TW200508622A - Device interface apparatus - Google Patents

Device interface apparatus

Info

Publication number
TW200508622A
TW200508622A TW093116076A TW93116076A TW200508622A TW 200508622 A TW200508622 A TW 200508622A TW 093116076 A TW093116076 A TW 093116076A TW 93116076 A TW93116076 A TW 93116076A TW 200508622 A TW200508622 A TW 200508622A
Authority
TW
Taiwan
Prior art keywords
socket
tested
substrate
interface apparatus
connector
Prior art date
Application number
TW093116076A
Other languages
Chinese (zh)
Other versions
TWI261674B (en
Inventor
Hiroyuki Hama
Shigeru Matsumura
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200508622A publication Critical patent/TW200508622A/en
Application granted granted Critical
Publication of TWI261674B publication Critical patent/TWI261674B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

A device interface apparatus is provided for providing test signals, which is used for testing a device to be tested, to the device to be tested, and for receiving output signals output from the device to be tested. The device interface apparatus comprises a pin electronics substrate, a substrate connector disposed at an end of the pin electronics substrate, a socket for holding the device to be tested, a socket connector having plurality of socket core wires and socket shield, a cable unit disposed between the socket and the pin electronics substrate for transmitting transmission signals. The cable unit comprises a substrate fitting connector, a socket fitting connector and a plurality of transmission cables.
TW093116076A 2003-06-05 2004-06-04 Device interface apparatus TWI261674B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003161064 2003-06-05

Publications (2)

Publication Number Publication Date
TW200508622A true TW200508622A (en) 2005-03-01
TWI261674B TWI261674B (en) 2006-09-11

Family

ID=33508594

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093116076A TWI261674B (en) 2003-06-05 2004-06-04 Device interface apparatus

Country Status (6)

Country Link
JP (1) JP4002935B2 (en)
KR (1) KR100609518B1 (en)
CN (1) CN100427955C (en)
DE (1) DE112004000029T5 (en)
TW (1) TWI261674B (en)
WO (1) WO2004109308A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7610538B2 (en) * 2007-04-13 2009-10-27 Advantest Corporation Test apparatus and performance board for diagnosis
KR101069850B1 (en) * 2008-12-31 2011-10-04 삼성중공업 주식회사 Testing apparatus for control circuit of robot
DE102013203536B4 (en) * 2013-03-01 2016-03-31 Multitest Elektronische Systeme Gmbh Device for testing electronic components
JP6276536B2 (en) * 2013-08-09 2018-02-07 東洋電子技研株式会社 Test device and contact device constituting it
JP7281273B2 (en) * 2018-12-04 2023-05-25 株式会社アドバンテスト extractor container
JP7410708B2 (en) * 2019-12-24 2024-01-10 株式会社アドバンテスト Electronic component testing equipment, sockets, and replacement parts for electronic component testing equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954853U (en) * 1982-10-05 1984-04-10 東芝エンジニアリング株式会社 measurement cord
JPS6230970A (en) * 1985-08-01 1987-02-09 Toshiba Corp Semiconductor measuring apparatus
JP3534290B2 (en) * 1997-08-07 2004-06-07 矢崎総業株式会社 Shield connector
JPH1183934A (en) * 1997-09-05 1999-03-26 Advantest Corp Semiconductor testing apparatus
TW456074B (en) * 1998-02-17 2001-09-21 Advantest Corp IC socket

Also Published As

Publication number Publication date
CN1697978A (en) 2005-11-16
DE112004000029T5 (en) 2005-07-28
CN100427955C (en) 2008-10-22
KR100609518B1 (en) 2006-08-08
JPWO2004109308A1 (en) 2006-07-20
WO2004109308A1 (en) 2004-12-16
KR20050029119A (en) 2005-03-24
TWI261674B (en) 2006-09-11
JP4002935B2 (en) 2007-11-07

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