DE602004011016D1 - Laserstrahluntersuchungssystem - Google Patents

Laserstrahluntersuchungssystem

Info

Publication number
DE602004011016D1
DE602004011016D1 DE602004011016T DE602004011016T DE602004011016D1 DE 602004011016 D1 DE602004011016 D1 DE 602004011016D1 DE 602004011016 T DE602004011016 T DE 602004011016T DE 602004011016 T DE602004011016 T DE 602004011016T DE 602004011016 D1 DE602004011016 D1 DE 602004011016D1
Authority
DE
Germany
Prior art keywords
inspection system
beam inspection
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004011016T
Other languages
English (en)
Other versions
DE602004011016T2 (de
Inventor
Hirotoshi Terada
Hiroyoshi Suzuki
Toshimichi Ishizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of DE602004011016D1 publication Critical patent/DE602004011016D1/de
Application granted granted Critical
Publication of DE602004011016T2 publication Critical patent/DE602004011016T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
DE602004011016T 2003-01-20 2004-01-16 Laserstrahl-Prüfvorrichtung Expired - Lifetime DE602004011016T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003011276A JP4526765B2 (ja) 2003-01-20 2003-01-20 ビーム照射加熱抵抗変化測定装置
JP2003011276 2003-01-20
PCT/JP2004/000335 WO2004065972A1 (ja) 2003-01-20 2004-01-16 レーザビーム検査装置

Publications (2)

Publication Number Publication Date
DE602004011016D1 true DE602004011016D1 (de) 2008-02-14
DE602004011016T2 DE602004011016T2 (de) 2009-01-02

Family

ID=32767274

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004011016T Expired - Lifetime DE602004011016T2 (de) 2003-01-20 2004-01-16 Laserstrahl-Prüfvorrichtung

Country Status (8)

Country Link
US (1) US7230436B2 (de)
EP (1) EP1586912B1 (de)
JP (1) JP4526765B2 (de)
KR (1) KR101031930B1 (de)
CN (1) CN100520427C (de)
DE (1) DE602004011016T2 (de)
TW (1) TWI310091B (de)
WO (1) WO2004065972A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3415035B2 (ja) * 1998-08-07 2003-06-09 オー・エイチ・ティー株式会社 基板検査用センサプローブおよびその製造方法
JP4252908B2 (ja) * 2004-02-10 2009-04-08 パナソニック株式会社 ビーム測定装置およびこれを用いたビーム測定方法
JP5128835B2 (ja) * 2007-03-20 2013-01-23 株式会社トプコン レーザ光受光位置検出センサ及びこれを用いたレベル装置
JP5637532B2 (ja) * 2010-12-27 2014-12-10 株式会社ブイ・テクノロジー レーザ加工装置
JP6158468B2 (ja) 2011-11-08 2017-07-05 富士電機株式会社 半導体装置の故障位置解析方法及び装置
CN102385031B (zh) * 2011-11-11 2013-10-30 华中科技大学 一种非接触式金属电迁移测量方法和装置
US9488699B2 (en) * 2012-04-26 2016-11-08 Honeywell International Inc. Devices for sensing current
JP3208924U (ja) 2013-08-30 2017-03-02 ハネウェル・インターナショナル・インコーポレーテッド 電流測定システムに対する妨害排除
CN105717170A (zh) * 2016-02-18 2016-06-29 工业和信息化部电子第五研究所 激光诱导阻抗变化测试方法和系统
KR102429847B1 (ko) 2016-04-29 2022-08-04 에이에스엠엘 네델란즈 비.브이. 구조체의 특성을 결정하는 방법 및 장치, 디바이스 제조 방법
US10782343B2 (en) * 2018-04-17 2020-09-22 Nxp Usa, Inc. Digital tests with radiation induced upsets
JP6611387B1 (ja) 2018-08-30 2019-11-27 浜松ホトニクス株式会社 半導体試料の検査装置及び検査方法
CN109613016A (zh) * 2018-12-04 2019-04-12 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 一种半导体芯片缺陷检测设备及方法
JP6824351B1 (ja) 2019-09-13 2021-02-03 浜松ホトニクス株式会社 半導体試料の検査装置及び検査方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US644895A (en) * 1899-10-12 1900-03-06 Fred Carpenter Tension device for loom-shuttles.
JPS54128770A (en) * 1978-03-29 1979-10-05 Mitsubishi Electric Corp Voltmeter
JP2900877B2 (ja) * 1996-03-22 1999-06-02 日本電気株式会社 半導体デバイスの配線電流観測方法、配線系欠陥検査方法およびその装置
JP3825542B2 (ja) 1997-10-09 2006-09-27 浜松ホトニクス株式会社 定電流型ビーム照射加熱抵抗変化測定装置
US6078183A (en) * 1998-03-03 2000-06-20 Sandia Corporation Thermally-induced voltage alteration for integrated circuit analysis
JP3175766B2 (ja) * 1998-09-28 2001-06-11 日本電気株式会社 非破壊検査装置および非破壊検査方法
US6444895B1 (en) 1998-09-28 2002-09-03 Nec Corporation Device and method for nondestructive inspection on semiconductor device
JP3144412B2 (ja) * 1999-03-25 2001-03-12 日本電気株式会社 半導体デバイスの配線電流観測方法、検査方法および装置
JP2001004719A (ja) 1999-06-24 2001-01-12 Hamamatsu Photonics Kk 電流変化測定装置
JP2002313859A (ja) 2001-02-09 2002-10-25 Nec Corp 非破壊検査方法および装置ならびに半導体チップ

Also Published As

Publication number Publication date
KR20050095612A (ko) 2005-09-29
WO2004065972A1 (ja) 2004-08-05
EP1586912B1 (de) 2008-01-02
US7230436B2 (en) 2007-06-12
CN100520427C (zh) 2009-07-29
TWI310091B (en) 2009-05-21
US20060164109A1 (en) 2006-07-27
EP1586912A1 (de) 2005-10-19
CN1739034A (zh) 2006-02-22
JP2004264030A (ja) 2004-09-24
KR101031930B1 (ko) 2011-04-29
DE602004011016T2 (de) 2009-01-02
TW200416407A (en) 2004-09-01
JP4526765B2 (ja) 2010-08-18
EP1586912A4 (de) 2006-05-17

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Legal Events

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