DE602004014365D1 - Klebharzmase und klebemittel in filmform sowie darauf basierende halbleitervorrichtung - Google Patents

Klebharzmase und klebemittel in filmform sowie darauf basierende halbleitervorrichtung

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Publication number
DE602004014365D1
DE602004014365D1 DE602004014365T DE602004014365T DE602004014365D1 DE 602004014365 D1 DE602004014365 D1 DE 602004014365D1 DE 602004014365 T DE602004014365 T DE 602004014365T DE 602004014365 T DE602004014365 T DE 602004014365T DE 602004014365 D1 DE602004014365 D1 DE 602004014365D1
Authority
DE
Germany
Prior art keywords
adhesive
semi
semiconductor device
based semiconductor
film molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004014365T
Other languages
English (en)
Inventor
Youichi Kodama
Hiroshi Maruyama
Isao Naruse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
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Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of DE602004014365D1 publication Critical patent/DE602004014365D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]
DE602004014365T 2003-05-14 2004-04-13 Klebharzmase und klebemittel in filmform sowie darauf basierende halbleitervorrichtung Expired - Lifetime DE602004014365D1 (de)

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TWI286828B (en) * 2004-11-12 2007-09-11 Mitsui Chemicals Inc Film-shaped adhesive and semiconductor package using the same
JP2006161038A (ja) * 2004-11-12 2006-06-22 Mitsui Chemicals Inc フィルム状接着剤およびそれを用いた半導体パッケージ
JP2007112890A (ja) * 2005-10-20 2007-05-10 Kaneka Corp 新規なポリイミド樹脂
WO2007114081A1 (ja) * 2006-04-03 2007-10-11 Mitsui Chemicals, Inc. 金属積層体
KR101023841B1 (ko) * 2006-12-08 2011-03-22 주식회사 엘지화학 접착제 수지 조성물 및 이를 이용한 다이싱 다이 본딩 필름
CN113488743B (zh) * 2021-06-23 2022-09-02 万向一二三股份公司 一种锂电池正极极耳绝缘涂层及其制备方法

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JP3164324B2 (ja) 1992-06-04 2001-05-08 住友ベークライト株式会社 低温熱圧着可能なフィルム接着剤
US5406124A (en) 1992-12-04 1995-04-11 Mitsui Toatsu Chemicals, Inc. Insulating adhesive tape, and lead frame and semiconductor device employing the tape
JP2866779B2 (ja) * 1993-01-05 1999-03-08 三井化学株式会社 耐熱性接着シート
JP2996857B2 (ja) 1994-03-09 2000-01-11 住友ベークライト株式会社 低温加工性の優れた耐熱性樹脂組成物
JPH0959589A (ja) 1995-08-25 1997-03-04 Sony Corp ダイボンド材および半導体装置
JP3513829B2 (ja) 1997-09-18 2004-03-31 日立化成工業株式会社 接着フィルム
DE60016217T2 (de) 1999-04-09 2005-04-07 Kaneka Corp. Polyimidharzzusammensetzung mit verbesserter feuchtigkeitsbeständigkeit, leimlösung, mehrlagiger klebefilm und verfahren zu deren herstellung
JP4620834B2 (ja) * 2000-04-04 2011-01-26 株式会社カネカ ボンディングシート
JP2001311053A (ja) * 2000-04-28 2001-11-09 Kanegafuchi Chem Ind Co Ltd フィルム状接合部材
JP2002069420A (ja) * 2000-08-30 2002-03-08 Kanegafuchi Chem Ind Co Ltd Ｆｐｃ補強板用接着性フィルム
JP2003027034A (ja) * 2001-07-17 2003-01-29 Kanegafuchi Chem Ind Co Ltd 接着性カバーフィルム
JP2003027014A (ja) * 2001-07-17 2003-01-29 Kanegafuchi Chem Ind Co Ltd 接着性フィルム

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US20060281872A1 (en) 2006-12-14
JPWO2004101701A1 (ja) 2006-07-13
CN100475926C (zh) 2009-04-08
EP1624038B1 (de) 2008-06-11
EP1624038A1 (de) 2006-02-08
KR100672822B1 (ko) 2007-01-22
JP4359242B2 (ja) 2009-11-04
US7488532B2 (en) 2009-02-10
KR20050111352A (ko) 2005-11-24
CN1788065A (zh) 2006-06-14
EP1624038A4 (de) 2006-05-31

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