DE602004010925D1 - Flüssigkeitskühlmodul - Google Patents

Flüssigkeitskühlmodul

Info

Publication number
DE602004010925D1
DE602004010925D1 DE602004010925T DE602004010925T DE602004010925D1 DE 602004010925 D1 DE602004010925 D1 DE 602004010925D1 DE 602004010925 T DE602004010925 T DE 602004010925T DE 602004010925 T DE602004010925 T DE 602004010925T DE 602004010925 D1 DE602004010925 D1 DE 602004010925D1
Authority
DE
Germany
Prior art keywords
liquid cooling
cooling module
module
liquid
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004010925T
Other languages
English (en)
Other versions
DE602004010925T2 (de
Inventor
Shinji Matsushita
Hironori Oikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE602004010925D1 publication Critical patent/DE602004010925D1/de
Application granted granted Critical
Publication of DE602004010925T2 publication Critical patent/DE602004010925T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE602004010925T 2003-09-25 2004-03-09 Flüssigkeitskühlmodul Expired - Lifetime DE602004010925T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003332918 2003-09-25
JP2003332918A JP4140495B2 (ja) 2003-09-25 2003-09-25 冷却モジュール

Publications (2)

Publication Number Publication Date
DE602004010925D1 true DE602004010925D1 (de) 2008-02-07
DE602004010925T2 DE602004010925T2 (de) 2008-12-11

Family

ID=34191474

Family Applications (2)

Application Number Title Priority Date Filing Date
DE602004010925T Expired - Lifetime DE602004010925T2 (de) 2003-09-25 2004-03-09 Flüssigkeitskühlmodul
DE602004003535T Expired - Lifetime DE602004003535T2 (de) 2003-09-25 2004-03-09 Flüssigskeitskühlmodul

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE602004003535T Expired - Lifetime DE602004003535T2 (de) 2003-09-25 2004-03-09 Flüssigskeitskühlmodul

Country Status (7)

Country Link
US (1) US7114551B2 (de)
EP (2) EP1519645B1 (de)
JP (1) JP4140495B2 (de)
KR (1) KR100633492B1 (de)
CN (1) CN100383957C (de)
DE (2) DE602004010925T2 (de)
TW (1) TWI238691B (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4506483B2 (ja) * 2005-01-20 2010-07-21 株式会社日立製作所 液冷システム
JP4551261B2 (ja) * 2005-04-01 2010-09-22 株式会社日立製作所 冷却ジャケット
CN100584166C (zh) * 2005-05-07 2010-01-20 富准精密工业(深圳)有限公司 液冷散热装置
CN100499974C (zh) * 2005-08-10 2009-06-10 富准精密工业(深圳)有限公司 整合式液冷散热装置
TWM289878U (en) * 2005-11-11 2006-04-21 Cooler Master Co Ltd Heat-dissipation structure of water-cooling type parallel runner
CN1818826B (zh) * 2006-01-19 2010-07-21 曜越科技股份有限公司 电路板的散热装置
JP2007242822A (ja) * 2006-03-08 2007-09-20 Hitachi Ltd 電子機器用の冷却装置
US20070272397A1 (en) * 2006-05-23 2007-11-29 Ilya Reyzin Compact liquid cooling unit for high end servers
US7467657B2 (en) * 2006-06-07 2008-12-23 Delphi Technologies, Inc. Compact modular CPU cooling unit
JP4781929B2 (ja) * 2006-07-25 2011-09-28 富士通株式会社 電子機器
US7466550B2 (en) * 2006-11-03 2008-12-16 Xigmatek Co., Ltd Integrated heat dissipating assembly
US20100132924A1 (en) * 2007-04-27 2010-06-03 National University Of Singapore Cooling device for electronic components
US8120916B2 (en) 2009-09-17 2012-02-21 International Business Machines Corporation Facilitating cooling of an electronics rack employing water vapor compression system
US20110265982A1 (en) * 2010-04-29 2011-11-03 International Business Machines Corporation Controlling coolant flow to multiple cooling units in a computer system
JP6054052B2 (ja) * 2012-04-19 2016-12-27 株式会社Ｎｔｔファシリティーズ 発熱部品冷却装置
US20140262158A1 (en) * 2013-03-15 2014-09-18 Parker-Hannifin Corporation Two-phase cooling system
CN103743276A (zh) * 2013-12-24 2014-04-23 苏州欢颜电气有限公司 交错式散热结构
JP2015207586A (ja) * 2014-04-17 2015-11-19 富士通株式会社 放熱装置、電子機器、基地局装置
CN105128163A (zh) * 2015-08-21 2015-12-09 芜湖集拓橡胶技术有限公司 橡胶水冷输送装置
TWI613541B (zh) * 2016-08-11 2018-02-01 技嘉科技股份有限公司 液冷式散熱系統
CN107734916B (zh) * 2016-08-11 2020-04-28 技嘉科技股份有限公司 液冷式散热系统
CN106793704A (zh) * 2017-01-09 2017-05-31 广东黑拍师光电有限公司 液体冷却一体化装置和液体冷却方法
EP3410053A1 (de) * 2017-05-30 2018-12-05 ECOFLOW Sp. z o.o. Luftgekühlter wärmetauscher
CN108172555B (zh) * 2017-11-15 2020-05-15 中国科学院电工研究所 一种带有气体控水单元的散热装置
CN108155165B (zh) * 2017-11-15 2019-08-13 中国科学院电工研究所 带有跳跃膜片的散热装置
CN108054147B (zh) * 2017-11-15 2020-05-15 中国科学院电工研究所 一种带有跳跃膜片的散热装置
CN109271008A (zh) * 2018-11-05 2019-01-25 北京小米移动软件有限公司 外部冷却系统和电子设备
CN113672059A (zh) * 2020-05-15 2021-11-19 亚浩电子五金塑胶（惠州）有限公司 电脑液冷系统
CN111770661A (zh) * 2020-05-25 2020-10-13 合肥通用机械研究院有限公司 一种一体式水冷散热装置
TW202231177A (zh) * 2021-01-29 2022-08-01 訊凱國際股份有限公司 電腦裝置、機殼及水冷散熱裝置
CN113961051B (zh) * 2021-11-03 2022-07-01 南昌工程学院 一种基于人工智能的新闻媒体数据推荐管理系统
CN114721483B (zh) * 2022-04-26 2023-07-28 湖南汽车工程职业学院 一种计算机机箱用的自冷却散热装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4468717A (en) * 1982-06-09 1984-08-28 Sperry Corporation Apparatus for cooling integrated circuit chips
JP2859927B2 (ja) * 1990-05-16 1999-02-24 株式会社東芝 冷却装置および温度制御装置
US5323847A (en) * 1990-08-01 1994-06-28 Hitachi, Ltd. Electronic apparatus and method of cooling the same
JPH0629434A (ja) * 1992-07-09 1994-02-04 Matsumoto Kokan Kk 放熱装置
JP2801998B2 (ja) * 1992-10-12 1998-09-21 富士通株式会社 電子機器の冷却装置
JPH06266474A (ja) * 1993-03-17 1994-09-22 Hitachi Ltd 電子機器装置及びラップトップ型電子機器装置
JP3385482B2 (ja) * 1993-11-15 2003-03-10 株式会社日立製作所 電子機器
JP4290232B2 (ja) * 1997-02-24 2009-07-01 富士通株式会社 ヒートシンクとそれを使用する情報処理装置
JP2000241089A (ja) * 1999-02-19 2000-09-08 Mitsubishi Electric Corp 蒸発器、吸熱器、熱輸送システム及び熱輸送方法
JP3068892U (ja) * 1999-11-11 2000-05-26 川富 簡 Ｃｐｕ放熱装置
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6360816B1 (en) 1999-12-23 2002-03-26 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6263957B1 (en) * 2000-01-13 2001-07-24 Lucent Technologies Inc. Integrated active cooling device for board mounted electric components
JP2002151638A (ja) * 2000-11-08 2002-05-24 Hitachi Ltd 電子機器の冷却装置
JP2002335091A (ja) * 2001-03-05 2002-11-22 Sanyo Electric Co Ltd 発熱性の電子部品用冷却装置
US6926070B2 (en) * 2002-03-22 2005-08-09 Intel Corporation System and method for providing cooling systems with heat exchangers
CN2560019Y (zh) * 2002-04-01 2003-07-09 王勤文 泵式散热器
US6668911B2 (en) * 2002-05-08 2003-12-30 Itt Manufacturing Enterprises, Inc. Pump system for use in a heat exchange application
US6600649B1 (en) * 2002-05-24 2003-07-29 Mei-Nan Tsai Heat dissipating device
JP3757200B2 (ja) * 2002-09-25 2006-03-22 株式会社日立製作所 冷却機構を備えた電子機器
US6763880B1 (en) * 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers

Also Published As

Publication number Publication date
KR100633492B1 (ko) 2006-10-16
JP2005100091A (ja) 2005-04-14
TWI238691B (en) 2005-08-21
EP1519645A2 (de) 2005-03-30
EP1519645B1 (de) 2006-12-06
KR20050030524A (ko) 2005-03-30
US20050067145A1 (en) 2005-03-31
EP1675451B1 (de) 2007-12-26
US7114551B2 (en) 2006-10-03
JP4140495B2 (ja) 2008-08-27
EP1519645A3 (de) 2005-04-13
TW200513169A (en) 2005-04-01
CN100383957C (zh) 2008-04-23
EP1675451A1 (de) 2006-06-28
CN1601731A (zh) 2005-03-30
DE602004010925T2 (de) 2008-12-11
DE602004003535T2 (de) 2007-07-19
DE602004003535D1 (de) 2007-01-18

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Legal Events

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