DE60229548D1 - I-kanal-oberflächenanbringungsverbinder mit erweiterten flanschen und verbindungsverfahren für leiterplatten - Google Patents

I-kanal-oberflächenanbringungsverbinder mit erweiterten flanschen und verbindungsverfahren für leiterplatten

Info

Publication number
DE60229548D1
DE60229548D1 DE60229548T DE60229548T DE60229548D1 DE 60229548 D1 DE60229548 D1 DE 60229548D1 DE 60229548 T DE60229548 T DE 60229548T DE 60229548 T DE60229548 T DE 60229548T DE 60229548 D1 DE60229548 D1 DE 60229548D1
Authority
DE
Germany
Prior art keywords
channel surface
pcb
flanges
advanced
flange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60229548T
Other languages
English (en)
Inventor
Apurba Roy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Power One Inc
Original Assignee
Power One Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Power One Inc filed Critical Power One Inc
Application granted granted Critical
Publication of DE60229548D1 publication Critical patent/DE60229548D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10856—Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Joining Of Building Structures In Genera (AREA)
DE60229548T 2001-11-16 2002-11-15 I-kanal-oberflächenanbringungsverbinder mit erweiterten flanschen und verbindungsverfahren für leiterplatten Expired - Fee Related DE60229548D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/991,420 US6503088B2 (en) 2000-12-15 2001-11-16 I-channel surface-mount connector with extended flanges
PCT/US2002/037350 WO2004017691A1 (en) 2001-11-16 2002-11-15 I-channel surface-mount connector with extended flanges

Publications (1)

Publication Number Publication Date
DE60229548D1 true DE60229548D1 (de) 2008-12-04

Family

ID=31888671

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60229548T Expired - Fee Related DE60229548D1 (de) 2001-11-16 2002-11-15 I-kanal-oberflächenanbringungsverbinder mit erweiterten flanschen und verbindungsverfahren für leiterplatten

Country Status (7)

Country Link
US (2) US6503088B2 (de)
EP (1) EP1446993B1 (de)
JP (1) JP4700343B2 (de)
AT (1) ATE412334T1 (de)
AU (1) AU2002352841A1 (de)
DE (1) DE60229548D1 (de)
WO (1) WO2004017691A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030125045A1 (en) * 2001-12-27 2003-07-03 Riley Wyatt Thomas Creating and using base station almanac information in a wireless communication system having a position location capability
US6786736B2 (en) * 2002-08-23 2004-09-07 Artesyn Technologies, Inc. Surface mount interconnect and device including same
US20040048498A1 (en) * 2002-09-06 2004-03-11 Hong Huang Metallic surface mount technology power connector
US7065351B2 (en) 2003-01-30 2006-06-20 Qualcomm Incorporated Event-triggered data collection
US7123928B2 (en) * 2003-07-21 2006-10-17 Qualcomm Incorporated Method and apparatus for creating and using a base station almanac for position determination
WO2005106523A1 (en) * 2004-04-02 2005-11-10 Qualcomm Incorporated Methods and apparatuses for beacon assisted position determination systems
US20060046525A1 (en) * 2004-08-27 2006-03-02 Allan Mark Printed circuit board type connector using surface mount and through hole technologies
US8478228B2 (en) * 2008-10-20 2013-07-02 Qualcomm Incorporated Mobile receiver with location services capability
US8600297B2 (en) 2009-07-28 2013-12-03 Qualcomm Incorporated Method and system for femto cell self-timing and self-locating
US20140185214A1 (en) * 2012-12-31 2014-07-03 Zhen Jia Stacked power module for graphics processing unit
DE102017218541A1 (de) * 2017-10-17 2019-04-18 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Bamberg Verfahren zur Herstellung einer elektrischen Baugruppe
US10862232B2 (en) * 2018-08-02 2020-12-08 Dell Products L.P. Circuit board pad connector system

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4470655A (en) * 1979-11-01 1984-09-11 Minnesota Mining And Manufacturing Company Transition connector
US4845542A (en) * 1987-03-19 1989-07-04 Unisys Corporation Interconnect for layered integrated circuit assembly
KR920022482A (ko) * 1991-05-09 1992-12-19 가나이 쯔도무 전자부품 탑재모듈
US5154536A (en) * 1991-05-31 1992-10-13 Jeffrey Ciudaj Adjustable screed rail
JPH07502141A (ja) * 1991-09-30 1995-03-02 ゼネラル・ダイナミックス・インフォメーション・システムズ・インコーポレーテッド めっきしたしなやかなリード線
US5324892A (en) * 1992-08-07 1994-06-28 International Business Machines Corporation Method of fabricating an electronic interconnection
US5588848A (en) * 1994-09-08 1996-12-31 Lucent Technologies Inc. Low inductance surface-mount connectors for interconnecting circuit devices and method for using same
US5484964A (en) * 1995-02-06 1996-01-16 Dawson, Deceased; Peter F. Surface mounting pin grid arrays
GB9513540D0 (en) * 1995-07-04 1995-09-06 Elco Europ Ltd Electrical connectors
US6224396B1 (en) * 1997-07-23 2001-05-01 International Business Machines Corporation Compliant, surface-mountable interposer
JPH11186688A (ja) * 1997-10-14 1999-07-09 Murata Mfg Co Ltd ハイブリッドｉｃおよびそれを用いた電子装置
JP4025885B2 (ja) * 1998-02-06 2007-12-26 協伸工業株式会社 コネクタチップ及びテーピングコネクタチップ
US6319829B1 (en) * 1999-08-18 2001-11-20 International Business Machines Corporation Enhanced interconnection to ceramic substrates
US6303861B1 (en) * 1999-10-21 2001-10-16 Fci Usa, Inc. Connector for connecting a conductor to a structural member
US6429388B1 (en) * 2000-05-03 2002-08-06 International Business Machines Corporation High density column grid array connections and method thereof

Also Published As

Publication number Publication date
EP1446993B1 (de) 2008-10-22
JP2005529476A (ja) 2005-09-29
US20020076952A1 (en) 2002-06-20
ATE412334T1 (de) 2008-11-15
AU2002352841A1 (en) 2004-03-03
US20030047344A1 (en) 2003-03-13
EP1446993A4 (de) 2007-05-30
US6649831B2 (en) 2003-11-18
WO2004017691A1 (en) 2004-02-26
JP4700343B2 (ja) 2011-06-15
US6503088B2 (en) 2003-01-07
EP1446993A1 (de) 2004-08-18

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee