DE602004009214D1 - Vorrichtung zum prüfen einer einrichtung mit einem hochfrequenzsignal - Google Patents

Vorrichtung zum prüfen einer einrichtung mit einem hochfrequenzsignal

Info

Publication number
DE602004009214D1
DE602004009214D1 DE602004009214T DE602004009214T DE602004009214D1 DE 602004009214 D1 DE602004009214 D1 DE 602004009214D1 DE 602004009214 T DE602004009214 T DE 602004009214T DE 602004009214 T DE602004009214 T DE 602004009214T DE 602004009214 D1 DE602004009214 D1 DE 602004009214D1
Authority
DE
Germany
Prior art keywords
high frequency
testing
cable
frequency signal
loadboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004009214T
Other languages
English (en)
Other versions
DE602004009214T2 (de
Inventor
Yoshimasa Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority claimed from PCT/JP2004/017993 external-priority patent/WO2005052603A1/en
Publication of DE602004009214D1 publication Critical patent/DE602004009214D1/de
Application granted granted Critical
Publication of DE602004009214T2 publication Critical patent/DE602004009214T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
DE602004009214T 2003-11-26 2004-11-26 Vorrichtung zum prüfen einer einrichtung mit einem hochfrequenzsignal Active DE602004009214T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US52578603P 2003-11-26 2003-11-26
US525786P 2003-11-26
PCT/JP2004/017993 WO2005052603A1 (en) 2003-11-26 2004-11-26 Apparatus for testing a device with a high frequency signal

Publications (2)

Publication Number Publication Date
DE602004009214D1 true DE602004009214D1 (de) 2007-11-08
DE602004009214T2 DE602004009214T2 (de) 2008-06-26

Family

ID=36676188

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004009214T Active DE602004009214T2 (de) 2003-11-26 2004-11-26 Vorrichtung zum prüfen einer einrichtung mit einem hochfrequenzsignal

Country Status (8)

Country Link
US (1) US7627445B2 (de)
EP (1) EP1692526B1 (de)
KR (1) KR101093397B1 (de)
CN (2) CN100592098C (de)
AT (1) ATE374371T1 (de)
DE (1) DE602004009214T2 (de)
MY (1) MY141227A (de)
TW (1) TWI349780B (de)

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DE102005048872A1 (de) * 2005-10-12 2007-04-26 Mühlbauer Ag Testkopfeinrichtung
US7405582B2 (en) * 2006-06-01 2008-07-29 Advantest Corporation Measurement board for electronic device test apparatus
US20090079447A1 (en) * 2007-09-20 2009-03-26 Azurewave Technologies, Inc. Testing system for a radio frequency module
CN101159498B (zh) * 2007-11-07 2010-12-29 中兴通讯股份有限公司 一种射频硬件模块的测试方法
EP2342847B1 (de) * 2008-09-22 2012-10-31 National Instruments Corporation Gleichzeitiges prüfen mehrerer kommunikationseinrichtungen
DE102009051370A1 (de) * 2009-06-04 2010-12-09 Rohde & Schwarz Gmbh & Co Kg Messkoppler in Bandleitertechnik
TWI411782B (zh) * 2009-09-25 2013-10-11 Teradyne Asia Pte Ltd 改良式負載板及負載板總成
CN101937720A (zh) * 2010-05-07 2011-01-05 深圳市忆嘉电子科技有限公司 一种高速动态随机存储器测试系统
CN102378232A (zh) * 2010-08-23 2012-03-14 财团法人资讯工业策进会 无线网络信号的测试系统及其测量方法
CN102419726A (zh) * 2010-09-28 2012-04-18 致茂电子(苏州)有限公司 测试程序分散配置的测试方法及其系统
US20130014983A1 (en) * 2011-07-14 2013-01-17 Texas Instruments Incorporated Device contactor with integrated rf shield
CN102497237B (zh) * 2011-12-01 2014-08-13 北京航天测控技术有限公司 一种基于PXIe合成仪器架构的射频和微波综合仪器
US20130330944A1 (en) * 2012-06-07 2013-12-12 Andrew Llc Spring-loaded blind-mate electrical interconnect
CN104181451A (zh) * 2013-05-22 2014-12-03 英业达科技有限公司 测试装置及测试方法
WO2015195970A1 (en) * 2014-06-20 2015-12-23 Xcerra Coproration Test socket assembly and related methods
CN105628981B (zh) * 2014-10-30 2018-09-25 上海电缆研究所有限公司 高频电缆测试平台
US9628202B2 (en) * 2015-02-27 2017-04-18 Rohde & Schwarz Gmbh & Co. Kg Testing front end modules, testing methods and modular testing systems for testing electronic equipment
US9755766B2 (en) * 2015-12-07 2017-09-05 Teradyne, Inc. Front end module for automatic test equipment
US10393772B2 (en) * 2016-02-04 2019-08-27 Advantest Corporation Wave interface assembly for automatic test equipment for semiconductor testing
US10114067B2 (en) * 2016-02-04 2018-10-30 Advantest Corporation Integrated waveguide structure and socket structure for millimeter waveband testing
TWI637181B (zh) * 2017-10-20 2018-10-01 中華精測科技股份有限公司 半導體封裝元件之高頻訊號量測裝置
CN107832534A (zh) * 2017-11-16 2018-03-23 中国航天空气动力技术研究院 针对高频脉动压力测试系统的高频低幅值信号识别方法
TWI640790B (zh) * 2018-02-26 2018-11-11 新加坡商美亞國際電子有限公司 測試用電路板及其操作方法

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US4045735A (en) * 1976-02-17 1977-08-30 E-H Research Laboratories, Inc. Apparatus for testing electronic devices having a high density array of pin leads
GB2195029B (en) 1983-11-25 1988-09-01 Mars Inc Automatic test equipment
JPS60139018A (ja) 1983-12-27 1985-07-23 Fuji Electric Co Ltd スイッチングトランジスタの制御回路
DE3524035A1 (de) 1985-07-05 1987-01-08 Standard Elektrik Lorenz Ag Baugruppe der nachrichtentechnik
US4707834A (en) 1985-09-17 1987-11-17 Tektronix, Inc. Computer-based instrument system
US4731577A (en) 1987-03-05 1988-03-15 Logan John K Coaxial probe card
US5014002A (en) 1989-04-18 1991-05-07 Vlsi Technology, Inc. ATE jumper programmable interface board
FR2662861A1 (fr) 1990-05-30 1991-12-06 Radiall Sa Connecteur pour cable coaxial.
US5477159A (en) * 1992-10-30 1995-12-19 Hewlett-Packard Company Integrated circuit probe fixture with detachable high frequency probe carrier
JP3565893B2 (ja) 1994-02-04 2004-09-15 アジレント・テクノロジーズ・インク プローブ装置及び電気回路素子計測装置
US5558541A (en) * 1994-10-03 1996-09-24 Hewlett-Packard Company Blind mate connector for an electronic circuit tester
US5846097A (en) * 1995-10-04 1998-12-08 Acuson Corporation Submersible connector system
JP3302576B2 (ja) 1996-09-30 2002-07-15 アジレント・テクノロジー株式会社 コネクタ付きプローブカード及びｄｕｔ接続装置
JP3286183B2 (ja) 1996-09-30 2002-05-27 アジレント・テクノロジー株式会社 同軸コネクタフローティングマウント装置
US6028439A (en) 1997-10-31 2000-02-22 Credence Systems Corporation Modular integrated circuit tester with distributed synchronization and control
TW440699B (en) 1998-06-09 2001-06-16 Advantest Corp Test apparatus for electronic parts
JP2000048920A (ja) 1998-07-28 2000-02-18 Yokogawa Electric Corp Ｉｃテスタのポゴピンブロック
JP4279929B2 (ja) 1999-02-12 2009-06-17 株式会社アドバンテスト ケーブルターミナル、同軸ケーブルユニット及びハイフィックス
JP2001281296A (ja) 2000-03-30 2001-10-10 Nec Corp 挟み込み型の半導体ソケットおよびデュアル−トランスミッション−ライン構成の半導体測定装置
US6791317B1 (en) * 2002-12-02 2004-09-14 Cisco Technology, Inc. Load board for testing of RF chips

Also Published As

Publication number Publication date
KR101093397B1 (ko) 2011-12-14
TWI349780B (en) 2011-10-01
EP1692526A1 (de) 2006-08-23
CN1886664A (zh) 2006-12-27
KR20070013259A (ko) 2007-01-30
US20050171718A1 (en) 2005-08-04
CN1875283A (zh) 2006-12-06
ATE374371T1 (de) 2007-10-15
US7627445B2 (en) 2009-12-01
DE602004009214T2 (de) 2008-06-26
MY141227A (en) 2010-03-31
CN100592098C (zh) 2010-02-24
EP1692526B1 (de) 2007-09-26
CN100476442C (zh) 2009-04-08
TW200530606A (en) 2005-09-16

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