제조하기 위한 에칭 레지스트 잉크젯 잉크
CN111788270A (zh) 用于制造印刷电路板的喷墨油墨
ATE341187T1 (de) Plattierungsprozess
WO2020260008A1 (en) Radiation curable inkjet ink for alkaline etching or plating applications
JP7174173B2 (ja) アルカリエッチング又はメッキ用途のための放射線硬化性インキジェットインキ
GB0128381D0 (en) Printed UV cured light management films
CN116904063A (zh) Pcb光刻用uv固化水性抗蚀刻油墨的制备与应用方法
KR20220077886A (ko) 에칭 저항성 잉크 조성물, 이로부터 제조된 광경화 필름 및 이를 이용한 인쇄회로기판의 제조방법

Legal Events

Date Code Title Description
8364 No opposition during term of opposition