DE602004007525D1 - Ic mit eingebauter karakteristikbestimmung - Google Patents

Ic mit eingebauter karakteristikbestimmung

Info

Publication number
DE602004007525D1
DE602004007525D1 DE602004007525T DE602004007525T DE602004007525D1 DE 602004007525 D1 DE602004007525 D1 DE 602004007525D1 DE 602004007525 T DE602004007525 T DE 602004007525T DE 602004007525 T DE602004007525 T DE 602004007525T DE 602004007525 D1 DE602004007525 D1 DE 602004007525D1
Authority
DE
Germany
Prior art keywords
integrated characteristic
characterization
characteristic provision
provision
built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004007525T
Other languages
English (en)
Other versions
DE602004007525T2 (de
Inventor
Kaam Kees M Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE602004007525D1 publication Critical patent/DE602004007525D1/de
Application granted granted Critical
Publication of DE602004007525T2 publication Critical patent/DE602004007525T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3187—Built-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31915—In-circuit Testers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
DE602004007525T 2003-07-09 2004-07-01 Ic mit eingebauter charakteristikbestimmung Active DE602004007525T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP03102062 2003-07-09
EP03102062 2003-07-09
PCT/IB2004/051089 WO2005006005A1 (en) 2003-07-09 2004-07-01 Ic with on-board characterization unit

Publications (2)

Publication Number Publication Date
DE602004007525D1 true DE602004007525D1 (de) 2007-08-23
DE602004007525T2 DE602004007525T2 (de) 2008-03-13

Family

ID=34042919

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004007525T Active DE602004007525T2 (de) 2003-07-09 2004-07-01 Ic mit eingebauter charakteristikbestimmung

Country Status (9)

Country Link
US (1) US7475312B2 (de)
EP (1) EP1646883B8 (de)
JP (1) JP2007527110A (de)
KR (1) KR20060028810A (de)
CN (1) CN100592097C (de)
AT (1) ATE366941T1 (de)
DE (1) DE602004007525T2 (de)
TW (1) TW200508632A (de)
WO (1) WO2005006005A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8484524B2 (en) * 2007-08-21 2013-07-09 Qualcomm Incorporated Integrated circuit with self-test feature for validating functionality of external interfaces
US10768230B2 (en) * 2016-05-27 2020-09-08 International Business Machines Corporation Built-in device testing of integrated circuits
US10685730B1 (en) * 2018-03-20 2020-06-16 Seagate Technology Llc Circuit including efficient clocking for testing memory interface
EP3861361B1 (de) 2018-10-01 2022-11-30 Volkswagen Aktiengesellschaft Verfahren und vorrichtung zum überwachen der zuverlässigkeit eines elektronischen systems

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7137048B2 (en) * 2001-02-02 2006-11-14 Rambus Inc. Method and apparatus for evaluating and optimizing a signaling system
JPH04212524A (ja) * 1990-12-06 1992-08-04 Matsushita Electric Ind Co Ltd 半導体集積回路
US6466520B1 (en) * 1996-09-17 2002-10-15 Xilinx, Inc. Built-in AC self test using pulse generators
US5982189A (en) * 1997-05-14 1999-11-09 International Business Machines Corporation Built-in dynamic stress for integrated circuits
US6427217B1 (en) * 1999-04-15 2002-07-30 Agilent Technologies, Inc. System and method for scan assisted self-test of integrated circuits
US6496947B1 (en) * 1999-10-25 2002-12-17 Lsi Logic Corporation Built-in self repair circuit with pause for data retention coverage
JP4048691B2 (ja) * 2000-04-27 2008-02-20 横河電機株式会社 Ｉｃ試験装置及びｉｃ試験方法
US6556938B1 (en) * 2000-08-29 2003-04-29 Agilent Technologies, Inc. Systems and methods for facilitating automated test equipment functionality within integrated circuits
JP4115676B2 (ja) * 2001-03-16 2008-07-09 株式会社東芝 半導体記憶装置
JP2003060049A (ja) * 2001-08-09 2003-02-28 Hitachi Ltd 半導体集積回路装置
US6889332B2 (en) * 2001-12-11 2005-05-03 Advanced Micro Devices, Inc. Variable maximum die temperature based on performance state
US6948080B2 (en) * 2002-01-09 2005-09-20 Raytheon Company System and method for minimizing upsets in digital microcircuits via ambient radiation monitoring
US7036062B2 (en) * 2002-10-02 2006-04-25 Teseda Corporation Single board DFT integrated circuit tester
US7017094B2 (en) * 2002-11-26 2006-03-21 International Business Machines Corporation Performance built-in self test system for a device and a method of use
JP2004260090A (ja) * 2003-02-27 2004-09-16 Renesas Technology Corp 半導体集積回路装置

Also Published As

Publication number Publication date
JP2007527110A (ja) 2007-09-20
EP1646883B1 (de) 2007-07-11
US20060155500A1 (en) 2006-07-13
CN1820205A (zh) 2006-08-16
KR20060028810A (ko) 2006-04-03
ATE366941T1 (de) 2007-08-15
CN100592097C (zh) 2010-02-24
WO2005006005A1 (en) 2005-01-20
TW200508632A (en) 2005-03-01
EP1646883A1 (de) 2006-04-19
US7475312B2 (en) 2009-01-06
DE602004007525T2 (de) 2008-03-13
EP1646883B8 (de) 2007-09-05

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: NXP B.V., EINDHOVEN, NL

8364 No opposition during term of opposition